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Journal of Electronic Materials

Ausgabe 1/2020

Special Section: TMS2019 Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder. Guest Editors: Kazuhiro Nogita, Tae-Kyu Lee, Zhi-Quan Liu, Arif Salleh, Christopher Gourlay, Yan Li, Albert T. Wu. Special Section: TMS2019 Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XVIII. Guest Editor: Hiroshi Nishikawa

Inhalt (99 Artikel)

TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder

The Effect of Ni and Bi Additions on the Solderability of Sn-0.7Cu Solder Coatings

M. I. I. Ramli, M. A. A. Mohd Salleh, M. M. A. Abdullah, P. Narayanan, J. Chaiprapa, R. Mohd Said, S. Yoriya, K. Nogita

TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder

Low Temperature Cu-to-Cu Bonding in Non-vacuum Atmosphere with Thin Gold Capping on Highly (111) Oriented Nanotwinned Copper

Yu-Ting Wu, Chih Chen

TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder

Nanomechanical Responses of an Intermetallic Compound Layer in Transient Liquid Phase Bonding Using Indium

Jenn-Ming Song, Wei-Chih Lu, Pei-Wen Chou

TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder

Effect of Chemical Additives in the Plating Bath on Surface Corrosion Resistance of Ni(P)

C. Y. Wu, Y. H. Chen, Y. K. Tang, E. J. Lin, Y. X. Lin, J. Y. Wang, W. X. Zhuang, C. H. Lee, C. Y. Chiu, C. Y. Yeh, C. Y. Hsiao, M. L. Cheng, A. L. Liu, C. Y. Liu

TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder

Decomposed Copper(II) Acetate Over Expanded Graphite (EG) as Hybrid Filler to Fabricate Epoxy Based Thermal Interface Materials (TIMs)

Sagar Kumar Nayak, Smita Mohanty, Sanjay K. Nayak

TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder

Lifetime Prediction of Electrochemical Ion Migration with Various Surface Finishes of Printed Circuit Boards

Won Sik Hong, Chulmin Oh

TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder

Mechanical Reliability of Photovoltaic Cells under Cyclic Thermal Loading

Dipali Sonawane, Praveen C. Ramamurthy, Praveen Kumar

TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder

A Study on Electrical and Electrochemical Characteristics of Friction Stir Welded Lithium-Ion Battery Tabs for Electric Vehicles

Omkar Mypati, Debasish Mishra, Suryakanta Sahu, Surjya K. Pal, Prakash Srirangam

TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder

Surface Diffusion and the Interfacial Reaction in Cu/Sn/Ni Micro-Pillars

H. Y. Yu, T. H. Yang, Y. S. Chiu, C. R. Kao

TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder

Effect of Thermomigration–Electromigration Coupling on Mass Transport in Cu Thin Films

Nalla Somaiah, Praveen Kumar

TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder

Tuning Stress in Cu Thin Films by Developing Highly (111)-Oriented Nanotwinned Structure

I-Ju Wang, Ching-Shun Ku, Tu-Ngoc Lam, E-Wen Huang, K. N. Tu, Chih Chen

TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder

Thermal Preconditioning and Restoration of Bismuth-Containing, Lead-Free Solder Alloys

André M. Delhaise, Polina Snugovsky, Jeff Kennedy, David Hillman, Ivan Matijevic, Stephan Meschter, David Adams, Milea Kammer, Marianne Romansky, Joseph Juarez, Ivan Straznicky, Leonid Snugovsky, Ross Wilcoxon, Doug D. Perovic

TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder

Properties of CuGa2 Formed Between Liquid Ga and Cu Substrates at Room Temperature

Shiqian Liu, Stuart McDonald, Qinfen Gu, Syo Matsumura, Dongdong Qu, Keith Sweatman, Tetsuro Nishimura, Kazuhiro Nogita

TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder

Orientation Relationships of Pure Tin on Single Crystal Germanium Substrates

Thomas C. Reeve, Samuel Temple Reeve, Carol A. Handwerker

TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder

Time Independent Deformation of a Sn-Ag-Bi Pb-Free Solder: Stress–Strain Deformation and Yield Stress Properties

