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Journal of Materials Science: Materials in Electronics
Erschienen in: Journal of Materials Science: Materials in Electronics 8/2019

09.03.2019

Improved mechanical properties induced by In and In & Zn double additions to eutectic Sn58Bi alloy

verfasst von: Shiqi Zhou, Yu-An Shen, Tiffani Uresti, Vasanth C. Shunmugasamy, Bilal Mansoor, Hiroshi Nishikawa

Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 8/2019

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Abstract

The effects of 0.5 wt% In as well as 0.5 wt% In and 1 wt% Zn double (In & Zn) additions to eutectic Sn58Bi alloy on the microstructure and mechanical properties were investigated. Newly designed In & Zn-added Sn58Bi alloy showed much finer microstructure than eutectic Sn58Bi and In-added Sn58Bi alloys. The elongation improvements of 36% and 41% before and after 1008 h aging were obtained in In & Zn-added Sn58Bi alloy compared to eutectic Sn58Bi alloy. Nanoindentation tests revealed that In had solid solution softening (SSS) effect on Sn phase. A hardness decrease and a large creep displacement obtained in both In- and In & Zn-added Sn58Bi served as evident of the SSS. The effects of Zn and In were combined responsible for the elongation improvement of In & Zn-added Sn58Bi.
Vorheriger Artikel Effect of Zn incorporation on the electrochemical corrosion properties of SAC105 solder alloys
Nächster Artikel Development of asymmetric device using Co3(PO4)2 as a positive electrode for energy storage application

