Skip to main content
Fachgebiete
Automobil + Motoren Bauwesen + Immobilien Business IT + Informatik Elektrotechnik + Elektronik Energie + Nachhaltigkeit Finance + Banking Management + Führung Marketing + Vertrieb Maschinenbau + Werkstoffe Versicherung + Risiko
DE
EN
Bücher
Zeitschriften
Themenseiten
Organisationspsychologie Projektmanagement Marketing Smart Manufacturing
Weitere Formate
Podcasts Webinare Technik Webinare Wirtschaft Kongresse Veranstaltungskalender Awards
Jetzt Einzelzugang starten
Zugang für Unternehmen
Referenzkunden
SLX-Digitalkonferenz: Zukunftswerkstatt 2024

Mehr Umsatz mit Top-Kontakten

Am 7. Mai erfahren Sie, wie Vertriebsteams Leadgenerierung, Leadnurturing und Leadstrategien effizient steuern können.
Erweiterte Suche
Anmelden
nach oben
Erschienen in:
Introduction to Nanotechnology Kapitel lesen Erstes Kapitel lesen

2017 | OriginalPaper | Buchkapitel

3. Introduction to Micro-/Nanofabrication

verfasst von : Gemma Rius, Antoni Baldi, Babak Ziaie, Massood Z. Atashbar

Erschienen in: Springer Handbook of Nanotechnology

Verlag: Springer Berlin Heidelberg

Einloggen

Aktivieren Sie unsere intelligente Suche, um passende Fachinhalte oder Patente zu finden.

search-config
loading …

Abstract

This chapter outlines and discusses important micro- and nanofabrication techniques. We focus on the most basic methods borrowed from the integrated circuit (IC) industry, such as thin-film deposition, lithography and etching, and then move on to look at microelectromechanical systems (MEMS) and nanofabrication technologies. We cover a broad range of dimensions, from the sub-millimeter to the nanometer scale. Although most of the current research is being geared towards the nanodomain, a good understanding of basic top-down methods for fabricating micron-sized objects can aid our understanding of this research. Due to space constraints, we focus here on the most important technologies; in the microdomain these include surface, bulk, and high-aspect-ratio micromachining; in the nanodomain we concentrate on e-beam lithography, epitaxial growth, scanning probe lithography, template manufacturing, and self-assembly. MEMS technology has matured rapidly, with some new technologies displacing older ones that have proven to be unsuited to manufacture on a commercial scale. However, due to limitations encountered on these methods used in the nanodomain, it appears that bottom-up methods or introduction of novel nanoforms and nanomaterials are the most feasible and promising solutions. Disruptive approaches are expected to have a major impact in a variety of application areas such as biology, medicine, environmental monitoring, and nanoelectronics.

Sie haben noch keine Lizenz? Dann Informieren Sie sich jetzt über unsere Produkte:

Springer Professional "Wirtschaft+Technik"

Online-Abonnement

Mit Springer Professional "Wirtschaft+Technik" erhalten Sie Zugriff auf:

  • über 102.000 Bücher
  • über 537 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Finance + Banking
  • Management + Führung
  • Marketing + Vertrieb
  • Maschinenbau + Werkstoffe
  • Versicherung + Risiko

Jetzt Wissensvorsprung sichern!

Jetzt informieren

Springer Professional "Technik"

Online-Abonnement

Mit Springer Professional "Technik" erhalten Sie Zugriff auf:

  • über 67.000 Bücher
  • über 390 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Maschinenbau + Werkstoffe




 

Jetzt Wissensvorsprung sichern!