Paul T. Vianco, Bonnie B. McKenzie, Jerome A. Rejent, J. Mark Grazier, Celedonio E. Jaramillo, Alice C. Kilgo

TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder

Interplay of Wettability, Interfacial Reaction and Interfacial Thermal Conductance in Sn-0.7Cu Solder Alloy/Substrate Couples

Thiago Soares, Clarissa Cruz, Bismarck Silva, Crystopher Brito, Amauri Garcia, José Eduardo Spinelli, Noé Cheung

TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder

Low-Pressure Silver Sintering of Automobile Power Modules with a Silicon-Carbide Device and an Active-Metal-Brazed Substrate

Won Sik Hong, Mi Song Kim, Chulmin Oh

TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder

The Variation of Microstructure and the Improvement of Shear Strength in SAC1205-xNi/OSP Cu Solder Joints Before and After Aging

Collin Fleshman, Jenq-Gong Duh

TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder

The Growth of Interfacial IMC Layer in SAC0307 Solder Joints with Specific Grain Orientation Under Electrical and Thermal Coupling Fields

Yu Tian, Limin Ma, Yishu Wang, Fu Guo, Zhijie Sun

TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder

Thermal, Electrical and Mechanical Properties of Expanded Graphite and Micro-SiC Filled Hybrid Epoxy Composite for Electronic Packaging Applications

Sagar Kumar Nayak, Smita Mohanty, Sanjay K. Nayak

TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder

Correlation Between the Growth of Voids and Ni3Sn4 Intermetallic Compounds at SnAg/Ni and SnAgCuBiSbNi/Ni Interfaces at Temperatures up to 200°C

Faramarz Hadian, Harry Schoeller, Eric Cotts

TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder

Effect of Component Flexibility During Thermal Cycling of Sintered Nano-Silver Joints by X-ray Microtomography

Jason J. Williams, Irene Lujan Regalado, Leo Liu, Shailesh Joshi, Nikhilesh Chawla

TMS2019 Phase Stability in Electronic Materials

Two-Phase η′ + η Region in Cu6Sn5 Intermetallic: Insight into the Order–Disorder Transition from Diffusion Couples

Christian Wieser, Werner Hügel, Alexander Walnsch, Andreas Leineweber

TMS2019 Phase Stability in Electronic Materials

Effect of Multiple Reflowing Processes on Interfacial Reactions and Mechanical Properties between Sn-9.0 wt.%Zn, Sn-3.0 wt.%Ag-0.5 wt.%Cu Solders and Ag Substrate

Chia-Yu Liu, Po-Cheng Kuo, Chih-Ming Chen, Jia-Ying Dai, Yee-Wen Yen, Alberto S. Pasana

Editorial Commentary

Thermal Interface Materials

D. D. L. Chung

Al2O3-Doped MoO3-TeO2 Glass as Anode Materials for Lithium-Ion Batteries with Long-Term Cycle Life

Jianyu Liu, Guangda Li, Tian Zheng, Yanfei Zhang, Xiangeng Meng, Zhenfeng Guo, Xiaoyun Wei

Schottky Barrier Parameters and Low-Frequency Noise Characteristics of Au/Ni Contact to n-Type β-Ga2O3

P. R. Sekhar Reddy, V. Janardhanam, Hoon-Ki Lee, Kyu-Hwan Shim, Sung-Nam Lee, V. Rajagopal Reddy, Chel-Jong Choi

Design Optimization for Maximized Thermoelectric Generator Performance

A. Narjis, C.-T. Liang, H. El Aakib, A. Tchenka, A. Outzourhit

Theoretical Study on Factors Influencing the Efficiency of D–π′–A′–π–A Isoindigo-Based Sensitizer for Dye-Sensitized Solar Cells

Sarinya Hadsadee, Vinich Promarak, Taweesak Sudyoadsuk, Tinnagon Keawin, Nawee Kungwan, Siriporn Jungsuttiwong

