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Erschienen in:
2013 | OriginalPaper | Buchkapitel
Fatigue Life and Reliability Analysis of Electronic Packages Under Thermal Cycling and Moisture Conditions
verfasst von : Yao Hsu, Wen-Fang Wu, Chih-Min Hsu
Erschienen in: Proceedings of the Institute of Industrial Engineers Asian Conference 2013
Verlag: Springer Singapore
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Abstract
Many previous researches on electronic packages focused on assessment of package lives under a single state of stress such as vibration, thermal cycling, drop impact, temperature and humidity. The present study considers both effects of thermal cycling and moisture on the fatigue life of electronic packages. The influence of moisture on thermal fatigue life of a package is investigated in particular. A Monte Carlo simulation algorithm is employed to make the result of finite element simulation close to reality. Samples of variables consisting of different package sizes and material parameters from their populations are generated and incorporated into the finite element analysis. The result of a numerical example indicates the thermal-fatigue failure mechanism of the electronic packages is not affected very much by the moisture. However, the mean time to failure of the package does decrease from 1,540 cycles to 1,200 cycles when moisture is taken into consideration.