Jetzt informieren
Vorheriges Kapitel Molecule-Based Devices
Nächstes Kapitel 3-D Nanostructure Fabrication by Focused-Ion Beam, Electron- and Laser Beam
Literatur
3.1
S.A. Campbell: The Science and Engineering of Microelectronic Fabrication (Oxford Univ. Press, New York 2001)
3.2
C.J. Jaeger: Introduction to Microelectronic Fabrication (Prentice Hall, New Jersey 2002)
3.3
J.D. Plummer, M.D. Deal, P.B. Griffin: Silicon VLSI Technology (Prentice Hall, New Jersey 2000)
3.4
J.E. Bjorkholm: EUV lithography: The successor to optical lithography, Intel Technol. J. 2, 1–8 (1998)
3.5
S. Owa, H. Nagasaka: Advantage and feasibility of immersion lithography, J. Microlithogr. Microfabr. Microsyst. 3, 97–103 (2004)
3.6
H.U. Krebs, M. Störmer, J. Faupel, E. Süske, T. Scharf, C. Fuhse, N. Seibt, H. Kijewski, D. Nelke, E. Panchenko, M. Buback: Pulsed laser deposition (PLD) – A versatile thin film technique, Adv. Solid State Phys. 43, 505–517 (2003)
3.7
M. Leskela, M. Ritala: Atomic layer deposition chemistry: recent developments and future challenges, Angew. Chem. Int. Ed. 42, 5548–5554 (2003)
3.8
J.L. Vossen: Thin Film Processes (Academic, New York 1976)
3.9
M. Gad-el-Hak (Ed.): The MEMS Handbook (CRC, Boca Raton 2002)MATH
3.10
T.-R. Hsu: MEMS and Microsystems Design and Manufacture (McGraw Hill, New York 2002)
3.11
G.T.A. Kovacs: Micromachined Transducers Sourcebook (McGraw Hill, New York 1998)
3.12
P. Rai-Choudhury (Ed.): Handbook of Microlithography, Micromachining and Microfabrication. Vol. 2: Micromachining and Microfabrication (SPIE/IEE, Bellingham, Washington/London 1997)
3.13
M.F. Aimi, M.P. Rao, N.C. MacDonald, A.S. Zuruzi, D.P. Bothman: High-aspect-ratio bulk micromachining of titanium, Nat. Mater. 3, 103–105 (2004)
3.14
T.J. Cotler, M.E. Elta: Plasma-etch technology, IEEE Circuits Devices Mag. 6, 38–43 (1990)
3.15
U. Gosele, Q.Y. Tong: Semiconductor wafer bonding, Annu. Rev. Mater. Sci. 28, 215–241 (1998)
3.16
Q.Y. Tong, U. Gosele: Semiconductor Wafer Bonding: Science and Technology (Wiley, New York 1999)
3.17
F. Niklaus, P. Enoksson, E. Kalveston, G. Stemme: Void-free full-wafer adhesive bonding, J. Micromech. Microeng. 11, 100–107 (2000)
3.18
C.A. Harper: Electronic Packaging and Interconnection Handbook (McGraw-Hill, New York 2000)
3.19
W.H. Ko, J.T. Suminto, G.J. Yeh: Bonding techniques for microsensors. In: Micromachining and Micropackaging for Transducers, ed. by W.H. Ko (Elsevier, Amsterdam 1985)
3.20
G.T.A. Kovacs, N.I. Maluf, K.A. Petersen: Bulk micromachining of silicon, Proc. IEEE 86(8), 1536–1551 (1998)
3.21
K. Najafi, K.D. Wise, T. Mochizuki: A high-yield IC-compatible multichannel recording array, IEEE Trans. Electron Devices 32, 1206–1211 (1985)
3.22
A. Selvakumar, K. Najafi: A high-sensitivity z-axis capacitive silicon microaccelerometer with a tortional suspension, J. Microelectromech. Syst. 7, 192–200 (1998)
3.23
H. Baltes, O. Paul, O. Brand: Micromachined thermally based CMOS microsensors, Proc. IEEE 86(8), 1660–1678 (1998)