Enhanced Charge Transport and Corrosion Protection Properties of Polyaniline–Carbon Nanotube Composite Coatings on Mild Steel

T. Rajyalakshmi, Apsar Pasha, Syed Khasim, Mohana Lakshmi, M. V. Murugendrappa, Nacer Badi

Wafer Flatness Modeling in Chemical Mechanical Polishing

Chaoyue Zhao, Jianyong Li, Defu Yi, Baozhen Li, Jianguo Cao

Perylene Tetracarboxylic Diimide: Characterization and Its Role in the Electrical Properties of an Ag/N-BuHHPDI/PEDOT:PSS/p-Si Heterojunction Device

Muhammad Zeb, Muhammad Tahir, Fida Muhammad, Dil Nawaz Khan, Muhammad Hassan Sayyad, Suhana Mohd Said, Fazal Wahab

The Aromatic Thermosetting Copolyester for Schottky Diode Applications in a Wide Temperature Range

İkram Orak, Zakir Caldiran, Mete Bakir, Osman S. Cifci, Adem Kocyigit

Preparation and Field Emission Properties of Single-Crystal CeB6 Tips

Yixin Xiao, Xin Zhang, Hongliang Liu, Jiuxing Zhang

p-GaN/n-ZnO Nanoplate/CsPbBr3 Quantum Dots Heterojunction Light-Emitting Diode for Dual-Wavelength Emission

Chunxia Wu, Bisheng Yan, Canran Zhang, Hongxiang Zhang, Jiyuan Guo, Su Zhou, Jun Dai

Upconversion Luminescence and Optical Temperature-Sensing Properties of LaNbO4:Yb3+/Er3+ Phosphors

Xuerui Cheng, Xingbang Dong, Ke Peng, Huanjun Zhang, Yuling Su, Liying Jiang

Complementary Inverter Circuits Based on p-Cu2O and n-ZTO Thin Film Transistors

M. R. Shijeesh, Pillai Aswathy Mohan, M. K. Jayaraj

Graphene Nanoscroll Geometry Effect on Transistor Performance

Mohammad Taghi Ahmadi, Ramin Ahmadi, Truong Khang Nguyen

Growth and Thermal Characterization of TbAs Nanoparticles Grown by Inert Gas Condensation

Bo E. Tew, Yuying Zhang, Areej Shahid, Matthew R. Lewis, Chaoying Ni, Joshua M. O. Zide

Transfer of P-type to N-type Thermoelectric Properties of Ag-Sb-Te Thin Film Through Temperature Annealing and Its Electrical Power Generation

Natchanun Prainetr, Athorn Vora-ud, Mati Horprathum, Pennapa Muthitamongkol, Somporn Thaowonkaew, Theerapong Santhaveesuk, Thang Bach Phan, Tosawat Seetawan

Near-Net-Shape Fabrication of Thermoelectric Legs by Flash Sintering

Masashi Mikami, Yoshiaki Kinemuchi, Kazuya Kubo, Naoki Uchiyama, Hidetoshi Miyazaki, Yoichi Nishino

Enhancement of the Thermoelectric Properties of BiCuSeO via In Doping and Powder Size Controlling

Bo Feng, Guangqiang Li, Xiaoming Hu, Peihai Liu, Rusong Li, Yanglin Zhang, Yawei Li, Zhu He, Xi’an Fan

Enhanced Thermoelectric Performance of n-Type Polycrystalline SnSe via MoCl5 Doping

Tong Shen, Kang Yin Li, Zi Jie Chen, Hai Fei Wu, Jian Xiao Si

Synthesis of Ag Nanoparticle-Decorated ZnO Nanorods Adopting the Low-Temperature Hydrothermal Method

Kanchana Shahi, R. S. Singh, Jai Singh, Maria Aleksandrova, Ajaya Kumar Singh

Tunable Magnetoelectric Response in Cofired (Bi0.5Na0.5TiO3-Bi0.5K0.5TiO3)/CoFe2O4 Laminated Composite

