Ausgabe 1/2015
Inhalt (11 Artikel)
Eddy current measurement of the thickness of top Cu film of the multilayer interconnects in the integrated circuit (IC) manufacturing process
Zilian Qu, Yonggang Meng, Qian Zhao
A comprehensive analysis of a 3-P (Pa) S spatial parallel manipulator
Yuzhe Liu, Liping Wang, Jun Wu, Jinsong Wang
Preload characteristics identification of the piezoelectric-actuated 1-DOF compliant nanopositioning platform
Ruizhou Wang, Xianmin Zhang
A rate-dependent Prandtl-Ishlinskii model for piezoelectric actuators using the dynamic envelope function based play operator
Meiju Yang, Chunxia Li, Guoying Gu, Limin Zhu
Modeling and analysis of steady-state vibration induced by backlash in servo rotary table
Xiao Yang, Dun Lu, Sanli Liu, Jun Zhang, Wanhua Zhao
Dynamics of structural systems with various frequency-dependent damping models
Li Li, Yujin Hu, Weiming Deng, Lei Lü, Zhe Ding
Dynamic modeling of hydrostatic guideway considering compressibility and inertia effect
Yikang Du, Kuanmin Mao, Yaming Zhu, Fengyun Wang, Xiaobo Mao, Bin Li
A Stoneley wave method to detect interlaminar damage of metal layer composite pipe
Bing Li, Lei Qiang, Tong Lu, Xu Geng, Minghang Li
An adaptive sliding mode control technology for weld seam tracking
Jie Liu, Youmin Hu, Bo Wu, Kaibo Zhou, Mingfeng Ge
Enhancing fatigue life of cylinder-crown integrated structure by optimizing dimension
Weiwei Zhang, Xiaosong Wang, Zhongren Wang, Shijian Yuan