3.24
B. Eyre, K.S.J. Pister, W. Gekelman: Multi-axis microcoil sensors in standard CMOS. In: Proc. SPIE Conf. Micromach. Devices Compon., Austin (1995) pp. 183–191
3.25
K.A. Shaw, Z.L. Zhang, N.C. MacDonnald: SCREAM: A single mask, single-crystal silicon process for microelectromechanical structures. In: Proc. IEEE Workshop Micro Electro Mech. Syst., Fort Lauderdale (1993) pp. 155–160
3.26
G.K. Fedder, S. Santhanam, M.L. Reed, S.C. Eagle, D.F. Guillo, M.S.C. Lu, L.R. Carley: Laminated high-aspect-ratio microstructures in a conventional CMOS process. In: Proc. IEEE Workshop Micro Electro Mech. Syst., San Diego (1996) pp. 13–18
3.27
B.P. Van Drieenhuizen, N.I. Maluf, I.E. Opris, G.T.A. Kovacs: Force-balanced accelerometer with mG resolution fabricated using silicon fusion bonding and deep reactive ion etching. In: Proc. Int. Conf. Solid-State Sens. Actuators, Chicago (1997) pp. 1229–1230
3.28
N.C. MacDonald: SCREAM MicroElectroMechanical Systems, Microelectron. Eng. 32, 51–55 (1996)
3.29
X. Huikai, L. Erdmann, Z. Xu, K.J. Gabriel, G.K. Fedder: Post-CMOS processing for high-aspect-ratio integrated silicon microstructures, J. Microelectromech. Syst. 11, 93–101 (2002)
3.30
J.M. Bustillo, R.S. Muller: Surface micromachining for microelectromechanical systems, Proc. IEEE 86(8), 1552–1574 (1998)
3.31
H.C. Nathanson, W.E. Newell, R.A. Wickstrom, J.R. Davis: The resonant gate transistor, IEEE Trans. Electron Devices 14, 117–133 (1967)
3.32
R.T. Howe, R.S. Muller: Polycrystalline silicon micromechanical beams. In: Proc. Electrochem. Soc. Spring Meet., Montreal (1982) pp. 184–185
3.33
G. Rius, F. Pérez Murano: Nanocantilever beam fabrication techniques in silicon. In: Nanocantilever Beams: Modeling, Fabrication, and Applications, ed. by I. Voiculescu, M. Zaghloul (CRC, Boca Raton 2015) pp. 3–36
3.34
P.F. Van Kessel, L.J. Hornbeck, R.E. Meier, M.R. Douglass: A MEMS-based projection display, Proc. IEEE 86(8), 1687–1704 (1998)
3.35
J.A. Geen, S.J. Sherman, J.F. Chang, S.R. Lewis: Single-chip surface-micromachined integrated gyroscope with \({\mathrm{50}}\,{\mathrm{{}^{\circ}/h}}\) root Allan deviation, IEEE J. Solid-State Circuits 37, 1860–1866 (2002)
3.36
A.E. Franke, D. Bilic, D.T. Chang, P.T. Jones, R.T. Howe, G.C. Johnson: Post-CMOS integration of germanium microstructures. In: Proc. Micro Electro Mech. Syst., Orlando (1999) pp. 630–637
3.37
S. Sedky, P. Fiorini, M. Caymax, S. Loreti, K. Baert, L. Hermans, R. Mertens: Structural and mechanical properties of polycrystalline silicon germanium for micromachining applications, J. Microelectromech. Syst. 7, 365–372 (1998)
3.38
N. Tas, T. Sonnenberg, H. Jansen, R. Legtenberg, M. Elwenspoek: Stiction in surface micromachining, J. Micromech. Microeng. 6, 385–397 (1996)
3.39
R. Maboudian, R.T. Howe: Critical review: Adhesion in surface micromechanical structures, J. Vac. Sci. Technol. B 15(1), 1–20 (1997)
