Ausgabe 2/2009
Inhalt (21 Artikel)
The Influence of an Imposed Current on the Creep of Sn-Ag-Cu Solder
Christopher Kinney, J.W. Morris Jr., Tae-Kyu Lee, Kuo-Chuan Liu, Jie Xue, Dave Towne
Morphology and Growth of Intermetallics at the Interface of Sn-based Solders and Cu with Different Surface Finishes
Ruihong Zhang, Fu Guo, Jianping Liu, Hao Shen, Feng Tai
The Effects of Solid-State Aging on the Intermetallic Compounds of Sn-Ag-Bi-In Solders on Cu Substrates
Albert T. Wu, Ming-Hsun Chen, Ciou-Nan Siao
An Investigation of Microstructure and Microhardness of Sn-Cu and Sn-Ag Solders as Functions of Alloy Composition and Cooling Rate
Sun-Kyoung Seo, Sung K. Kang, Da-Yuan Shih, Hyuck Mo Lee
Interfacial Reaction and Die Attach Properties of Zn-Sn High-Temperature Solders
Seongjun Kim, Keun-Soo Kim, Sun-Sik Kim, Katsuaki Suganuma
Temperature-Dependent Phase Segregation in Cu/42Sn-58Bi/Cu Reaction Couples under High Current Density
Guangchen Xu, Hongwen He, Fu Guo
Wetting Kinetics of Eutectic Lead and Lead-Free Solders: Spreading over the Cu Surface
Hui Zhao, Dinesh Reddy Nalagatla, Dusan P. Sekulic
Microstructure, Defects, and Reliability of Mixed Pb-Free/Sn-Pb Assemblies
Polina Snugovsky, Heather McCormick, Simin Bagheri, Zohreh Bagheri, Craig Hamilton, Marianne Romansky
Stability of Flip-Chip Interconnects Assembled with Al/Ni(V)/Cu-UBM and Eutectic Pb-Sn Solder During Exposure to High-Temperature Storage
J. Osenbach, A. Amin, M. Bachman, F. Baiocchi, D. Bitting, D. Crouthamel, J. DeLucca, D. Gerlach, J. Goodell, C. Peridier, M. Stahley, R. Weachock
Nature of Growth Pits in Lead Salt Epilayers Grown by Molecular Beam Epitaxy
Jiangang Ma, Donghui Li, Gang Bi, Fanghai Zhao, Shelly Elizondo, Shaibal Mukherjee, Zhisheng Shi
Effects of Ag and Al Additions on the Structure and Creep Properties of Sn-9Zn Solder Alloy
R. Mahmudi, A.R. Geranmayeh, H. Noori, M. Taghaddosi
Effects of Thermal Aging on Microstructure and Microhardness of Sn-3.7Ag-0.9Zn-1In Solder
Chen Wei, Yongchang Liu, Zhiming Gao, Jingbo Wan, Changsheng Ma
Nanoparticles of the Lead-free Solder Alloy Sn-3.0Ag-0.5Cu with Large Melting Temperature Depression
Chang Dong Zou, Yu Lai Gao, Bin Yang, Xin Zhi Xia, Qi Jie Zhai, Cristina Andersson, Johan Liu
Structural, Elastic, and Electronic Properties of Al-Cu Intermetallics from First-Principles Calculations
Wei Zhou, Lijuan Liu, Baoling Li, Qinggong Song, Ping Wu
Study of Low-Temperature Thermocompression Bonding in Ag-In Solder for Packaging Applications
Riko I Made, Chee Lip Gan, Li Ling Yan, Aibin Yu, Seung Wook Yoon, John H. Lau, Chengkuo Lee
Oxidation of Lead Frame Copper Alloys with Different Compositions and Its Effect on Oxide Film Adhesion
Xi Chen, Anmin Hu, Ming Li, Dali Mao