Skip to main content
Erschienen in: Microsystem Technologies 12/2017

02.03.2017 | Technical Paper

Experimental study of micro patterns on conductive ink transfer in a plate-to-roll system

verfasst von: Sihun Jeong, Cheonghwan Lee, Jaesool Shim, Chulho Bai

Erschienen in: Microsystem Technologies | Ausgabe 12/2017

Einloggen

Aktivieren Sie unsere intelligente Suche, um passende Fachinhalte oder Patente zu finden.

search-config
loading …

Abstract

Recently, printed electronics technology can be used in conductive printed patterns and flexible displays. The transfer ratio in this process is influenced by the conditions of the printing surface, the properties of the conductive ink material, and the printing speed, which are important factors that affect the printing quality. This study examines the transfer characteristics of conductive ink transferred from various micro-patterns onto flexible film substrates using a roll-to-plate process. Various patterns with different aspect ratios were printed at different printing speeds to determine the ink transfer characteristics and printability. The optimum printing speed for characterizing the printing quality is related to the shape of the patterns, and it is more affected by the depth than the width of the pattern according to experiments. The transfer ratio increases with the force aspect ratio.

Sie haben noch keine Lizenz? Dann Informieren Sie sich jetzt über unsere Produkte:

Springer Professional "Wirtschaft+Technik"

Online-Abonnement

Mit Springer Professional "Wirtschaft+Technik" erhalten Sie Zugriff auf:

  • über 102.000 Bücher
  • über 537 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Finance + Banking
  • Management + Führung
  • Marketing + Vertrieb
  • Maschinenbau + Werkstoffe
  • Versicherung + Risiko

Jetzt Wissensvorsprung sichern!

Springer Professional "Technik"

Online-Abonnement

Mit Springer Professional "Technik" erhalten Sie Zugriff auf:

  • über 67.000 Bücher
  • über 390 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Maschinenbau + Werkstoffe




 

Jetzt Wissensvorsprung sichern!