3.40
J.H. Smith, S. Montague, J.J. Sniegowski, J.R. Murray, P.J. McWhorter: Embedded micromechanical devices for the monolithic integration of MEMS with CMOS. In: Proc. Int. Electron Devices Meet., Washington (1995) pp. 609–612
3.41
K.S.J. Pister, M.W. Judy, S.R. Burgett, R.S. Fearing: Microfabricated hinges: 1 mm vertical features with surface micromachining. In: Proc. 6th Int. Conf. Solid-State Sens. Actuators, San Francisco (1991) pp. 647–650
3.42
L.Y. Lin, S.S. Lee, M.C. Wu, K.S.J. Pister: Micromachined integrated optics for free space interconnection. In: Proc. IEEE Micro Electro Mech. Syst. Workshop, Amsterdam (1995) pp. 77–82
3.43
R.S. Muller, K.Y. Lau: Surface-micromachined microoptical elements and systems, Proc. IEEE 86(8), 1705–1720 (1998)
3.44
E.W. Becker, W. Ehrfeld, P. Hagmann, A. Maner, D. Munchmeyer: Fabrication of microstructures with high aspect ratios and great structural heights by synchrotron radiation lithography, galvanoforming, and plastic molding (LIGA process), Microelectron. Eng. 4, 35–56 (1986)
3.45
H. Guckel: High-aspect-ratio micromachining via deep x-ray lithography, Proc. IEEE 86(8), 1586–1593 (1998)
3.46
K.Y. Lee, N. LaBianca, S.A. Rishton, S. Zolgharnain, J.D. Gelorme, J. Shaw, T.H.P. Chang: Micromachining applications of a high resolution ultra-thick photoresist, J. Vac. Sci. Technol. B 13, 3012–3016 (1995)
3.47
K. Roberts, F. Williamson, G. Cibuzar, L. Thomas: The fabrication of an array of microcavities utilizing SU-8 photoresist as an alternative ‘LIGA’ technology. In: Proc. 13th Bienn. Univ./Gov./Ind. Microelectron. Symp. (IEEE), Minneapolis (1999) pp. 139–141
3.48
C. Burbaum, J. Mohr, P. Bley, W. Ehrfeld: Fabrication of capacitive acceleration sensors by the LIGA technique, Sens. Actuators A Phys. A27, 559–563 (1991)
3.49
D.A. Horsley, M.B. Cohn, A. Singh, R. Horowitz, A.P. Pisano: Design and fabrication of an angular microactuator for magnetic disk drives, J. Microelectromech. Syst. 7, 141–148 (1998)
3.50
C.G. Keller, R.T. Howe: Hexsil bimorphs for vertical actuation. In: Dig. Tech. Pap. 8th Int. Conf. Solid-State Sens. Actuators Eurosens. IX, Stockholm (1995) pp. 99–102
3.51
C.G. Keller, R.T. Howe: Nickel-filled hexsil thermally actuated tweezers. In: Dig. Tech. Pap. 8th Int. Conf. Solid-State Sens. Actuators Eurosens. IX, Stockholm (1995) pp. 376–379
3.52
F. Ayazi, K. Najafi: High aspect-ratio combined poly and single-crystal silicon (HARPSS) MEMS technology, J. Microelectromech. Syst. 9, 288–294 (1998)
3.53
F. Ayazi, K. Najafi: A HARPSS polysilicon vibrating ring gyroscope, J. Microelectromech. Syst. 10, 169–179 (2001)
3.54
Y.S. No, F. Ayazi: The HARPSS process for fabrication of nano-precision silicon electromechanical resonators. In: Proc. 2001 1st IEEE Conf. Nanotechnol., Maui (2001) pp. 489–494
3.55
N. Yazdi, F. Ayazi, K. Najafi: Micromachined inertial sensors, Proc. IEEE 86, 1640–1659 (1998)
3.56
G. Timp: Nanotechnology (Springer, New York 1998)
