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Journal of Polymer Research
Erschienen in: Journal of Polymer Research 2/2021

01.02.2021 | ORIGINAL PAPER

Fabrication of highly thermal conductive PA6/hBN composites via in-situ polymerization process

verfasst von: He-xin Zhang, Do Hyun Seo, Dong-Eun Lee, Keun-Byoung Yoon

Erschienen in: Journal of Polymer Research | Ausgabe 2/2021

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Abstract

In this research, thermally conductive polyamide 6/hexagonal boron nitride (PA6/hBN) nanocomposites waaere fabricated via an in-situ ring-opening polymerization of ε-caprolactam. The hBN filler was exfoliated through a co-solvent exfoliation process and then chemically modified to form an ε-caprolactam-grafted BN (cBN). After that, PA6 was introduced onto the cBN surface using a grafting from method. The thermal conductivities of the PA6/cBN composites significantly increased up to 180 % when the BN content was 16.5 wt%. The tensile strength and Young’s modulus of the PA6/cBN composites with 16.5 wt% hBN increased by 30 % and 92 %, respectively, compared to the pristine PA6. The grafted PA6 on BN composites exhibited strong polymer-filler interfacial interactions. Overall, this study provides a facile method of fabricating high-performance PA6 with improved thermal and mechanical properties and higher thermal conductivity.
Vorheriger Artikel Improvement of mechanical properties for epoxy composites with modified titanate whiskers via dopamine self-oxidation
Nächster Artikel Facile fabrication of non-spherical thiol-functionalized organosilica particles and their adsorption of Ag(I)

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Metadaten
Titel
Fabrication of highly thermal conductive PA6/hBN composites via in-situ polymerization process
verfasst von
He-xin Zhang
Do Hyun Seo
Dong-Eun Lee
Keun-Byoung Yoon
Publikationsdatum
01.02.2021
Verlag
Springer Netherlands
Erschienen in
Journal of Polymer Research / Ausgabe 2/2021
Print ISSN: 1022-9760
Elektronische ISSN: 1572-8935
DOI
https://doi.org/10.1007/s10965-020-02378-w

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