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Erschienen in: Microsystem Technologies 10-11/2011

01.10.2011 | Technical Paper

Fabrication of metallic micromirror using electroplating technology

verfasst von: Jia-dong Li, Ping Zhang, Yi-hui Wu, Yong-shun Liu, Ming Xuan

Erschienen in: Microsystem Technologies | Ausgabe 10-11/2011

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Abstract

A nickel micromirror array was designed and successfully fabricated using a thick photoresist as a sacrificial layer and as a mold for nickel electroplating. It was composed of two address electrodes, two support posts and a nickel mirror plate. The mirror plate, which is supported by two nickel posts, is overhung about 10 μm from the silicon substrate. The nickel mirror plate is actuated by an electrostatic force generated by electrostatic potential difference applied between the mirror plate and the address electrode. Optimized fabrication processes have been developed to reduce residual stress in mirror plate and prevent contact between the mirror plate and the substrate, which ensure a reasonable flat and smooth micromirror for operation at low actuation voltage.

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Metadaten
Titel
Fabrication of metallic micromirror using electroplating technology
verfasst von
Jia-dong Li
Ping Zhang
Yi-hui Wu
Yong-shun Liu
Ming Xuan
Publikationsdatum
01.10.2011
Verlag
Springer-Verlag
Erschienen in
Microsystem Technologies / Ausgabe 10-11/2011
Print ISSN: 0946-7076
Elektronische ISSN: 1432-1858
DOI
https://doi.org/10.1007/s00542-011-1353-4

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