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Journal of Electronic Materials

Ausgabe 9/2009

Inhalt (28 Artikel)

Open Access

Intermetallic Reaction of Indium and Silver in an Electroplating Process

Pin J. Wang, Jong S. Kim, Chin C. Lee

Constitutive Relations for Creep in a SnCu-Based Composite Solder Reinforced with Ag Particles

Yaowu Shi, Yanfu Yan, Jianping Liu, Zhidong Xia, Yongping Lei, Fu Guo, Xiaoyan Li

A Novel Mechanism of Embrittlement Affecting the Impact Reliability of Tin-Based Lead-Free Solder Joints

Konstantina Lambrinou, Wout Maurissen, Paresh Limaye, Bart Vandevelde, Bert Verlinden, Ingrid De Wolf

Fracture Mechanics of Solder Bumps During Ball Shear Testing: Effect of Bump Size

Woong Ho Bang, Choong-Un Kim, Suk Hoon Kang, Kyu Hwan Oh

Study of Solidification Cracks in Sn-Ag-Cu Lead-Free Solder Joints

Wenxing Dong, Yaowu Shi, Yongping Lei, Zhidong Xia, Fu Guo

Rutherford Backscattering Spectrometry Analysis of Self-Formed Ti-Rich Interface Layer Growth in Cu(Ti)/Low-k Samples

Kazuyuki Kohama, Kazuhiro Ito, Kenichi Mori, Kazuyoshi Maekawa, Yasuharu Shirai, Masanori Murakami

Open Access

Amorphization and Solid-Phase Epitaxial Growth of C-Cluster Ion-Implanted Si

N.G. Rudawski, L.R. Whidden, V. Craciun, K.S. Jones

Comparative Study on MOCVD Growth of a-Plane GaN Films on r-Plane Sapphire Substrates Using GaN, AlGaN, and AlN Buffer Layers

J. N. Dai, Z. H. Wu, C. H. Yu, Q. Zhang, Y. Q. Sun, Y. K. Xiong, X. Y. Han, L. Z. Tong, Q. H. He, F. A. Ponce, C. Q. Chen

Interband Cascade Lasers with Wavelengths Spanning 3.2–4.2 μm

C. L. Canedy, J. R. Lindle, W. W. Bewley, C. S. Kim, M. Kim, J. A. Nolde, I. Vurgaftman, J. R. Meyer

Edge-Emitting Lead Salt Mid-Infrared Laser Structure on BaF2 (110) Substrate

D. Li, S. Mukherjee, J. Ma, G. Bi, D. Ray, F. Zhao, S.L. Elizondo, G. Yu, Z. Shi

p-Type PbTe Thermoelectric Bulk Materials with Nanograins Fabricated by Attrition Milling and Spark Plasma Sintering

Chia-Hung Kuo, Ming-Shan Jeng, Jie-Ren Ku, Shih-Kuo Wu, Ya-Wen Chou, Chii-Shyang Hwang

Two Layer Surface Exfoliation on Si3N4/Si by Sequential Implantation of He and H Ions

Mengkai Li, Zhuo Wang, Changlong Liu, Junqi Liao, Yanyan Shen, Lili Zhang, Bing Yuan

Synthesis and Characterization of Naphthalene End-Capped Divinylbenzene for OTFT

Sung Jin Park, Sul Ong Kim, Sung Ouk Jung, Mi-Hye Yi, Yun-Hi Kim, Soon-Ki Kwon

Femtosecond Laser Drilling of Alumina Wafers

Chengde Li, Seongkuk Lee, Suwas Nikumb

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