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Literatur
1.
M. Abtew, G. Selvaduray, Lead-free solders in microelectronics. Mater. Sci. Eng. R 27, 95–141 (2000)CrossRef
2.
K.M. Kumar, V. Kripesh, L. Shen, A.A.O. Tay, Study on the microstructure and mechanical properties of a novel SWCNT-reinforced solder alloy for ultra-fine pitch applications. Thin Solid Films 504, 371–378 (2006)CrossRef
3.
O. Mokhtari, H. Nishikawa, Correlation between microstructure and mechanical properties of Sn-Bi-X solders. Mater. Sci. Eng. A 651, 831–839 (2016)CrossRef
4.
E.E.M. Noor, N.M. Sharif, C.K. Yew, T. Ariga, A.B. Ismail, Z. Hussain, Wettability and strength of In-Bi-Sn lead-free solder alloy on copper substrate. J. Alloys Compd. 507, 290–296 (2010)CrossRef
5.
6.
L. Yang, W. Zhou, Y. Ma, X. Li, Y. Liang, W. Cui, P. Wu, Effects of Ni addition on mechanical properties of Sn58Bi solder alloy during solid-state aging. Mater. Sci. Eng. A 667, 368–375 (2016)CrossRef
7.
X. Chen, F. Xue, J. Zhou, Y. Yao, Effect of in on microstructure, thermodynamic characteristic and mechanical properties of Sn-Bi based lead-free solder. J. Alloys Compd. 633, 377–383 (2015)CrossRef
8.
L. Shen, P. Septiwerdani, Z. Chen, Elastic modulus, hardness and creep performance of SnBi alloys using nanoindentation. Mater. Sci. Eng. A 558, 253–258 (2012)CrossRef
9.
X. Li, Y. Ma, W. Zhou, P. Wu, Effects of nanoscale Cu6Sn5 particles addition on microstructure and properties of SnBi solder alloys. Mater. Sci. Eng. A 684, 328–334 (2017)CrossRef
10.
W. Dong, Y. Shi, Z. Xia, Y. Lei, F. Guo, Effects of trace amounts of rare earth additions on microstructure and properties of Sn-Bi-Based solder alloy. J. Electron. Mater. 37, 982–991 (2008)CrossRef
11.
J. Shen, Y. Pu, H. Yin, D. Luo, J. Chen, Effects of minor Cu and Zn additions on the thermal, microstructure and tensile properties of Sn-Bi-based solder alloys. J. Alloys Compd. 614, 63–70 (2014)CrossRef
12.
M. Mccormack, H.S. Chen, G.W. Kammlott, S. Jin, Significantly improved mechanical properties of Bi-Sn solder alloys by Ag-doping. J. Electron. Mater. 26, 954–958 (1997)CrossRef
13.
S. Zhou, O. Mokhtari, M.G. Rafique, V.C. Shunmugasamy, B. Mansoor, H. Nishikawa, Improvement in the mechanical properties of eutectic Sn58Bi alloy by 0.5 and 1 wt.% Zn addition before and after thermal aging. J. Alloys Compd. 765, 1243–1252 (2018)
14.
J.F. Li, S.H. Mannan, M.P. Clode, D.C. Whalley, D.A. Hutt, Interfacial reactions between molten Sn-Bi-X solders and Cu substrates for liquid solder interconnects. Acta Mater. 54, 2907–2922 (2006)CrossRef
15.
H.R. Kotadia, O. Mokhtari, M. Bottrill, M.P. Clode, M.A. Green, S.H. Mannan, Reactions of Sn-3.5Ag-based solders containing Zn and Al additions on Cu and Ni(P) substrates. J. Electron. Mater. 39, 2720–2731 (2010)CrossRef
16.
H.R. Kotadia, O. Mokhtari, M.P. Clode, M.A. Green, S.H. Mannan, Intermetallic compound growth suppression at high temperature in SAC solders with Zn addition on Cu and Ni-P substrates. J. Alloys Compd. 511, 176–188 (2012)CrossRef
17.
H.R. Kotadia, A. Panneerselvam, M.W. Sugden, H. Steen, M. Green, S.H. Mannan, Electronics assembly and high temperature Reliability using Sn-3.8 Ag-0.7 Cu solder paste with Zn additives. IEEE Trans. Compon. Packag. Manuf. Technol. 3, 1786–1793 (2013)CrossRef
18.
A. Sharif, Y.C. Chan, Effect of indium addition in Sn-rich solder on the dissolution of Cu metallization. J. Alloys Compd. 390, 67–73 (2005)CrossRef
19.
S.K. Kang, D.-Y. Shih, D. Leonard, D.W. Henderson, T. Gosselin, S. Cho, J. Yu, W.K. Choi, Controlling Ag 3 Sn plate formation in near-ternary-eutectic Sn-Ag-Cu solder by minor Zn alloying. Jom. 56, 34 (2004)CrossRef
20.
O. Mokhtari, H. Nishikawa, Effects of in and Ni addition on microstructure of Sn-58Bi solder joint. J. Electron. Mater. 43, 4158–4170 (2014)CrossRef
21.
W.C. Oliver, G.M. Pharr, An improved technique for determining hardness and elastic modulus using load and displacement sensing indentation experiments. J. Mater. Res. 7, 1564–1583 (1992)CrossRef
22.
Z. Lai, D. Ye, Microstructure and fracture behavior of non eutectic Sn–Bi solder alloys. J. Mater. Sci. Mater. Electron. 27, 3182–3192 (2016)CrossRef
23.
Y. Huo, J. Wu, C.C. Lee, Solid solution softening and enhanced ductility in concentrated FCC silver solid solution alloys. Mater. Sci. Eng. A 729, 208–218 (2018)CrossRef
24.
V.P. Soldatov, V.D. Natsik, A.N. Diulin, G.I. Kirichenko, Low-temperature softening of β-tin single crystals on doping with substitutional impurities. Low Temp. Phys. 26, 160–168 (2000)CrossRef
25.
D.R. Trinkle, C. Woodward, The chemistry of deformation: how solutes soften pure metals. Science 310, 1665–1667 (2005)CrossRef
26.
D. Tabor, Indentation hardness: fifty years on a personal view. Philos. Mag. A 74, 1207–1212 (1996)CrossRef
27.
X. Li, B. Bhushan, A review of nanoindentation continuous stiffness measurement technique and its applications. Mater. Charact. 48, 11–36 (2002)CrossRef
28.
H. Ma, J.C. Suhling, A review of mechanical properties of lead-free solders for electronic packaging. J. Mater. Sci. 44, 1141–1158 (2009)CrossRef
29.
L. Shen, P. Lu, S. Wang, Z. Chen, Creep behaviour of eutectic SnBi alloy and its constituent phases using nanoindentation technique. J. Alloys Compd. 574, 98–103 (2013)CrossRef
Metadaten
Titel
Improved mechanical properties induced by In and In & Zn double additions to eutectic Sn58Bi alloy
verfasst von
Shiqi Zhou
Yu-An Shen
Tiffani Uresti
Vasanth C. Shunmugasamy
Bilal Mansoor
Hiroshi Nishikawa
Publikationsdatum
09.03.2019
Verlag
Springer US
Erschienen in
Journal of Materials Science: Materials in Electronics / Ausgabe 8/2019
Print ISSN: 0957-4522
Elektronische ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-019-01056-y

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