Ausgabe 12/2005
Inhalt (22 Artikel)
Foreword
David P. Field, Christopher A. Michaluk, N. M. Ravindra, Gary Rozak, H. C. Starck, Jerzy A. Szpunar
Copper bonded layers analysis and effects of copper surface conditions on bonding quality for three-dimensional integration
K. N. Chen, C. S. Tan, A. Fan, R. Reif
Influence of tungsten sputtering target density on physical vapor deposition thin film properties
Chi-Fung Lo, Peter McDonald, Darryl Draper, Paul Gilman
Measurement of angular emission trajectories for magnetron-sputtered tantalum
C. E. Wickersham Jr., Zhiguo Zhang
Structure and soft magnetic properties of Fe-Co-Ni-based multicomponent thin films
Hung-Kai Chen, Shih-Hai Li, Jenq-Gong Duh
The effects of substrate bias, substrate temperature, and pulse frequency on the microstructures of chromium nitride coatings deposited by pulsed direct current reactive magnetron sputtering
Jyh-Wei Lee, Shih-Kang Tien, Yu-Chu Kuo
Annealing textures of copper damascene interconnects for ultra-large-scale integration
Hyo Jong Lee, Heung Nam Han, Dong Nyung Lee
Effect of film thickness on the evolution of annealing texture in sputtered copper films
N. -J. Park, D. P. Field, M. M. Nowell, P. R. Besser
Influence of substrate on high-temperature behavior of copper film studied in situ by electron backscatter diffraction
Kabirkumar J. Mirpuri, Jerzy A. Szpunar
Microstructural development in asymmetric processing of tantalum plate
D. P. Field, J. M. Yanke, E. V. Mcgowan, C. A. Michaluk
Thermophysical properties of molten refractory metals measured by an electrostatic levitator
Takehiko Ishikawa, Paul-François Paradis
Microstructure evaluation and mechanical properties of nanolayered chromium nitride/tungsten nitride coating
Fan-Bean Wu, Shi-Kang Tien, Jenq-Gong Duh, Jyh-Wei Lee
Effects of process current density and temperature on electrochemical boriding of steel in molten salts
G. Kartal, S. Timur, C. Arslan
Intermetallic compound formation and morphology evolution in the 95Pb5Sn flip-chip solder joint with Ti/Cu/Ni under bump metallization during reflow soldering
Kai-Zheng Wang, Chih-Ming Chen
Evaluation of solder joint reliability in flip-chip packages during accelerated testing
Jong-Woong Kim, Dae-Gon Kim, Won Sik Hong, Seung-Boo Jung
The formation of epitaxial hexagonal boron nitride on nickel substrates
P. C. Yang, J. T. Prater, W. Liu, J. T. Glass, R. F. Davis
Reliability of In-48Sn solder/Au/Ni/Cu BGA packages during reflow process
Ja-Myeong Koo, Seung-Boo Jung
Monolayer-protected silver nano-particle-based anisotropic conductive adhesives: Enhancement of electrical and thermal properties
Yi Li, Kyoung-Sik Moon, C. P. Wong
Whisker growth on surface treatment in the pure tin plating
Kyung-Seob Kim, Wan-Ok Han, Sung-Won Han
Analytical equations for predicting the thermal properties of isotropic conductive adhesives
Masahiro Inoue, Takahiro Sugimura, Munenori Yamashita, Shunro Yamaguchi, Katsuaki Suganuma
Formation of bulk Ag3Sn intermetallic compounds in Sn-Ag lead-free solders in solidification
J. Shen, Y. C. Liu, H. X. Gao, C. Wei, Y. Q. Yang
The effect of forming gas anneal on the oxygen content in bonded copper layer
C. S. Tan, K. N. Chen, A. Fan, R. Reif