Skip to main content
main-content

Tipp

Weitere Artikel dieser Ausgabe durch Wischen aufrufen

21.11.2018 | Ausgabe 2/2019 Open Access

Journal of Materials Science: Materials in Electronics 2/2019

Heterophase materials for fused filament fabrication of structural electronics

Zeitschrift:
Journal of Materials Science: Materials in Electronics > Ausgabe 2/2019
Autoren:
B. Podsiadły, A. Skalski, B. Wałpuski, M. Słoma
Wichtige Hinweise

Electronic supplementary material

The online version of this article (https://​doi.​org/​10.​1007/​s10854-018-0391-4) contains supplementary material, which is available to authorized users.

Abstract

In this work, new electrically conductive composite filaments are developed for the fabrication of conductive paths, 3D printed with FDM technology. These composite materials consist of electrically conductive copper powder and a polymer matrix. The influence of three different polymers (ABS, PLA, PS) on the electrical properties of the composites was examined. Electrical measurements of the composite filaments with the increasing copper powder concentrations, allow identifying the percolation threshold for elaborated composites. Results show that the lowest resistivity (0.156 × 10−5 Ωm) was achieved for the ABS/Cu composite at the 84.6 wt% Cu concentration. The obtained resistivity values are much lower than for other conductive composites and nanocomposites filaments reported in the literature. Voltage-current characteristics determined for each composite material showed that composites have Ohmic characteristics in low voltage regime. At high voltage regime, the electrical power dissipated in the composites caused a rapid increase in temperature. It was discovered that a polymer matrix influences the maximum value of the electrical power that can be dissipated in the filament before losing electrical conductivity. Examples of conductive 3D printed structures made from elaborated composites are also presented.

Unsere Produktempfehlungen

Premium-Abo der Gesellschaft für Informatik

Sie erhalten uneingeschränkten Vollzugriff auf alle acht Fachgebiete von Springer Professional und damit auf über 45.000 Fachbücher und ca. 300 Fachzeitschriften.

Basis-Abo der Gesellschaft für Informatik

Sie erhalten uneingeschränkten Vollzugriff auf die Inhalte der Fachgebiete Business IT + Informatik und Management + Führung und damit auf über 30.000 Fachbücher und ca. 130 Fachzeitschriften.

Zusatzmaterial
Literatur
Über diesen Artikel

Weitere Artikel der Ausgabe 2/2019

Journal of Materials Science: Materials in Electronics 2/2019 Zur Ausgabe