Ausgabe 9/2004
Inhalt (17 Artikel)
Microstructure and mechanical properties of annealed Al-1%Si bonding wire
Yanqing Liu, W. Kinzy Jones
Thermodynamic assessment of the Sn-Co lead-free solder system
Libin Liu, Cristina Andersson, Johan Liu
Selective formation of intermetallic compounds in Sn-20In-0.8Cu ball grid array solder joints with Au/Ni surface finishes
Hsing-Fei Wu, Ming-Jui Chiang, Tung-Han Chuang
Residual stress and interfacial reaction of the electroplated Ni-Cu alloy under bump metallurgy in the flip-chip solder joint
S. -H. Kim, J. -Y. Kim, J. Yu, T. Y. Lee
Development of creep-resistant, nanosized Ag particle-reinforced Sn-Pb composite solders
J. P. Liu, F. Guo, Y. F. Yan, W. B. Wang, Y. W. Shi
Constitutive relations on creep for SnAgCuRE lead-free solder joints
Zhigang Chen, Yaowu Shi, Zhidong Xia
Mesa-size dependence characteristics of vertical surface-emitting lasers
N. C. Das, W. Chang
Study of immersion silver and tin printed-circuit-board surface finishes in lead-free solder applications
Minna Arra, Dongkai Shangguan, Dongji Xie, Janne Sundelin, Toivo Lepistö, Eero Ristolainen
Solid-state intermetallic compound layer growth between copper and 95.5Sn-3.9Ag-0.6Cu solder
Paul T. Vianco, Jerome A. Rejent, Paul F. Hlava
In-situ cleaning and passivation of oxidized Cu surfaces by alkanethiols and its application to wire bonding
Caroline M. Whelan, Michael Kinsella, Hong Meng Ho, Karen Maex
High-resistivity GaSb bulk crystals grown by the vertical bridgman method
R. Pino, Y. Ko, P. S. Dutta
The electrical properties and stability of the hafnium silicate/Si0.8Ge0.2(100) interface
S. Addepalli, P. Sivasubramani, M. J. Kim, B. E. Gnade, R. M. Wallace
Impact of carbon concentration on the interface density of states of metal-oxide Si1−x−y GexCy (strained) capacitors
A. Cuadras, B. Garrido, J. R. Morante, L. Fonseca, K. Pressel, B. Tillack, T. Grabolla
Effect of bump characteristics and temperature variation on the online contact resistance of anisotropic conductive joints
Lafir Ali, Y. C. Chan, M. O. Alam
Study of schottky barrier heights of indium-tin-oxide on p-GaN using x-ray photoelectron spectroscopy and current-voltage measurements
Yow-Jon Lin, Chou-Wei Hsu
Characterization and modeling of static and cyclic relaxation in nonconductive adhesives
M. Gunawan, E. H. Wong, S. G. Mhaisalkar, L. T. Davila, Yu Hong, J. F. J. M. Caers, T. K. Tsai
Effect of adding Sb on microstructure and adhesive strength of Sn-Ag solder joints
Hwa-Teng Lee, Ming-Hung Chen, Huei-Mei Jao, Chin-Jui Hsu