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Erschienen in:
11.10.2015
Improvements in thermo-mechanical and rheological properties of SiO2/epoxy composites using different types of SiO2
Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 1/2016
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Abstract
Single-size 400 nm-SiO2 and multi-size 1 and 5 μm-SiO2 were used as fillers in epoxy matrix. The fillers with the larger particle size and multi-size SiO2 particles mixing is beneficial to lower the viscosity and increase the filler loading. Among the composites, the 60 wt% 5 μm-SiO2 epoxy composite has the best properties with both low coefficients of thermal expansion (CTE) of 28.8 ppm/°C and low viscosity of ~50 Pa s, which shows its capability to achieve the required low CTE and viscosity values in the electronic packaging. Different theoretical proposals were used to estimate the CTE. Maxwell–Garnett equation fits the experimental data well. In addition, the mixture law and Bruggeman effective medium theory offer the upper and lower limits to the CTE.