Ausgabe 3/2009
Inhalt (15 Artikel)
Electromigration-Induced Plasticity: Texture Correlation and Implications for Reliability Assessment
A.S. Budiman, P.R. Besser, C.S. Hau-Riege, A. Marathe, Y.-C. Joo, N. Tamura, J.R. Patel, W.D. Nix
Constraining Effects of Lead-Free Solder Joints During Stress Relaxation
Peter Zimprich, Usman Saeed, Brigitte Weiss, Herbert Ipser
In Situ Observation of Small-Scale Deformation in a Lead-Free Solder Alloy
Yong Sun, Jin Liang, Zhi-Hui Xu, Guofeng Wang, Xiaodong Li
Predicting the Drop Performance of Solder Joints by Evaluating the Elastic Strain Energy from High-Speed Ball Pull Tests
Taehoon You, Yunsung Kim, Jina Kim, Jaehong Lee, Byungwook Jung, Jungtak Moon, Heeman Choe
Inhibition of Whisker Growth on the Surface of Sn-3Ag-0.5Cu-0.5Ce Solder Alloyed with Zn
Tung-Han Chuang, Hsiu-Jen Lin
Effects of Electromigration on Interfacial Reactions in the Ni/Sn-Zn/Cu Solder Interconnect
X.F. Zhang, J.D. Guo, J.K. Shang
Physical Factors Determining Thermal Conductivities of Isotropic Conductive Adhesives
Masahiro Inoue, Hiroaki Muta, Takuji Maekawa, Shinsuke Yamanaka, Katsuaki Suganuma
Protein-Assembled Nanocrystal-Based Vertical Flash Memory Devices with Al2O3 Integration
F. Ferdousi, J. Sarkar, S. Tang, D. Shahrjerdi, T. Akyol, E. Tutuc, S.K. Banerjee
Germanium-Rich SiGe Nanowires Formed Through Oxidation of Patterned SiGe FINs on Insulator
S. Balakumar, K. D. Buddharaju, B. Tan, S. C. Rustagi, N. Singh, R. Kumar, G. Q. Lo, S. Tripathy, D. L. Kwong
Effect of pH on Structural and Electrical Properties of Electrodeposited Bi2Te3 Thin Films
Asaithambi Suresh, Krishanu Chatterjee, Vijay Kr. Sharma, Saibal Ganguly, Kajari Kargupta, Dipali Banerjee
Effect of Rapid Thermal Annealing on Sputtered CaCu3Ti4O12 Thin Films
Shih-Yuan Lin, Ying-Chung Chen, Chih-Ming Wang, Kuo-Sheng Kao, Chih-Yuan Chan
Microstructure and Characteristics of Thin-Film La0.8Sr0.2Co0.5Ni0.5O3/ZnO:Al Heterocontact CO Sensors Prepared by RF Magnetron Sputtering
Wein-Duo Yang, Yen-Hwei Chang, Chia-Chia Huang, Yu-Chung Chen