Ausgabe 9/2011
Inhalt (22 Artikel)
A Diffuse Interface Model of Intermediate-Phase Growth Under the Influence of Electromigration
Peng Zhou, William C. Johnson
A Sharp Interface Model of Intermediate-Phase Growth Under the Influence of Electromigration
Peng Zhou, William C. Johnson, Perry H. Leo
Characterization and Electrochemical Mechanism for Bromide-Containing Conductive Anodic Filament (CAF) Failure
Antonio Caputo, Laura J. Turbini, Doug D. Perovic
Correlation Between Sn Grain Orientation and Corrosion in Sn-Ag-Cu Solder Interconnects
Tae-Kyu Lee, Bo Liu, Bite Zhou, Thomas Bieler, Kuo-Chuan Liu
Effects of Cooling Rate and Composition on Mechanical Properties of Directionally Solidified Pb100−x -Sn x Solders
E. Çadirli, H. Kaya, M. Şahin
Effects of Joining Sequence on the Interfacial Reactions and Substrate Dissolution Behaviors in Ni/Solder/Cu Joints
Chao Sheng Liu, Cheng En Ho, Cheng Sam Peng, C. Robert Kao
Evaluation of Electrochemical Migration on Printed Circuit Boards with Lead-Free and Tin-Lead Solder
Xiaofei He, Michael H. Azarian, Michael G. Pecht
Effect of Gold on the Corrosion Behavior of an Electroless Nickel/Immersion Gold Surface Finish
Q. V. Bui, N. D. Nam, J. W. Yoon, D. H. Choi, A. Kar, J. G. Kim, S. B. Jung
Electromigration in a Sn-3 wt.%Ag-0.5 wt.%Cu-3 wt.%Bi Solder Stripe Between Two Cu Electrodes Under Current Stressing
Shang-Hua Lee, Chih-Ming Chen
Comparative Study of ENIG and ENEPIG as Surface Finishes for a Sn-Ag-Cu Solder Joint
Jeong-Won Yoon, Bo-In Noh, Seung-Boo Jung
Reaction of Liquid Sn-Ag-Cu-Ce Solders with Solid Copper
J. Chriaštel’ová, L. Rízeková Trnková, K. Pocisková Dimová, M. Ožvold
Impact of Isothermal Aging on Long-Term Reliability of Fine-Pitch Ball Grid Array Packages with Sn-Ag-Cu Solder Interconnects: Die Size Effects
Tae-Kyu Lee, