Ausgabe 10/2005
Inhalt (13 Artikel)
Regular Issue Paper
Thermal oxidation of polycrystalline and single crystalline aluminum nitride wafers
Z. Gu, J. H. Edgar, S. A. Speakman, D. Blom, J. Perrin, J. Chaudhuri
Regular Issue Paper
Modeling of the zero-bias resistance-area product of long wavelength infrared HgCdTe-on-Si diodes fabricated from molecular beam epitaxy-grown epitaxial layers
Vishnu Gopal, Sudha Gupta
Regular Issue Paper
The correlation between stress relaxation and steady-state creep of eutectic Sn-Pb
W. H. Bang, K. H. Oh, J. P. Jung, J. W. Morris Jr., Fay Hua
Regular Issue Paper
Growth and properties of digitally-alloyed AlGaInP by solid source molecular beam epitaxy
O. Kwon, Y. Lin, J. Boeckl, S. A. Ringel
Regular Issue Paper
Roughness and texture correlation of Al films
Wenjie Zhang, Leeward Yi, Juineng Tu, Pingyi Chang, Duli Mao, Jin Wu
Regular Issue Paper
Simultaneous formation of p- and n-type ohmic contacts to 4H-SiC using the ternary Ni/Ti/Al system
S. Tsukimoto, T. Sakai, T. Onishi, Kazuhiro Ito, Masanori Murakami
Regular Issue Paper
A parametric approach for assessment of thermomechanical fatigue performance of Sn-based solder joints
K. N. Subramanian
Regular Issue Paper
The joint strength and microstructure of fluxless Au/Sn solders in InP-based laser diode packages
M. T. Sheen, Y. H. Ho, C. L. Wang, K. C. Hsieh, W. H. Cheng
Regular Issue Paper
Scanning electron microscope in-situ investigation of fracture behavior in 96.5Sn3.5Ag lead-free solder
Ying Ding, Chunqing Wang, Mingyu Li
Regular Issue Paper
Carbon-black thixotropic thermal pastes for improving thermal contacts
Chia-Ken Leong, Yasuhiro Aoyagi, D. D. L. Chung
Regular Issue Paper
A comparative study of micropipe decoration and counting in conductive and semi-insulating silicon carbide wafers
Jianwei Wan, Seung-Ho Park, Gilyong Chung, Mark Loboda
Regular Issue Paper
Growth of II-IV-V2 chalcopyrite nitrides by molecular beam epitaxy
J. E. van Nostrand, J. D. Albrecht, R. Cortez, K. D. Leedy, B. Johnson, M. J. O’keefe
Letter
Solid-state annealing behavior of two high-Pb solders, 95Pb5Sn and 90Pb10Sn, on Cu under bump metallurgy
L. N. Ramanathan, J. W. Jang, J. K. Lin, D. R. Frear