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2021 | OriginalPaper | Buchkapitel

Investigation of Material Property Model on Substrate Deformation Induced by Thick-Walled WAAM Process Using Numerical Computation

verfasst von : Siti Nursyahirah Ahmad, Yupiter Harangan Prasada Manurung, Muhd Faiz Mat, Martin Leitner

Erschienen in: Recent Trends in Manufacturing and Materials Towards Industry 4.0

Verlag: Springer Singapore

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Abstract

This research presents an investigation of material property model effects of thick-walled Wire Arc Additive Manufacturing (WAAM) process on deformation behaviour which involves thermo-mechanical non-linear numerical computation. A 3D thermo-elastic–plastic WAAM model is developed using general purposed FEA software MSC Marc/Mentat. The material models of component stainless steel SS316L were simulated based on two different sources namely material X5Crnimo18_10_1from default library database and evolved wire. The thermo-mechanical and thermo-physical material properties of evolved wire SS316L were obtained using chemical composition analysis SEDM-EDX and generated by advanced material modelling software. Component geometry was modelled using simplified rectangular shape and mesh which consists of ten layers and three strings. The numerical simulation was implemented under consideration of temperature dependent hardening rule with von-mises yield criteria and Goldak’s double ellipsoid heat source model was utilized. Based on the adjusted thermal coefficient parameters, the transient temperature distribution between two different material property models were analysed. The outcome of this research is to characterise the substrate deformation induced by WAAM process using material models of evolved component SS316L and existing material from default library database.

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Metadaten
Titel
Investigation of Material Property Model on Substrate Deformation Induced by Thick-Walled WAAM Process Using Numerical Computation
verfasst von
Siti Nursyahirah Ahmad
Yupiter Harangan Prasada Manurung
Muhd Faiz Mat
Martin Leitner
Copyright-Jahr
2021
Verlag
Springer Singapore
DOI
https://doi.org/10.1007/978-981-15-9505-9_67

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