Ausgabe 6/2011
Inhalt (19 Artikel)
Elastically Stretchable Insulation and Bilevel Metallization and Its Application in a Stretchable RLC Circuit
J. Harris, O. Graudejus, S. Wagner
Characterization and Properties of Nickel Aluminide Nanocrystals in an Alumina Layer for Nonvolatile Memory Applications
Dong-Hau Kuo, Yung-Chuan Chen, Jheng-Yu He, Jinn P. Chu
Stabilization of the Thermal Decomposition of Poly(Propylene Carbonate) Through Copper Ion Incorporation and Use in Self-Patterning
Todd J. Spencer, Yu-Chun Chen, Rajarshi Saha, Paul A. Kohl
The Effect of Doping with the Polymer Metallic Complex Poly Zinc Acrylate on Superconducting Bulk MgB2
Zili Zhang, Hongli Suo, Lin Ma, Min Liu, Teng Zhang, Meiling Zhou
Preparation and Properties of New Polyphenylene Sulfide/AlN Composites for Electronic Packaging
R. K. Goyal, P. Jadhav, A. N. Tiwari
A Study of Difference in Reflow Characteristics Between Electroplated and Sputtered Cu in a Dual-Damascene Fabrication Process for Silicon Semiconductor Devices
Takashi Onishi, Masao Mizuno, Takao Fujikawa, Tetsuya Yoshikawa, Jun Munemasa, Masataka Mizuno, Teruo Kihara, Hideki Araki, Yasuharu Shirai
Silver Nanoparticle Paste for Low-Temperature Bonding of Copper
Hani Alarifi, Anming Hu, Mustafa Yavuz, Y. Norman Zhou
Formation of Intermetallics in Sn-0.9Cu and Sn-0.7Cu-0.08Ni Solders
Tina Ventura, Young-Hee Cho, Chun Kong, Arne K. Dahle
Characterizing the Mechanical Properties of Actual SAC105, SAC305, and SAC405 Solder Joints by Digital Image Correlation
T. T. Nguyen, D. Yu, S. B. Park
Effects of Processing and Amount of Co Addition on Shear Strength and Microstructual Development in the Sn-3.0Ag-0.5Cu Solder Joint
Limin Ma, Feng Tai, Guangchen Xu, Fu Guo, Xitao Wang
Tensile and Fatigue Behavior of Al-1Si Wire Used in Wire Bonding
F. D. Danaher, J. J. Williams, D. R. P. Singh, L. Jiang, N. Chawla
Cr-Doped III–V Nitrides: Potential Candidates for Spintronics
B. Amin, S. Arif, Iftikhar Ahmad, M. Maqbool, R. Ahmad, S. Goumri-Said, K. Prisbrey
Effect of Pd Surface Roughness on the Bonding Process and High Temperature Reliability of Au Ball Bonds
Y. Huang, H. J. Kim, M. McCracken, G. Viswanathan, F. Pon, M. Mayer, Y. N. Zhou
Effects of Annealing on Structural and Electrical Properties of CuInSe2 Thin Films Prepared by Hybrid Sputtering/Evaporation Processes
Qifeng Han, Qiang Liu, Chenghong Duan, Guoping Du, Wangzhou Shi
Gettered GaP Substrates for Improved Multijunction Solar Cell Devices
K. H. Montgomery, C. R. Allen, I. H. Wildeson, J.-H. Jeon, A. K. Ramdas, J. M. Woodall
Effect of Sputtered ZnO Layers on Behavior of Thin-Film Transistors Deposited at Room Temperature in a Nonreactive Atmosphere
M. I. Medina-Montes, S. H. Lee, M. Pérez, L. A. Baldenegro-Pérez, M. A. Quevedo-López, B. Gnade, R. Ramírez-Bon
Improved Electrical Performance and Reliability of Poly-Si TFTs Fabricated by Drive-In Nickel-Induced Crystallization with Chemical Oxide Layer
Ming-Hui Lai, YewChung Sermon Wu, Chih-Pang Chang