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Journal of Materials Science: Materials in Electronics
Erschienen in: Journal of Materials Science: Materials in Electronics 23/2019

05.11.2019

Humic acid assisted chemical synthesis of silver nanoparticles for inkjet printing of flexible circuits

verfasst von: Yueyue Hao, Zesheng Xu, Jian Gao, Kaiyun Wu, Jingyu Liu, Jing Luo

Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 23/2019

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Abstract

In this paper, humic acid (HA) was used as stabilizer to prepare silver nanoparticles (Ag NPs) by chemically reducing silver salts in water phase, which were employed to produce Ag NPs inks for inkjet printing conductive silver patterns. The obtained silver nanoparticles stabilized with HA (HA-Ag NPs) were all in spherical shape and the particle size was about 7–12 nm. By re-dispersing HA-Ag NPs in ultrapure water, conductive ink with excellent storage stability was prepared, which can be placed at room temperature for 30 days without any precipitation. The as-prepared HA-Ag NPs conductive ink was printed onto photopapers to fabricate conductive silver patterns with a domestic inkjet printer. The resistivity of the printed pattern could reach 135 μΩ cm after printed for 40 layers and sintered at 180 °C for 60 min. In addition, the printed conductive silver patterns could be integrated into a LED device or alarm apparatus, indicating it could be widely used in flexible printing electronics.
Vorheriger Artikel Study on the structure and luminescence quenching of Pr doped Na0.5Bi4.5Ti4O15 multifunctional ceramics
Nächster Artikel Performance and mechanism of estrone (E1) and 17β-estradiol (17β-E2) removal from aqueous solution using hexadecyltrimethylammonium (HDTMA) modified zeolites

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Metadaten
Titel
Humic acid assisted chemical synthesis of silver nanoparticles for inkjet printing of flexible circuits
verfasst von
Yueyue Hao
Zesheng Xu
Jian Gao
Kaiyun Wu
Jingyu Liu
Jing Luo
Publikationsdatum
05.11.2019
Verlag
Springer US
Erschienen in
Journal of Materials Science: Materials in Electronics / Ausgabe 23/2019
Print ISSN: 0957-4522
Elektronische ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-019-02372-z

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