Ausgabe 3/2008
Inhalt (17 Artikel)
Fabrication of Strained-Si/Strained-Ge Heterostructures on Insulator
Leonardo Gomez, Michael Canonico, Meekyung Kim, Pouya Hashemi, Judy L. Hoyt
Silicidation of Ni(Yb) Film on Si(001)
Jia Luo, Yu-Long Jiang, Guo-Ping Ru, Bing-Zong Li, Paul K. Chu
Stress-Induced Grain Boundary Migration in Polycrystalline Copper
Max O. Bloomfield, Daniel N. Bentz, Timothy S. Cale
Experimental Study of Au-Pt-Sn Phase Equilibria and Thermodynamic Assessment of the Au-Pt and Au-Pt-Sn Systems
Vincent Grolier, Rainer Schmid-Fetzer
Thermodynamic Assessment of Phase Equilibria in the Sn-Ag-Ni System with Key Experimental Verification
F. Gao, C.P. Wang, X.J. Liu, K. Ishida
Microstructure and Creep Deformation of Sn-Ag-Cu-Bi/Cu Solder Joints
Min He, Sylvester N. Ekpenuma, Viola L. Acoff
Interfacial Reaction Between Cu Substrates and Zn-Al Base High-Temperature Pb-Free Solders
Yoshikazu Takaku, Lazuardi Felicia, Ikuo Ohnuma, Ryosuke Kainuma, Kiyohito Ishida
Ambient Temperature Ultrasonic Bonding of Si-Dice Using Sn-3.5wt.%Ag
Jung-Mo Kim, Jae-Pil Jung, Y. Norman Zhou, Jong-Young Kim
Energy-Based Micromechanics Analysis on Fatigue Crack Propagation Behavior in Sn-Ag Eutectic Solder
Yao Yao, Semyon Vaynman, Leon M. Keer, Morris E. Fine
Epitaxial Growth and Surface Roughness Control of Ferromagnetic Thin Films on Si by Sputter Deposition
Jianhua Joshua Yang, C.-X. Ji, Ying Yang, Hua Xiang, Y. A. Chang
Wet Etching Study of La0.67(Sr0.5Ca0.5)0.33MnO3 Films on Silicon Substrates
Joo-Hyung Kim, Alexander M. Grishin, Velislava Angelova Ignatova
The Effect of Hydrogen on the Fracture Properties of 0.8(Na1/2Bi1/2)TiO3-0.2(K1/2Bi1/2)TiO3 Ferroelectric Ceramics
H. Zhang, Y.J. Su, L.J. Qiao, W.Y. Chu, D. Wang, Y.X. Li