Ausgabe 4/2001
Inhalt (27 Artikel)
Evaluation of ultra-low-k dielectric materials for advanced interconnects
C. Jin, S. Lin, J. T. Wetzel
Advanced metrology for rapid characterization of the thermal mechanical properties of low-k dielectric and copper thin films
S. H. Lau, Ellie Tolentino, Yuen Lim, Evangeline Tolentino, Ann Koo
Structure and property characterization of low-k dielectric porous thin films
Barry J. Bauer, Eric K. Lin, Hae-Jeong Lee, Howard Wang, Wen-Li Wu
Synthesis and characterization of porous polymeric low dielectric constant films
Yuhuan Xu, D. W. Zheng, Yipin Tsai, K. N. Tu, Bin Zhao, Q. Z. Liu, Maureen Brongo, Chung Wo Ong, Chung Loong Choy, George T. T. Sheng, C. H. Tung
Material and process challenges in 100 nm interconnects module technology and beyond
Takayuki Ohba
Microstructural characterization of inlaid copper interconnect lines
Paul R. Besser, Ehrenfried Zschech, Werner Blum, Delrose Winter, Richard Ortega, Stewart Rose, Matt Herrick, Martin Gall, Stacye Thrasher, Mike Tiner, Brett Baker, Greg Braeckelmann, Larry Zhao, Cindy Simpson, Cristiano Capasso, Hisao Kawasaki, Elizabeth Weitzman
Microstructure examination of copper wafer bonding
Kuan-Neng Chen, Andy Fan, Rafael Reif
TiN and TaN diffusion barriers in copper interconnect technology: Towards a consistent testing methodology
Huseyin Kizil, Gusung Kim, Christoph Steinbrüchel, Bin Zhao
Spontaneous, non-aqueous electrochemical deposition of copper and palladium on Al and Al(Cu) thin films
R. Fang, H. Gu, M. J. O'Keefe, T. J. O'Keefe, W. S. Shih, K. D. Leedy, R. Cortez
Material and electrical properties of electroless Ag-W thin film
A. Inberg, Y. Shacham-Diamand, E. Rabinovich, G. Golan, N. Croitoru
Comparative study on the effect of misalignment on bordered and borderless contacts
J. S. Huang, A. S. Oates, S. H. Kang, T. L. Shofner, R. A. Ashton, Y. S. Obeng
Local Joule heating and overall resistance increase in void-containing aluminum interconnects
Y. L. Shen
Material issues in electronic interconnects and packaging
K. N. Subramanian, A. Lee, S. Choi, P. Sonje
Interactions between solder and metallization during long-term aging of advanced microelectronic packages
C. E. Ho, W. T. Chen, C. R. Kao
Stress testing of a recrystallizing CaO-B2O3-SiO2 glass-ceramic with Ag electrodes for high frequency electronic packaging
Andrew A. Shapiro, Neil Kubota, Karl Yu, Martha L. Mecartney
Influence of oxides on friction during Cu CMP
Hong Liang, Jean-Michel Martin, Richard Lee
Cu-CMP for dual damascene technology: Prestonian vs. non-prestonian regimes of Cu removal
Y. Gotkis, S. Guha
A model for wafer scale variation of removal rate in chemical mechanical polishing based on elastic pad deformation
Guanghui Fu, Abhijit Chandra
Au−Ni−Sn intermetallic phase relationships in eutectic Pb−Sn solder formed on Ni/Au metallization
H. G. Song, J. P. Ahn, A. M. Minor, J. W. Morris
Fatigue crack growth behavior in 63Sn-37Pb and 95Pb-5Sn solder materials
J. Zhao, Y. Mutoh, Y. Miyashita, T. Ogawa, A. J. McEvily
Grain growth simulation of [001] textured YBCO films grown on (001) substrates with large lattice misfit: Prediction of misorientations of the remaining boundaries
Jack W. H. Tsai, Shiun Ling, Julio C. Rodriguez, Zarina Mustapha, Siu-Wai Chan
Reduction of photoresist usage during spin coating
Fu-Chu Chou, Min-Wen Wang, Shih-Ching Gong, Zen-Gi Yang
Relaxation of InGaN thin layers observed by X-ray and transmission electron microscopy studies
Z. Liliental-Weber, M. Benamara, J. Washburn, J. Z. Domagala, J. Bak-Misiuk, E. L. Piner, J. C. Roberts, S. M. Bedair
Phase equilibria in transition metal Al-Ga-N systems and thermal stability of contacts to AlGaN
K. O. Schweitz, S. E. Mohney