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Erschienen in: Journal of Materials Science: Materials in Electronics 16/2020

04.07.2020

Hierarchical NiOCeO nanosheets self-assembly flower-like architecture: heterojunction engineering assisting for high-performance humidity sensor

verfasst von: Ying Liu, Yanqiong Li, Pan Wang, Yongli Jin, Xiaolong Huang, Guodong Wei, Wen Zeng

Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 16/2020

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Abstract

Due to its high performance, good sensitivity, fast response and recovery time, p-n heterojunction layer-like nanostructure consisting of two kinds of semiconducting metal oxide materials can be regarded as one of the most promising sensor materials for humidity detection at room temperature. In this study, NiO–CeO p-n heterojunction-based 2D nanosheet self-assembled architectures have been developed for constructing high-performance humidity sensors. Morphology and structure characterizations reveal that the novel heterostructures are composed of 3D flower-like porous microspheres self-assembled by 2D layered nanosheets with high surface area and abundant active sites, in which the amorphous n-type CeO nanocrystalline with only several nanometers homogeneously distributes into the p-type NiO nanosheet matrix. The sensors presented excellent humidity sensing performance with high sensitivity and a pseudo-linear response to water gas in the relative wide humidity (RH) range of 11–95% at room temperature with excellent stability, reproducibility and fast response speed. These improved properties can be greatly attributed to the unique 3D flower-like architectures with a large specific surface area and the NiO–CeO heterojunction interface and synergistic effect. Such a high performances of NiO–CeO p-n heterojunction humidity sensor can have great potential applications in highly sensitive humidity sensors.

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Metadaten
Titel
Hierarchical NiO–CeO nanosheets self-assembly flower-like architecture: heterojunction engineering assisting for high-performance humidity sensor
verfasst von
Ying Liu
Yanqiong Li
Pan Wang
Yongli Jin
Xiaolong Huang
Guodong Wei
Wen Zeng
Publikationsdatum
04.07.2020
Verlag
Springer US
Erschienen in
Journal of Materials Science: Materials in Electronics / Ausgabe 16/2020
Print ISSN: 0957-4522
Elektronische ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-020-03874-x

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