Ausgabe 12/2007
Inhalt (32 Artikel)
Microstructural Aspects of Nucleation and Growth of (In,Ga)As-GaAs(001) Islands with Low Indium Content
V.P. Kladko, V.V. Strelchuk, A.F. Kolomys, M.V. Slobodian, Yu.I. Mazur, Zh.M. Wang, Vas. P. Kunets, G.J. Salamo
Effect of Electron–Electron Interaction on Nonlinear Near-Resonance Electromagnetic Response of Quantum Dot Systems
Victor Bondarenko, Miroslaw Załużny, Yang Zhao
Biomolecule-Assisted Synthetic Route to Nanostructured Crystals: Synthesis of CdS Hierarchical Dendrites
Fengyan Sun, Qing Yang, Daoli Zhao, Yu Wu
Thermo-optical Responses of Nanoparticles: Melting of Ice and Nanocalorimetry Approach
Hugh H. Richardson, Alyssa C. Thomas, Michael T. Carlson, Martin E. Kordesch, Alexander O. Govorov
Study on the Adhesion Between Epoxy Molding Compound and Nanocone-Arrayed Pd Preplated Leadframes
Tao Hang, Huiqin Ling, Zhengji Xiu, Ming Li, Dali Mao
Ordered CdTe/CdS Arrays for High-Performance Solar Cells
David Zubía, Cesar López, Mario Rodríguez, Arev Escobedo, Sandra Oyer, Luis Romo, Scott Rogers, Stella Quiñónez, John McClure
Electrical Characterization of Defects Introduced During Sputter Deposition of Schottky Contacts on n-type Ge
F.D. Auret, S. Coelho, W.E. Meyer, C. Nyamhere, M. Hayes, J.M. Nel
The Effect of Low-Temperature Solute Elements on Nonequilibrium Eutectic Solidification of Sn-Ag Eutectic Solders
Jenn-Ming Song, Zong-Mou Wu, De-An Huang, Hsin-Yi Chuang
On the Nature of the Interface between Ag3Sn Intermetallics and Sn in Sn-3.5Ag Solder Alloys
Rajen S. Sidhu, Shantanu V. Madge, Xin Deng, Nikhilesh Chawla
Electron and Hole Capture Cross-Sections of Fe Acceptors in GaN:Fe Epitaxially Grown on Sapphire
T. Aggerstam, A. Pinos, S. Marcinkevičius, M. Linnarsson, S. Lourdudoss
Influence of Ta-based Diffusion Barriers on the Microstructure of Copper Thin Films
M. Stangl, A. Fletcher, J. Acker, H. Wendrock, K. Wetzig
Intermetallics Evolution in Sn-3.5Ag Based Lead-Free Solder Matrix on an OSP Cu Finish
Feng Gao, Hiroshi Nishikawa, Tadashi Takemoto
Influence of Bonding Temperature and Applied Load on the Bonding Integrity and Optical Performance of Face-Down Bonded Ridge-Waveguide Lasers
J.W. Ronnie Teo, Z.F. Wang, X.Q. Shi, G.Y. Li, S. Yuan
Ultraviolet Photodetection Properties of a Pt Contact on a Mg0.1Zn0.9O/ZnO Composite Film
S. Mridha, R. Ghosh, D. Basak
Superconducting and Transport Properties of (Bi-Pb)-Sr-Ca-Cu-O with Nano-Cr2O3 Additions
Kong Wei, R. Abd-Shukor
Fabrication of Cu(Ti) Alloy Interconnects with Self-Formation of Thin Barrier Metal Layers Using a High-Pressure Annealing Process
S. Tsukimoto, T. Onishi, K. Ito, M. Konno, T. Yaguchi, T. Kamino, M. Murakami
Thermal Stability of Nitride-Based Diffusion Barriers for Ohmic Contacts to n-GaN
L.F. Voss, L. Stafford, R. Khanna, B.P. Gila, C.R. Abernathy, S.J. Pearton, F. Ren, I.I. Kravchenko
Effect of Thermal Aging on Drop Performance of Chip Scale Packages with SnAgCu Solder Joints on Cu Pads
Weiqun Peng, Marco Elisio Marques
Oxidation-Induced Whisker Growth on the Surface of Sn-6.6(La, Ce) Alloy
Tung-Han Chuang, Hsiu-Jen Lin, Chih-Chien Chi
Effect of Homogenization on the Indentation Creep of Cast Lead-Free Sn-5%Sb Solder Alloy
R. Mahmudi, A. R. Geranmayeh, M. Allami, M. Bakherad
Ferrite Polymer Composite for Improving the Electromagnetic Compatibility of Semiconductor Packaging
Kyoung-sik Moon, C.P. Wong, Soo-hyung Kim, Hyung Do Choi, Seung Han, Ho Gyu Yoon, Kwang S. Suh
Evolution of Contact Resistance during the Bonding Process of NCA Flip-Chip Interconnections
H. Yu, S.G. Mhaisalkar, E.H. Wong
He Ion Implantation and the Refractive Index Depth Profile in Relaxor Ferroelectric Optical Waveguides
P.D. Moran, A. Chen, N. Tangtrakarn, M. Lawrence, S. Bakhru, H. Bakhru
Microstructure Development of Mechanical-Deformation-Induced Sn Whiskers
Shih-Kang Lin, Yuhi Yorikado, Junxiang Jiang, Keun-Soo Kim, Katsuaki Suganuma, Sinn-Wen Chen, Masanobu Tsujimoto, Isamu Yanada
Photothermal Activation of Shallow Dopants Implanted in Silicon
A.T. Fiory, A. Stevenson, A. Agarwal, N.M. Ravindra