3.57
3.58
P. Rai-Choudhury (Ed.): Handbook of Microlithography, Micromachining and Microfabrication. Vol. 1: Microlithography (SPIE/IEE, Bellingham, Washington/London 1997)
3.59
L. Ming, C. Bao-qin, Y. Tian-Chun, Q. He, X. Qiuxia: The sub-micron fabrication technology. In: Proc. 6th Int. Conf. Solid-State Integr.-Circuit Technol., San Francisco, Vol. 1 (2001) pp. 452–455
3.60
M.A. Herman: Molecular Beam Epitaxy: Fundamentals and Current Status (Springer, New York 1996)
3.61
J.S. Frood, G.J. Davis, W.T. Tsang: Chemical Beam Epitaxy and Related Techniques (Wiley, New York 1997)
3.62
S. Mahajan, K.S. Sree Harsha: Principles of Growth and Processing of Semiconductors (McGraw Hill, New York 1999)
3.63
S. Kim, M. Razegi: Advances in quantum dot structures. In: Processing and Properties of Compound Semiconductors, ed. by K. Willardson, E.R. Weber (Academic, New York 2001)
3.64
D. Bimberg, M. Grundmann, N.N. Ledentsov: Quantum Dot Heterostructures (Wiley, New York 1999)
3.65
G. Seebohm, H.G. Craighead: Lithography and patterning for nanostructure fabrication. In: Quantum Semiconductor Devices and Technologies, ed. by T.P. Pearsall (Kluwer, Boston 2000)
3.66
E. Kapon: Lateral patterning of quantum well heterostructures by growth on nonplanar substrates. In: Epitaxial Microstructures, ed. by A.C. Gossard (Academic, New York 1994)
3.67
F. Guffarth, R. Heitz, A. Schliwa, O. Stier, N.N. Ledentsov, A.R. Kovsh, V.M. Ustinov, D. Bimberg: Strain engineering of self-organized InAs quantum dots, Phys. Rev. B 64, 085305–1–085305–7 (2001)
3.68
M. Sugawara: Self-Assembled InGaAs/GaAs Quantum Dots (Academic, New York 1999)
3.69
B.C. Lee, S.D. Lin, C.P. Lee, H.M. Lee, J.C. Wu, K.W. Sun: Selective growth of single InAs quantum dots using strain engineering, Appl. Phys. Lett. 80, 326–328 (2002)
3.70
F.S.S. Chien, W.F. Hsieh, S. Gwo, A.E. Vladar, J.A. Dagata: Silicon nanostructures fabricated by scanning-probe oxidation and tetra-methyl ammonium hydroxide etching, J. Appl. Phys. 91, 10044–10050 (2002)
3.71
M. Calleja, J. Anguita, R. Garcia, K. Birkelund, F. Perez-Murano, J.A. Dagata: Nanometer-scale oxidation of silicon surfaces by dynamic force microscopy: Reproducibility, kinetics and nanofabrication, Nanotechnology 10, 34–38 (1999)
3.72
E.S. Snow, P.M. Campbell, F.K. Perkins: Nanofabrication with proximal probes, Proc. IEEE 85, 601–611 (1997)
3.73
H. Sugimura, T. Uchida, N. Kitamura, H. Masuhara: Tip-induced anodization of titanium surfaces by scanning tunneling microscopy: A humidity effect on nanolithography, Appl. Phys. Lett. 63, 1288–1290 (1993)
3.74
N. Kramer, J. Jorritsma, H. Birk, C. Schonenberger: Nanometer lithography on silicon and hydrogenated amorphous silicon with low energy electrons, J. Vac. Sci. Technol. B 13, 805–811 (1995)
3.75
H.T. Soh, K.W. Guarini, C.F. Quate: Scanning Probe Lithography (Kluwer Academic, Boston 2001)
3.76
