2010 | OriginalPaper | Buchkapitel
Inductive Coupled Communications
verfasst von : Professor Noriyuki Miura, Professor Takayasu Sakurai, Professor Tadahiro Kuroda
Erschienen in: Coupled Data Communication Techniques for High-Performance and Low-Power Computing
Verlag: Springer US
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Inductive coupled communication is a wireless communication technology for three-dimensionally (3D) stacked chips in a package. As discussed in a previous chapter, capacitive coupled communication (see Figure 4.1) utilizes a pair of metal electrodes which forms a capacitive-coupling channel–essentially a capacitor–as a vertical wireless data link between stacked chips. In inductive coupled communication, a pair of metal coils creates an inductive-coupling channel–essentially a transformer–between stacked chips. Both of these are pure digital circuit solutions compatible with a standard CMOS technology. The metal electrodes and/or the metal coils can be fabricated by using IC interconnections.