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Journal of Materials Science: Materials in Electronics
Erschienen in: Journal of Materials Science: Materials in Electronics 6/2011

01.06.2011

In situ optical inspection of electrochemical migration during THB tests

verfasst von: Bálint Medgyes, Balázs Illés, Richárd Berényi, Gábor Harsányi

Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 6/2011

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Abstract

In order to get more information about the process of electrochemical migration (ECM), a novel in situ optical inspection system was developed and tested. The optical inspection system is applicable for real time in situ investigation to observe water condensation and dendrite growth during Thermal Humidity Bias (THB) tests. In this paper, a real time observation of water condensation and dendrite growth is studied on immersion silver (iAg), bare copper (Cu) and galvanic tin (gSn) interdigital (double comb) patterns prepared on FR4 substrate during Dew Point THB test. The real time in situ optical investigations were verified by real time voltage measurements, which are presented in the paper as well. The result shows that the water condensation mainly starts on the metal surface, which is an unexpected phenomenon since the preliminary condition of ECM is the presence of a continuous moisture film between the metallization stripes, e.g. on the surface of the insulation board material.
Vorheriger Artikel Gold/silicon nanocomposites: synthesis, characterization, and application in detection of dopamine
Nächster Artikel Erratum to: Characterization and analysis of CaO–SiO2–B2O3 ternary system ceramics

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Metadaten
Titel
In situ optical inspection of electrochemical migration during THB tests
verfasst von
Bálint Medgyes
Balázs Illés
Richárd Berényi
Gábor Harsányi
Publikationsdatum
01.06.2011
Verlag
Springer US
Erschienen in
Journal of Materials Science: Materials in Electronics / Ausgabe 6/2011
Print ISSN: 0957-4522
Elektronische ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-010-0198-4

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