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Journal of Electronic Materials

Ausgabe 9/2011

Inhalt (22 Artikel)

Correlation Between Sn Grain Orientation and Corrosion in Sn-Ag-Cu Solder Interconnects

Tae-Kyu Lee, Bo Liu, Bite Zhou, Thomas Bieler, Kuo-Chuan Liu

Effect of Gold on the Corrosion Behavior of an Electroless Nickel/Immersion Gold Surface Finish

Q. V. Bui, N. D. Nam, J. W. Yoon, D. H. Choi, A. Kar, J. G. Kim, S. B. Jung

Reaction of Liquid Sn-Ag-Cu-Ce Solders with Solid Copper

J. Chriaštel’ová, L. Rízeková Trnková, K. Pocisková Dimová, M. Ožvold

Tin Whisker Growth on NdSn3 Powder

Hong-Chang Shi, Ai-Ping Xian

Calculation of the Thermoelectric Power of Vanadium, Niobium, and Tantalum

Horst Brodowsky, Qiyuan Chen, Zhongliang Xiao, Zhoulan Yin

Effects of Thermal Annealing on the Formation of Buried β-SiC by Ion Implantation

P. R. Poudel, B. Rout, D. R. Diercks, J. A. Paramo, Y. M. Strzhemechny, F. D. Mcdaniel

Synthesis and Characterization of SrFe11.2Zn0.8O19 Nanoparticles for Enhanced Microwave Absorption

Sachin Tyagi, Himanshu B. Baskey, Ramesh Chandra Agarwala, Vijaya Agarwala, Trilok Chand Shami

Hybrid Inorganic–Organic Heterojunction Solar Cell

Shaker Ebrahim, Moataz Soliman, Tarek M. Abdel-Fattah

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