Ausgabe 6/2009
Inhalt (28 Artikel)
Temperature Dependence of Epitaxial Graphene Formation on SiC(0001)
Luxmi, Shu Nie, P.J. Fisher, R.M. Feenstra, Gong Gu, Yugang Sun
Thickness Estimation of Epitaxial Graphene on SiC Using Attenuation of Substrate Raman Intensity
Shriram Shivaraman, M. V. S. Chandrashekhar, John J. Boeckl, Michael G. Spencer
Growth of Graphene-Like Structures on an Oxidized SiC Surface
Weijie Lu, W.C. Mitchel, J.J. Boeckl, Tiffany R. Crenshaw, W.E. Collins, R.P.H. Chang, L.C. Feldman
Growth and Characterization of Carbon Nanopearls on a Si Substrate by CVD Process
S. Houston, G. J. Brown, T. Murray, S. Fairchild, K. Eyink, A. Smetana
A Study of Deterministic Positioning of Carbon Nanotubes by Dielectrophoresis
A. Arun, P. Salet, A. M. Ionescu
Field Emission and Electric Discharge of Nanocrystalline Diamond Films
Bohr-Ran Huang, Shyankay Jou, Meng-Chang wu
Geometrical Characteristics and Surface Polarity of Inclined Crystallographic Planes of the Wurtzite and Zincblende Structures
Hisashi Masui, Samantha C. Cruz, Shuji Nakamura, Steven P. DenBaars
Phosphor-Concentration-Dependent Characteristics of White LEDs in Different Current Regulation Modes
Jiun Pyng You, Nguyen T. Tran, Yuan-Chang Lin, Yongzhi He, Frank G. Shi
Improved Gettering Efficiency of Ni from Nickel-Mediated Crystallization Silicon Using Phosphorus-Doped Amorphous Silicon
Bau-Ming Wang, Yewchung Sermon Wu
Improved Ni Schottky Contacts on n-Type 4H-SiC Using Thermal Processing
T. N. Oder, T. L. Sung, M. Barlow, J. R. Williams, A. C. Ahyi, T. Isaacs-Smith
Aqueous-Develop, Photosensitive Polynorbornene Dielectric: Properties and Characterization
Venmathy Rajarathinam, C. Hunter Lightsey, Tyler Osborn, Brian Knapp, Edmund Elce, Sue Ann Bidstrup Allen, Paul A. Kohl
Growth and Characterization of Zn-Incorporated Copper Oxide Films
M. Engin, F. Atay, S. Kose, V. Bilgin, I. Akyuz
Microstructure Evolution and the Constitutive Relations of High-Temperature Solders
Harry Schoeller, Shubhra Bansal, Aaron Knobloch, David Shaddock, Junghyun Cho
Nanotribological Characteristics of Cu6Sn5, Cu3Sn, and Ni3Sn4 Intermetallic Compounds
Ping-Feng Yang, Sheng-Rui Jian, Yi-Shao Lai, Rong-Sheng Chen
An Assessment of Immersion Silver Surface Finish for Lead-Free Electronics
Weiqiang Wang, Anupam Choubey, Michael H. Azarian, Michael Pecht
Viscosity and Surface Tension of Liquid Sn-Cu Lead-Free Solders
N. Zhao, X.M. Pan, D.Q. Yu, H.T. Ma, L. Wang
Comparison of Insulated with Bare Au Bonding Wire: HAZ Length, HAZ Breaking Force, and FAB Deformability
Wan Ho Song, Chunjin Hang, Andrew Pequegnat, Michael Mayer, Norman Y. Zhou, Young-Kyu Song, John Persic
Thermal Fatigue Endurance of Lead-Free Composite Solder Joints over a Temperature Range of −55°C to 150°C
Olli Nousiainen, Tero Kangasvieri, Risto Rautioaho, Jouko Vähäkangas
Effect of Stand-Off Height on Microstructure and Tensile Strength of the Cu/Sn9Zn/Cu Solder Joint
Fengshun Wu, Bo Wang, Bin Du, Bing An, Yiping Wu
Effect of Intermetallic on Electromigration and Atomic Diffusion in Cu/SnAg3.0Cu0.5/Cu Joints: Experimental and First-Principles Study
Wei Zhou, Lijuan Liu, Baoling Li, Ping Wu
Interfacial Reactions of Si Die Attachment with Zn-Sn and Au-20Sn High Temperature Lead-Free Solders on Cu Substrates
Seongjun Kim, Keun-Soo Kim, Katsuaki Suganuma, Goro Izuta
High-Speed Cyclic Bend Tests and Board-Level Drop Tests for Evaluating the Robustness of Solder Joints in Printed Circuit Board Assemblies
E.H. Wong, S.K.W. Seah, C.S. Selvanayagam, R. Rajoo, W.D. van Driel, J.F.J.M. Caers, X.J. Zhao, N. Owens, M. Leoni, L.C. Tan, Y.-S. Lai, C.-L. Yeh
Microstructural Changes of the Ag-Epoxy ICA/Sn Interface in a High-Humidity Environment
Sun Sik Kim, Keun Soo Kim, Seong Jun Kim, Katsuaki Suganuma
Evaluation of Electrochemical Migration on Flexible Printed Circuit Boards with Different Surface Finishes
Bo-In Noh, Jeong-Won Yoon, Won-Sik Hong, Seung-Boo Jung