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Erschienen in:
2010 | OriginalPaper | Buchkapitel
1. Fundamentals of Packaging at Microwave and Millimeter-Wave Frequencies
verfasst von : Rick Sturdivant
Erschienen in: RF and Microwave Microelectronics Packaging
Verlag: Springer US
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Abstract
The thirst for higher data rates and greater bandwidth has resulted in increased interest in millimeter-wave systems as a means for local and wider area information transport. At the same time there is a real need for lower cost and more compact systems. These requirements have led to the development of a highly integrated millimeter-wave System In Package (SIP), which operates beyond 40 GHz. This solution uses low cost ceramic packaging as well as optimized interconnects and transitions to allow for wide-band electrical performance. This paper will present details on the functionality, electrical performance and packaging used to realize this solution.