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07.04.2021 | Metals & corrosion

Intermetallic compounds formed in Sn droplet on Cu substrate under the impact of electric currents

verfasst von: Yueying Su, Rui Zhu, Tianqing Zheng, Yanping Shen, Yanyi Xu, Liugang Chen, Yunhu Zhang, Changjiang Song, Hongxing Zheng, Qijie Zhai

Erschienen in: Journal of Materials Science | Ausgabe 20/2021

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Abstract

The present paper investigates the influence of electric currents on the formation of Sn/Cu intermetallic compounds. Solidification experiments of Sn droplets on Cu substrate were performed under the impact of direct csurrents (DC) and pulsed electric currents (ECP), respectively. The results show that the precipitation of Cu₆Sn₅ from the Sn/Cu interfacial reaction is significantly enhanced by both DC and ECP. DC promotes the formation of Cu₆Sn₅ at the interface, whereas ECP triggers the detachment of Cu₆Sn₅ at the interface and favors the growth of freely floated Cu₆Sn₅ particles in the bulk Sn melt. Numerical simulations were conducted to calculate the distribution of electric current, induced magnetic field, Lorentz force and forced flow inside the Sn melt. The numerical results show that a strong downwards Lorentz force is generated adjacent electrode bottom owing to the interaction between electric current and induced magnetic field. As a result, a global forced flow is caused inside the Sn melt. It is possible that the forced flow induces the elements transport to promote the precipitation of intermetallic compounds. Moreover, a strong Lorentz force difference between Sn melt and Cu₆Sn₅ is generated under the application of ECP compared with that of DC, thereby increasing the potential to initiate the detachment of Cu₆Sn₅.

Vorheriger Artikel Data workflow to incorporate thermodynamic energies from Calphad databases into grand-potential-based phase-field models

Nächster Artikel Robust fluorinated siloxane copolymers via initiated chemical vapor deposition for corrosion protection

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Titel: Intermetallic compounds formed in Sn droplet on Cu substrate under the impact of electric currents
verfasst von: Yueying Su
Rui Zhu
Tianqing Zheng
Yanping Shen
Yanyi Xu
Liugang Chen
Yunhu Zhang
Changjiang Song
Hongxing Zheng
Qijie Zhai
Publikationsdatum: 07.04.2021
Verlag: Springer US
Erschienen in: Journal of Materials Science / Ausgabe 20/2021
Print ISSN: 0022-2461
Elektronische ISSN: 1573-4803
DOI: https://doi.org/10.1007/s10853-021-06048-0

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