C.A. Mirkin: Dip-pen nanolithography: automated fabrication of custom multicomponent, sub-100-nanometer surface architectures, MRS Bull. 26, 535–538 (2001)
3.77
P.E. Sheehan, L.J. Whitman, W.P. King, B.A. Nelson: Nanoscale deposition of solid inks via thermal dip pen nanolithography, Appl. Phys. Lett. 85, 1589–1591 (2004)
3.78
R. Garcia, A.W. Knoll, E. Riedo: Advanced scanning probe lithography, Nat. Nanotechnol. 9, 577–587 (2014)
3.79
L.L. Sohn, R.L. Willett: Fabrication of nanostructures using atomic-force-microscope-based lithography, Appl. Phys. Lett. 67, 1552–1554 (1995)
3.80
H.J. Mamin, B.D. Terris, L.S. Fan, S. Hoen, R.C. Barrett, D. Rugar: High-density data storage using proximal probe techniques, IBM J. Res. Dev. 39, 681–699 (1995)
3.81
K. Bessho, S. Hashimoto: Fabricating nanoscale structures on Au surface with scanning tunneling microscope, Appl. Phys. Lett. 65, 2142–2144 (1994)
3.82
I.W. Lyo, P. Avouris: Field-induced nanometer- to atomic-scale manipulation of silicon surfaces with the STM, Science 253, 173–176 (1991)
3.83
M.F. Crommie, C.P. Lutz, D.M. Eigler: Confinement of electrons to quantum corrals on a metal surface, Science 262, 218–220 (1993)
3.84
A. de Lozanne: Pattern generation below 0.1 micron by localized chemical vapor deposition with the scanning tunneling microscope, Jpn. J. Appl. Phys. 33, 7090–7093 (1994)
3.85
L.A. Nagahara, T. Thundat, S.M. Lindsay: Nanolithography on semiconductor surfaces under an etching solution, Appl. Phys. Lett. 57, 270–272 (1990)
3.86
T. Thundat, L.A. Nagahara, S.M. Lindsay: Scanning tunneling microscopy studies of semiconductor electrochemistry, J. Vac. Sci. Technol. A 8, 539–543 (1990)
3.87
S.C. Minne, S.R. Manalis, A. Atalar, C.F. Quate: Independent parallel lithography using the atomic force microscope, J. Vac. Sci. Technol. B 14, 2456–2461 (1996)
3.88
M. Lutwyche, C. Andreoli, G. Binnig, J. Brugger, U. Drechsler, W. Häberle, H. Rohrer, H. Rothuizen, P. Vettiger: Microfabrication and parallel operation of 5 × 5 2-D AFM cantilever arrays for data storage and imaging, Proc. MEMS 98, 8–11 (1998)
3.89
G.M. Whitesides, B. Grzybowski: Self-assembly at all scales, Science 295, 2418–2421 (2002)
3.90
P. Kazmaier, N. Chopra: Bridging size scales with self-assembling supramolecular materials, MRS Bull. 25, 30–35 (2000)
3.91
G.A. Gelves, Z.T.M. Murakami, M.J. Krantz, J.A. Haber: Multigram synthesis of copper nanowires using ac electrodeposition into porous aluminium oxide templates, J. Mater. Chem. 16, 3075–3083 (2006)
3.92
3.93
R. Gronheid, P. Nealey (Eds.): Directed Self-Assembly of Block Copolymers for Nano-manufacturing, Woodhead Publishing Series in Electronic and Optical Materials, Vol. 83 (Elsevier, Cambridge 2015)
3.94
R. Plass, J.A. Last, N.C. Bartelt, G.L. Kellogg: Self-assembled domain patterns, Nature 412, 875 (2001)
3.95
Y.A. Vlasov, X.-Z. Bo, J.G. Sturm, D.J. Norris: On-chip natural self-assembly of silicon photonic bandgap crystals, Nature 414, 289–293 (2001)
3.96
