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Journal of Electronic Materials

Ausgabe 10/2003

Inhalt (22 Artikel)

Special Issue Paper

Foreword

Seung H. Kang, N. M. Ravindra

Special Issue Paper

Study of electron-scattering mechanism in nanoscale Cu interconnects

Choong-Un Kim, Jaeyong Park, Nancy Michael, Paul Gillespie, Rod Augur

Special Issue Paper

Electromigration failure in ultra-fine copper interconnects

Nancy L. Michael, Choong-Un Kim, Paul Gillespie, Rod Augur

Special Issue Paper

TaN-TiN binary alloys and superlattices as diffusion barriers for copper interconnects

H. Wang, A. Gupta, Ashutosh Tiwari, X. Zhang, J. Narayan

Special Issue Paper

In-situ nanoindentation of epitaxial TiN/MgO (001) in a transmission electron microscope

A. M. Minor, E. A. Stach, J. W. Morris Jr., I. Petrov

Special Issue Paper

Effect of multistep annealing on mechanical and surface properties of electroplated Cu thin films

A. K. Sikder, Ashok Kumar, P. Shukla, P. B. Zantye, M. Sanganaria

Special Issue Paper

Light emission from silicon: Some perspectives and applications

A. T. Fiory, N. M. Ravindra

Special Issue Paper

Modeling and simulation of emissivity of silicon-related materials and structures

N. M. Ravindra, Krshna Ravindra, Sundaresh Mahendra, Bhushan Sopori, Anthony T. Fiory

Special Issue Paper

Deformation and interfacial sliding in back-end interconnect structures in microelectronic devices

C. Park, I. Dutta, K. A. Peterson, J. Vella

Special Issue Paper

Formation of nickel disilicide using nickel implantation and rapid thermal annealing

Chel-Jong Choi, Sung-Young Chang, Young-Woo Ok, Tae-Yeon Seong, H. Gan, G. Z. Pan, K. N. Tu

Special Issue Paper

Properties of Bi-doped PbTe layers grown by liquid phase epitaxy under controlled Te vapor pressure

Wataru Tamura, Arata Yasuda, Ken Suto, Masasuke Hosokawa, Osamu Itoh, Jun-Ichi Nishizawa

Special Issue Paper

The impact of deep levels on the photocurrent transients in semi-insulating GaAs

M. Pavlović, B. Šantić, D. I. Desnica-Franković, N. Radić, T. Šmuc, U. V. Desnica

Special Issue Paper

Self-limiting growth of ZrO2 films on a Si(100) substrate using ZrCl4 and O2 under atmospheric pressure

Naoyuki Takahashi, Naoki Yoshii, Shinichi Nonobe, Takato Nakamura, Masayuki Yoshioka

Special Issue Paper

Plasma cleaning of the flex substrate for flip-chip bonding with anisotropic conductive adhesive film

M. A. Uddin, M. O. Alam, Y. C. Chan, H. P. Chan

Special Issue Paper

Recent progress of (Ba,Sr)TiO3 thin films for tunable microwave devices

Xinhua Zhu, Jianmin Zhu, Shunhua Zhou, Zhiguo Liu, Naiben Ming, Shengguo Lu, Helen Lai-Wah Chan, Chung-Loong Choy

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