Yulan Cheng, Sheng Liu, Kexiang Wei, Shuoqing Yan, Shengxiang Huang, Lianwen Deng

Correlation Between Energy Storage Density and Differential Dielectric Constant in Ferroelectrics

Yong Chen, Yi Ke Du, Yao Chang Yue, Kang Hui Liu, Ye Chen, Lu Qin, Chao Bin Jiang, Lei Zhang, Wan Qiang Cao, Rui Kun Pan

Structural, Optical and Dielectric Properties of Aluminoborosilicate Glasses

M. S. Salinigopal, N. Gopakumar, P. S. Anjana, B. SureshKumar

Enhanced Mechanical Properties of Li2O-Al2O3-SiO2 Photostructurable Glass by SrO Doping

Lei Chen, Jihua Zhang, Hongwei Chen, Libin Gao, Tianpeng Liang, Haolin Zhao, Jinyu Zhao, Xin Li

Enhancing the Properties of Spark Plasma Sintered Nanocrystalline NdFeB Magnets by the Addition of Cu-Zn Alloy and Dy2O3 Powders

Shenglong Hu, Jing Liu, Yukun Liu, Jiasheng Zhang, Hongya Yu, Kunpeng Su, Youlin Huang, Zhongwu Liu

Synthesis of Tetragonal Cu2NiSnS4 Thin Film via Low-Cost Electrodeposition Method: Effect of Ni2+ Molarity

M. Beraich, M. Taibi, A. Guenbour, A. Zarrouk, A. Bellaouchou, M. Fahoume

Effect of Heating Rate on Bulk Density and Microstructure in Bi2Te2.7Se0.3 Sintering

Chang Hyun Lee, Hyo Soon Shin, Dong Hun Yeo, Sahn Nahm

A Statistical Learning Framework for Accelerated Bandgap Prediction of Inorganic Compounds

Suryanaman Chaube, Prerna Khullar, Sriram Goverapet Srinivasan, Beena Rai

The Effect of Pr–Er Colorant on the Chroma of Dental Zirconia Ceramics

Qiang Jing, Jin-Xiao Bao, Shao-Feng Mao, Fei Ruan, Xi-Wen Song, Sheng-Li An, Yong-He Zhang

Structural, Optical and Magnetic Properties of -- and - Composites Produced by a Facile Method

Esra Kendir, Atakan Tekgül, İlker Küçük, Şerafettin Yaltkaya

Hybrid Nickel Ferrite Nanotubes Doped Polyaniline Nanocomposite and Its Dielectric Properties

R. D. Balikile, Aashish S. Roy, Ameena Parveen, G. Ramgopal, Nacer Badi

Complex Dielectric, Impedance, and Electric Modulus of CuMn2O4

S. Mohanta, I. Naik, S. D. Kaushik, S. Mukherjee, P. Patra

Humidity Robustness of Plasma-Coated PCBs

Aliakbar Khangholi, Feng Li, Kamila Piotrowska, Samir Loulidi, Rajan Ambat, Guy Van Assche, Annick Hubin, Iris De Graeve

Realization of Improved Visible Light-Mediated Photocatalytic Activity of Al2O3 Nanoparticles Through Cobalt Doping

S. Anbarasu, S. Ilangovan, K. Usharani, A. Prabhavathi, M. Suganya, M. Karthika, C. Kayathiri, S. Balamurugan, A. R. Balu

Effects of Calcining Temperature on Structure and Dielectric and Ferroelectric Properties of Sol-Gel Synthesized Ba0.85Ca0.15Zr0.1Ti0.9O3 Ceramics

X. W. Wang, B. H. Zhang, G. Feng, L. Y. Sun, Y. C. Shi, Y. C. Hu, J. Shang, S. Y. Shang, S. Q. Yin, X. E. Wang

Mitigation of Long Whisker Growth Based upon the Dynamic Recrystallization Mechanism

P. T. Vianco, D. P. Cummings, P. G. Kotula, B. M. McKenzie, L. M. Lowery, S. Williams, D. Banga

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