C. Gigault, K. Dalnoki-Veress, J.R. Dutcher: Changes in the morphology of self-assembled polystyrene microsphere monolayers produced by annealing, J. Colloid Interface Sci. 243, 143–155 (2001)
3.97
J.C. Hulteen, C.R. Martin: A general template-based method for the preparation of nanomaterials, J. Mater. Chem. 7, 1075–1087 (1997)
3.98
J.D. Joannopoulos, P.R. Villeneuve, S. Fan: Photonic crystals: putting a new twist on light, Nature 386, 143–149 (1997)
3.99
T.D. Clark, R. Ferrigno, J. Tien, K.E. Paul, G.M. Whitesides: Template-directed self-assembly of 10-μm-sized hexagonal plates, J. Am. Chem. Soc. 124, 5419–5426 (2002)
3.100
S.A. Sapp, D.T. Mitchell, C.R. Martin: Using template-synthesized micro- and nanowires as building blocks for self-assembly of supramolecular architectures, Chem. Mater. 11, 1183–1185 (1999)
3.101
Y. Yin, Y. Lu, B. Gates, Y. Xia: Template assisted self-assembly: A practical route to complex aggregates of monodispersed colloids with well-defined sizes, shapes and structures, J. Am. Chem. Soc. 123, 8718–8729 (2001)
3.102
J.L. Wilbur, G.M. Whitesides: Self-assembly and self-assembles monolayers in micro- and nanofabrication. In: Nanotechnology, ed. by G. Timp (Springer, New York 1999)
3.103
S.R. Wasserman, Y.T. Tao, G.M. Whitesides: Structure and reactivity of alkylsiloxane monolayers formed by reaction of alkyltrichlorosilanes on silicon substrates, Langmuir 5, 1074–1087 (1989)
3.104
C.P. Tripp, M.L. Hair: An infrared study of the reaction of octadecyltrichlorosilane with silica, Langmuir 8, 1120–1126 (1992)
3.105
S. Fiorilli, P. Rivolo, E. Descrovi, C. Ricciardi, L. Pasquardini, L. Lunelli, L. Vanzetti, C. Pederzolli, B. Onida, E. Garrone: Vapor-phase self-assembled monolayers of aminosilane on plasma-activated silicon substrates, J. Colloid Interface Sci. 321, 235–241 (2008)
3.106
R. de la Rica, A. Baldi, E. Mendoza, A. San Paulo, A. Llobera, C. Fernandez-Sanchez: Silane nanopatterns via gas-phase soft lithography, Small 4(8), 1076–1079 (2008)
3.107
D.R. Walt: Nanomaterials: Top-to-bottom functional design, Nature 1, 17–18 (2002)
3.108
J. Noh, T. Murase, K. Nakajima, H. Lee, M. Hara: Nanoscopic investigation of the self-assembly processes of dialkyl disulfides and dialkyl sulfides on Au(111), J. Phys. Chem. B 104, 7411–7416 (2000)
3.109
M. Himmelhaus, F. Eisert, M. Buck, M. Grunze: Self-assembly of n-alkanethiol monolayers: A study by IR-visible sum frequency spectroscopy (SFG), J. Phys. Chem. 104, 576–584 (1999)
3.110
A.K. Boal, F. Ilhan, J.E. DeRouchey, T. Thurn-Albrecht, T.P. Russell, V.M. Rotello: Self-assembly of nanoparticles into structures spherical and network aggregates, Nature 404, 746–748 (2000)
3.111
A. Ulman: An Introduction to Ultrathin Organic Films: From Langmuir–Blodgett to Self-Assembly (Academic, New York 1991)
3.112
E. Winfree, F. Liu, L.A. Wenzler, N.C. Seeman: Design and self-assembly of two-dimensional DNA crystals, Nature 394, 539–544 (1998)
3.113
