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2015 | OriginalPaper | Buchkapitel

5. Industrial Implications of Electromigration-Induced Plasticity in Cu Interconnects: Plasticity-Amplified Diffusivity

verfasst von : Arief Suriadi Budiman

Erschienen in: Probing Crystal Plasticity at the Nanoscales

Verlag: Springer Singapore

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Abstract

The theoretical analysis of the diffusion in interconnects during the electromigration is performed in this chapter. Two main diffusion paths are compared: grain boundaries and electromigration induced dislocations. The electromigration induced dislocations are formed due to the crystal bending, described in the previous chapters, and form a short diffusion path in the direction of the current. These two possible diffusion paths can lead to the significantly different device failure time dependence on the current density. This can lead to an important implication for the way device lifetime/reliability is assessed.

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Vorheriges Kapitel Electromigration-Induced Plasticity in Cu Interconnects: The Texture Dependence

Nächstes Kapitel Indentation Size Effects in Single Crystal Cu as Revealed by Synchrotron X-ray Microdiffraction

Budiman AS, Hau-Riege CS, Besser PR et al (2007) Plasticity-amplified diffusivity: dislocation cores as fast diffusion paths in Cu interconnects. In: 45th annual IEEE international reliability physics symposium proceedings, Phoenix, 15–19 Apr 2007

Budiman AS, Tamura N, Valek BC et al (2006) Crystal plasticity in Cu damascene interconnect lines undergoing electromigration as revealed by synchrotron X-ray microdiffraction. Appl Phys Lett 88:233515CrossRef

Budiman AS, Tamura N, Valek BC et al. (2006) Electromigration-induced plastic deformation in Cu damascene interconnect lines as revealed by synchrotron X-ray microdiffraction. Mat Res Soc Proc 914

Valek BC, Bravman JC, Tamura N et al (2002) Electromigration-induced plastic deformation in passivated metal lines. Appl Phys Lett 81:4168–4170CrossRef

Valek BC, Tamura N, Spolenak R et al (2003) Early stage of plastic deformation in thin films undergoing electromigration. J Appl Phys 94:3757–3761CrossRef

Tamura N, MacDowell AA, Spolenak BC et al (2003) Scanning X-ray microdiffraction with submicrometer white beam for strain/stress and orientation mapping in thin films. J Synchrotron Radiat 10:137–143CrossRef

Baker SP, Joo YC, Knaub MP et al (2000) Electromigration damage in mechanically deformed Al conductor lines: dislocations as fast diffusion paths. Acta Mater 48:2199–2208CrossRef

Frost HJ, Ashby MF (1982) Deformation-mechanism maps: the plasticity and creep of metals and ceramics. Pergamon Press, Oxford

Suo Z (1994) Electromigration-induced dislocation climb and multiplication in conducting lines. Acta Metall Mater 42:3581–3588CrossRef

10.

Oates AS (1996) Electromigration transport mechanisms in al thin-film conductors. J Appl Phys 79:163–169CrossRef

11.

Black JR (1967) Mass transport of aluminum by momentum exchange with conducting electrons. In: 6th annual IEEE international reliability physics symposium proceeding, Los Angeles, 6–8 Nov 1967

12.

Kirchheim R, Kaeber U (1991) Atomistic and computer modeling of metallization failure of integrated circuits by electromigration. J Appl Phys 70:172–181CrossRef

13.

Korhonen MA, Borgesen P, Tu KN et al (1993) Stress evolution due to electromigration in confined metal lines. J Appl Phys 73:3790–3799CrossRef

14.

Lloyd JR (1991) Electromigration failure. J Appl Phys 69:7601CrossRef

15.

Hau-Riege CS, Marathe AP, Pham V (2002) The effect of line length on the electromigration reliability of Cu interconnects. In: Proceedings of the advanced metallization conference, vol 169

16.

Schafft HA, Grant TC, Saxena AN et al (1985) Electromigration and the current density dependence. In: Reliability physics symposium, Orlando

17.

Sigsbee RA (1973) Electromigration and metalization lifetimes. J Appl Phys 44:2533–2540CrossRef

18.

Bobbio A, Saracco O (1975) A modified reliability expression for the electromigration time-to-failure. Micoelectron Reliab 14:431–433CrossRef

19.

Gan D, Ho PS, Pang Y et al (2006) Effect of passivation on stress relaxation in electroplated copper films. J Mater Res 21:1512–1518CrossRef

20.

Cai B, Kong QP, Lu L et al (1999) Interface controlled diffusional creep of nanocrystalline pure copper. Scripta Mater 41:755–759CrossRef

21.

Dickenscheid W, Birringer R, Gleiter H et al (1991) Investigation of self-diffusion in nanocrystalline copper by NMR. Solid State Commun 79:683–686CrossRef

22.

Zschech E, Meyer MA, Langer E (2004) Effect of mass transport along interfaces and grain boundaries on copper interconnect degradation. In: MRS Proceedings, San Francisco, 12–16 Apr 2004

Titel: Industrial Implications of Electromigration-Induced Plasticity in Cu Interconnects: Plasticity-Amplified Diffusivity
verfasst von: Arief Suriadi Budiman
Verlag: Springer Singapore
Buch: Probing Crystal Plasticity at the Nanoscales
Print ISBN: 978-981-287-334-7

Electronic ISBN: 978-981-287-335-4

Copyright-Jahr: 2015
DOI: https://doi.org/10.1007/978-981-287-335-4_5

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