Literatur
Zurück zum Zitat Ahmed DH, Sung HJ, Kim DS (2011) Simulation of non-Newtonian ink transfer between two separating plates for gravure-offset printing. Int J Heat Fluid Flow 32:298–307CrossRef Ahmed DH, Sung HJ, Kim DS (2011) Simulation of non-Newtonian ink transfer between two separating plates for gravure-offset printing. Int J Heat Fluid Flow 32:298–307CrossRef
Zurück zum Zitat Ahn BJ, Han KJ, Ko SL (2010) Influence of micro pattern geometry and printing and curing conditions in gravure printing on printing performance when using conductive ink. Trans Korean Soc Mech Eng A 34(3):263–271CrossRef Ahn BJ, Han KJ, Ko SL (2010) Influence of micro pattern geometry and printing and curing conditions in gravure printing on printing performance when using conductive ink. Trans Korean Soc Mech Eng A 34(3):263–271CrossRef
Zurück zum Zitat Dearden AL, Smith PJ, Shin DY, Reis N, Derby B, O’Brien P (2005) A low curing temperature silver ink for use in ink-jet printing and subsequent production of conductive tracks. Macromol Rapid Commun 26(4):315–318CrossRef Dearden AL, Smith PJ, Shin DY, Reis N, Derby B, O’Brien P (2005) A low curing temperature silver ink for use in ink-jet printing and subsequent production of conductive tracks. Macromol Rapid Commun 26(4):315–318CrossRef
Zurück zum Zitat Elsayad S, Morsy F, El-Sherbiny S, Abdou E (2002) Some factors affecting ink transfer in gravure printing. Pigm Resin Technol 31(4):234–240CrossRef Elsayad S, Morsy F, El-Sherbiny S, Abdou E (2002) Some factors affecting ink transfer in gravure printing. Pigm Resin Technol 31(4):234–240CrossRef
Zurück zum Zitat Hagberg J, Pudas M, Leppävuori S, Elsey K, Logan A (2001) Gravure offset printing development for fine line thick film circuits. Microelectron Int Int J 18:32–35CrossRef Hagberg J, Pudas M, Leppävuori S, Elsey K, Logan A (2001) Gravure offset printing development for fine line thick film circuits. Microelectron Int Int J 18:32–35CrossRef
Zurück zum Zitat Hahne P, Hirth E, Reis IE, Schwichtenberg K, Richtering W, Horn FM, Eggenweiler U (2001) Progress in thick-film pad printing technique for solar cells. Sol Energy Mater Sol Cells 65:399–407CrossRef Hahne P, Hirth E, Reis IE, Schwichtenberg K, Richtering W, Horn FM, Eggenweiler U (2001) Progress in thick-film pad printing technique for solar cells. Sol Energy Mater Sol Cells 65:399–407CrossRef
Zurück zum Zitat Kim CH, Lee TM, Kim DS, Choi BO (2007) Distortion of printed patterns in printed electronics. J Korean Soc Precis Eng 24(8):74–80 Kim CH, Lee TM, Kim DS, Choi BO (2007) Distortion of printed patterns in printed electronics. J Korean Soc Precis Eng 24(8):74–80
Zurück zum Zitat Kim Y, Park S, Shin K, Bai C, Shim J (2016) Effect of cycloid movement on plate-to-roll gravure offset printing. Microsyst Technol 22(2):357–365CrossRef Kim Y, Park S, Shin K, Bai C, Shim J (2016) Effect of cycloid movement on plate-to-roll gravure offset printing. Microsyst Technol 22(2):357–365CrossRef
Zurück zum Zitat Lee S, Na Y (2010) Analysis on the ink transfer mechanism in R2R application. J Mech Sci Technol 24:293–296CrossRef Lee S, Na Y (2010) Analysis on the ink transfer mechanism in R2R application. J Mech Sci Technol 24:293–296CrossRef
Zurück zum Zitat Mikami Y, Nagae Y, Mori Y, Kuwabara K, Saito T, Hayama H et al (1994) A new patterning process concept for large area transistor circuit fabrication without using an optical mask aligner. IEEE Trans Electron Device 41(3):306–314CrossRef Mikami Y, Nagae Y, Mori Y, Kuwabara K, Saito T, Hayama H et al (1994) A new patterning process concept for large area transistor circuit fabrication without using an optical mask aligner. IEEE Trans Electron Device 41(3):306–314CrossRef
Zurück zum Zitat Otero TF, Cantero I (1999) Conducting polymers as positive electrodes in rechargeable lithium-ion batteries. J Power Sources 81:838–841CrossRef Otero TF, Cantero I (1999) Conducting polymers as positive electrodes in rechargeable lithium-ion batteries. J Power Sources 81:838–841CrossRef
Zurück zum Zitat Oyama M (2010) Recent nanoarchitectures in metal nanoparticle-modified electrodes for electroanalysis. Anal Sci 26(1):1–12CrossRef Oyama M (2010) Recent nanoarchitectures in metal nanoparticle-modified electrodes for electroanalysis. Anal Sci 26(1):1–12CrossRef
Zurück zum Zitat Park SS, Jeon Y, Cho M, Bai C, Lee DY, Shim J (2012) The FEM based liquid transfer model in gravure offset printing using phase field method. Microsyst Technol 18:2027–2034CrossRef Park SS, Jeon Y, Cho M, Bai C, Lee DY, Shim J (2012) The FEM based liquid transfer model in gravure offset printing using phase field method. Microsyst Technol 18:2027–2034CrossRef
Zurück zum Zitat Pudas M, Hagberg J, Leppävuori S (2002) The absorption ink transfer mechanism of gravure offset printing for electronic circuitry. IEEE Trans Electron Packag Manuf 25:335–343CrossRef Pudas M, Hagberg J, Leppävuori S (2002) The absorption ink transfer mechanism of gravure offset printing for electronic circuitry. IEEE Trans Electron Packag Manuf 25:335–343CrossRef
Zurück zum Zitat Pudas M, Hagberg J, Leppävuori S, Elsey K, Logan A (2004a) Methods for the evaluation of fine-line offset gravure printing inks for ceramics. Color Technol 120:119–126CrossRef Pudas M, Hagberg J, Leppävuori S, Elsey K, Logan A (2004a) Methods for the evaluation of fine-line offset gravure printing inks for ceramics. Color Technol 120:119–126CrossRef
Zurück zum Zitat Pudas M, Hagberg J, Leppävuori S (2004b) Printing parameters and ink components affecting ultra-fine-line gravure-offset printing for electronics applications. J Eur Ceram Soc 24:2943–2950CrossRef Pudas M, Hagberg J, Leppävuori S (2004b) Printing parameters and ink components affecting ultra-fine-line gravure-offset printing for electronics applications. J Eur Ceram Soc 24:2943–2950CrossRef
Zurück zum Zitat Sankaran AK, Rothstein JP (2012) Effect of viscoelasticity on liquid transfer during gravure printing. J Nonnewton Fluid Mech 175–176:64–75CrossRef Sankaran AK, Rothstein JP (2012) Effect of viscoelasticity on liquid transfer during gravure printing. J Nonnewton Fluid Mech 175–176:64–75CrossRef
Zurück zum Zitat Xing Y, Rosner DE (1999) Prediction of spherule size in gas phase nanoparticle synthesis. J Nanopart Res 1(2):277–291CrossRef Xing Y, Rosner DE (1999) Prediction of spherule size in gas phase nanoparticle synthesis. J Nanopart Res 1(2):277–291CrossRef
Zurück zum Zitat Yin X, Kumar S (2005) Lubrication flow between a cavity and a flexible wall. Phys Fluids (1994–Present) 17(6):063101CrossRefMATH Yin X, Kumar S (2005) Lubrication flow between a cavity and a flexible wall. Phys Fluids (1994–Present) 17(6):063101CrossRefMATH
Zurück zum Zitat Yin X, Kumar S (2006) Flow visualization of the liquid emptying process in scaled-up gravure grooves and cells. Chem Eng Sci 61(4):1146–1156CrossRef Yin X, Kumar S (2006) Flow visualization of the liquid emptying process in scaled-up gravure grooves and cells. Chem Eng Sci 61(4):1146–1156CrossRef
Zurück zum Zitat Yin W, Lee DH, Choi J, Park C, Cho SM (2008) Screen printing of silver nanoparticle suspension for metal interconnects. Korean J Chem Eng 25(6):1358–1361CrossRef Yin W, Lee DH, Choi J, Park C, Cho SM (2008) Screen printing of silver nanoparticle suspension for metal interconnects. Korean J Chem Eng 25(6):1358–1361CrossRef
Metadaten
Titel
Experimental study of micro patterns on conductive ink transfer in a plate-to-roll system
verfasst von
Sihun Jeong
Cheonghwan Lee
Jaesool Shim
Chulho Bai
Publikationsdatum
02.03.2017
Verlag
Springer Berlin Heidelberg
Erschienen in
Microsystem Technologies / Ausgabe 12/2017
Print ISSN: 0946-7076
Elektronische ISSN: 1432-1858
DOI
https://doi.org/10.1007/s00542-017-3341-9

Weitere Artikel der Ausgabe 12/2017

Microsystem Technologies 12/2017 Zur Ausgabe

Neuer Inhalt