Ausgabe 7/2007
Inhalt (18 Artikel)
Nanostructured Thermoelectric Materials and High-Efficiency Power-Generation Modules
Timothy P. Hogan, Adam Downey, Jarrod Short, Jonathan D’Angelo, Chun-I Wu, Eric Quarez, John Androulakis, Pierre F.P. Poudeu, Joseph R. Sootsman, Duck-Young Chung, Mercouri G. Kanatzidis, S.D. Mahanti, Edward J. Timm, Harold Schock, Fei Ren, Jason Johnson, Eldon D. Case
Synthesis and Thermoelectric Properties of “Nano-Engineered” CoSb3 Skutterudite Materials
P.N. Alboni, X. Ji, J. He, N. Gothard, J. Hubbard, Terry M. Tritt
Development and Evolution of Nanostructure in Bulk Thermoelectric Pb-Te-Sb Alloys
Teruyuki Ikeda, Vilupanur A. Ravi, Lauren A. Collins, Sossina M. Haile, G. Jeffrey Snyder
Solution-Chemical Syntheses of Nano-Structured Bi2Te3 and PbTe Thermoelectric Materials
X. Ji, B. Zhang, T.M. Tritt, J.W. Kolis, A. Kumbhar
Thermoelectric Properties of Mo3Sb5.4Te1.6 and Ni0.06Mo3Sb5.4Te1.6
Huqin Zhang, Jian He, Bo Zhang, Zhe Su, Terry M. Tritt, Navid Soheilnia, Holger Kleinke
Thermoelectric Properties of Half-Heusler Bismuthides ZrCo1−x Ni x Bi (x = 0.0 to 0.1)
V. Ponnambalam, Bo Zhang, Terry M. Tritt, S. Joseph Poon
Thermoelectric Properties of Na x CoO2 and Prospects for Other Oxide Thermoelectrics
D.J. Singh, D. Kasinathan
Crystal Growth, Structure, and Stoichiometry of the Superconducting Pyrochlore Cd2Re2O7
J. He, R. Jin, B.C. Chakoumakos, J.S. Gardner, D. Mandrus, Terry M. Tritt
Thermoelectric Properties of NaCo2–x Fe x O y
Biprodas Dutta, Jugdersuren Battogtokh, David Mckewon, Igor Vidensky, Neilanjan Dutta, Ian L. Pegg
Electromigration in the Flip Chip Solder Joint of Sn-8Zn-3Bi on Copper Pads
W.H. Lin, Albert T. Wu, S.Z. Lin, T.H. Chuang, K.N. Tu
Effects of Copper Doping on Microstructural Evolution in Eutectic SnBi Solder Stripes under Annealing and Current Stressing
Chih-Ming Chen, Chih-Chieh Huang, Chien-Neng Liao, Kuen-Ming Liou
Properties of Sn3.8Ag0.7Cu Solder Alloy with Trace Rare Earth Element Y Additions
H. Hao, J. Tian, Y.W. Shi, Y.P. Lei, Z.D. Xia
Failure Mechanisms and Crack Propagation Paths in Thermally Aged Pb-Free Solder Interconnects
Eduardo Franco De Monlevade, Weiqun Peng
The Role of TiO2 in Ceramic Bulk Interference Suppressing Resistor Integrated with Car Spark Plug
Ewa Klimiec, Stanisław Nowak, Wiesław Zaraska, Jerzy Stoch
Improved Schottky Contacts on n-Type 4H-SiC Using ZrB2 Deposited at High Temperatures
T.N. Oder, P. Martin, A.V. Adedeji, T. Isaacs-Smith, J.R. Williams
Optical Characterization of Ag Nanoparticles Embedded in Aluminophosphate Glass
J.A. Jiménez, S. Lysenko, G. Zhang, H. Liu