J.H. Reif, T.H. LaBean, N.C. Seeman: Programmable assembly at the molecular scale: Self-assembly of DNA lattices. In: Proc. 2001 IEEE Int. Conf. Robot. Autom., Seoul (2001) pp. 966–971
3.114
A.P. Alivisatos, K.P. Johnsson, X. Peng, T.E. Wilson, C.J. Loweth, M.P. Bruchez Jr, P.G. Schultz: Organization of ‘nanocrystal molecules’ using DNA, Nature 382, 609–611 (1996)
3.115
H. Cao, Z. Yu, J. Wang, J.O. Tegenfeldt, R.H. Austin, E. Chen, W. Wu, S.Y. Chou: Fabrication of 10 nm enclosed nanofluidic channels, Appl. Phys. Lett. 81, 174–176 (2002)
3.116
H. Masuda, H. Yamada, M. Satoh, H. Asoh: Highly ordered nanochannel-array architecture in anodic alumina, Appl. Phys. Lett. 71, 2770–2772 (1997)
3.117
R.L. Fleischer: Nuclear Tracks in Solids: Principles and Applications (Univ. of California Press, Berkeley 1976)
3.118
R.E. Packard, J.P. Pekola, P.B. Price, R.N.R. Spohr, K.H. Westmacott, Y.Q. Zhu: Manufacture observation and test of membranes with locatable single pores, Rev. Sci. Instrum. 57, 1654–1660 (1986)
3.119
L. Sun, P.C. Searson, C.L. Chien: Electrochemical deposition of nickel nanowire arrays in single-crystal mica films, Appl. Phys. Lett. 74, 2803–2805 (1999)
3.120
E.C. Walter, M.P. Zach, F. Favier, B.J. Murray, K. Inazu, J.C. Hemminger, R.M. Penner: Metal nanowire arrays by electrodeposition, ChemPhysChem 4(2), 131–138 (2003)
3.121
M.Z. Atashbar, D. Banerji, S. Singamaneni, V. Bliznyuk: Deposition of parallel arrays of palladium nanowires and electrical characterization using microelectrode contacts, Nanotechnology 15(3), 374–378 (2004)
3.122
Y. Du, W.L. Cai, C.M. Mo, J. Chen, L.D. Zhang, X.G. Zhu: Preparation and photoluminescence of alumina membranes with ordered pore arrays, Appl. Phys. Lett. 74, 2951–2953 (1999)
3.123
M. Guowen, C. Anyuan, C. Ju-Yin, A. Vijayaraghavan, J.J. Yung, M. Shima, P.M. Ajayan: Ordered Ni nanowire tip arrays sticking out of the anodic aluminum oxide template, J. Appl. Phys. 97, 64303–1–64303–5 (2005)
3.124
S. Yang, H. Zhu, D. Yu, Z. Jin, S. Tang, Y. Du: Preparation and magnetic property of Fe nanowire array, J. Magn. Magn. Mater. 222, 97–100 (2000)
3.125
M. Sun, G. Zangari, R.M. Metzger: Cobalt island arrays with in-plane anisotropy electrodeposited in highly ordered alumina, IEEE Trans. Magn. 36, 3005–3008 (2000)
3.126
P.V. Braun, P. Wiltzius: Electrochemically grown photonic crystals, Nature 402, 603–604 (1999)
3.127
S.R. Nicewarner-Pena, R.G. Freeman, B.D. Reiss, L. He, D.J. Pena, I.D. Walton, R. Cromer, C.D. Keating, M.J. Natan: Submicrometer metallic barcodes, Science 294, 137–141 (2001)
Metadaten
Titel
Introduction to Micro-/Nanofabrication
verfasst von
Gemma Rius
Antoni Baldi
Babak Ziaie
Massood Z. Atashbar
Copyright-Jahr
2017
Verlag
Springer Berlin Heidelberg
Buch
Springer Handbook of Nanotechnology

Print ISBN: 978-3-662-54355-9

Electronic ISBN: 978-3-662-54357-3

Copyright-Jahr: 2017

DOI
https://doi.org/10.1007/978-3-662-54357-3_3

Neuer Inhalt

    Bildnachweise