Ausgabe 12/2014
Special Sections from the 2014 TMS Annual Meeting: Pb-free Solders and Materials for Emerging Interconnect and Packaging Technologies; Advanced Materials for Power Electronics and Power Conditioning Systems; and Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XIII. Guest Editors: Darrel Frear, Rachael Myers-Ward, Paul Ohodnicki, and Chaohong Wang
Inhalt (30 Artikel)
Wetting of Cu Pads by Bi-2.6Ag-xCu Alloys and Phase Equilibria in the Ag-Bi-Cu System
Przemyslaw Fima, Grzegorz Garzel, Anna Sypień
Effect of Grain Boundary Misorientation on Electromigration in Lead-Free Solder Joints
Amaneh Tasooji, Leticia Lara, Kyuoh Lee
Effects of Electromigration on the Creep and Thermal Fatigue Behavior of Sn58Bi Solder Joints
Yong Zuo, Limin Ma, Fu Guo, Lei Qiao, Yutian Shu, Andree Lee, K. N. Subramanian
Synchrotron Radiation Microtomography for Large Area 3D Imaging of Multilevel Microelectronic Packages
John W. Elmer, Yan Li, Holly D. Barth, Dilworth Y. Parkinson, Mario Pacheco, Deepak Goyal
Refinement of the Microstructure of Sn-Ag-Bi-In Solder, by Addition of SiC Nanoparticles, to Reduce Electromigration Damage Under High Electric Current
Youngseok Kim, Shijo Nagao, Tohru Sugahara, Katsuaki Suganuma, Minoru Ueshima, Hans-Juergen Albrecht, Klaus Wilke, Joerg Strogies
Significance of Nucleation Kinetics in Sn Whisker Formation
E. Chason, F. Pei, C. L. Briant, H. Kesari, A. F. Bower
A Study of Pb-Rich Dendrites in a Near-Eutectic 63Sn-37Pb Solder Microstructure via Laboratory-Scale Micro X-ray Computed Tomography (μXCT)
J.C.E. Mertens, J.J. Williams, Nikhilesh Chawla
Effect of Bath Life of Ni(P) on the Brittle-Fracture Behavior of Sn-3.0Ag-0.5Cu/ENIG
Wonil Seo, Kyoung-Ho Kim, Jung-Hwan Bang, Mok-Soon Kim, Sehoon Yoo
Assessment of Solder Joint Fatigue Life Under Realistic Service Conditions
Sa’d Hamasha, Younis Jaradat, Awni Qasaimeh, Mazin Obaidat, Peter Borgesen
Effects of Microstructure and Loading on Fracture of Sn-3.8Ag-0.7Cu Joints on Cu Substrates with ENIG Surface Finish
Z. Huang, P. Kumar, I. Dutta, R. Sidhu, M. Renavikar, R. Mahajan
Effect of Cr Addition on Wetting Behavior Between Cu and High-Temperature Zn-25Sn-0.15Al-0.1Ga-xCr Pb-Free Solder
Chin-Wei Liu, Kwang-Lung Lin
Mechanical Properties of Sintered Ag as a New Material for Die Bonding: Influence of the Density
V. Caccuri, X. Milhet, P. Gadaud, D. Bertheau, M. Gerland
Nanocopper Based Solder-Free Electronic Assembly
K. Schnabl, L. Wentlent, K. Mootoo, S. Khasawneh, A. A. Zinn, J. Beddow, E. Hauptfleisch, D. Blass, P. Borgesen
Effect of Board Thickness on Sn-Ag-Cu Joint Interconnect Mechanical Shock Performance
Tae-Kyu Lee, Weidong Xie
Tuning of Magnetic Properties and GMI Effect of Co-Based Amorphous Microwires by Annealing
Arcady Zhukov, Ahmed Talaat, Juan Maria Blanco, Mihail Ipatov, Valentina Zhukova
Effect of Nanocrystallization on Magnetic Properties and GMI Effect of Fe-rich Microwires
V. Zhukova, A. Talaat, M. Ipatov, J. J. del Val, L. Gonzalez-Legarreta, B. Hernando, A. Zhukov
Strongly Dipolar Polythiourea and Polyurea Dielectrics with High Electrical Breakdown, Low Loss, and High Electrical Energy Density
Shan Wu, Quinn Burlingame, Zhao-Xi Cheng, Minren Lin, Q. M. Zhang
High-Performance, Wide-Bandgap Power Electronics
Ty McNutt, Brandon Passmore, John Fraley, Brice McPherson, Robert Shaw, Kraig Olejniczak, Alex Lostetter
Polarization Effects of GaN and AlGaN: Polarization Bound Charge, Band Bending, and Electronic Surface States
Brianna S. Eller, Jialing Yang, Robert J. Nemanich
Temperature-Dependent Giant Magnetoimpedance Effect in Amorphous Soft Magnets
M. Kurniawan, R. K. Roy, A. K. Panda, D. W. Greve, P. Ohodnicki, M. E. McHenry
Experimental Determination and Thermodynamic Modeling of the Sn-Rich Corner of the Ternary Ni-Pd-Sn Phase Diagram at 250°C
Md. Arifur Rahman, Cheng En Ho, Wojciech Gierlotka, Jui Chao Kuo
Interfacial Microstructure Evolution Between Sn-Zn Solders and Ag Substrate During Solid-State Annealing
Chao-hong Wang, Po-yi Li, Kuan-ting Li
An Electroless-Ag Reflector Developed for High-Brightness White LEDs
W.C. Liu, T. Y. Chung, Y. H. Chen, C. Y. Hsiao, C. P. Lin, C. Y. Liu
Solid Liquid Interdiffusion Bonding of (Pb, Sn)Te Thermoelectric Modules with Cu Electrodes Using a Thin-Film Sn Interlayer
T. H. Chuang, H. J. Lin, C. H. Chuang, W. T. Yeh, J. D. Hwang, H. S. Chu