1 Introduction
2 Experimental setup
2.1 Additive manufacturing
Process parameter | Value |
---|---|
Layer thickness | 50 \(\upmu {\text {m}}\) |
Particle size range | 25–50 \(\upmu {\text {m}}\) |
Laser power border | 150 W |
Laser scan speed border | 300 mm/s |
Laser power hatch | 250 W |
Laser scan speed hatch | 1000 mm/s |
Atmosphere | Argon |
2.2 Weakened structure explanation
2.3 Specimen design
2.4 Machining
3 Orthogonal cutting results
4 Drilling results
4.1 Cutting forces
Samples | Force \(F_{z}\) | Moment \(M_{z}\) | ||
---|---|---|---|---|
Median (N) | MAD (N) | Median (Ncm) | MAD (Ncm) | |
Reference | 5920 | 55 | 3020 | 118 |
AM solid | 5750 | 54 | 2990 | 105 |
AM W2 | 4850 | 49 | 2650 | 74 |
AM W3 | 3980 | 51 | 2420 | 69 |
4.2 Chip formation and surface properties
5 Conclussion and outlook
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The use of standard support structures for horizontal bores leads to challenges in chip removal and to reduced surface qualities.
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The chip formation and the process forces during drilling can be positively influenced by the weakened structure W2 in the LPBF process. The further weakened structure W3 led to a slightly worse surface quality.
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In general, good results can be achieved with regard to chip formation and surface quality through the use of weakened structures.
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Due to the reduced process forces during drilling, the clamping forces can also be reduced. With thin printed components this might solve a problem if the part cannot withstand the typically encountered forces during clamping.
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The lower and less fluctuating machining forces and vibrations are expected to lead to: easier clamping technology; less tool wear; shorter process times; higher surface qualities and higher cutting process stability because of better chip removal.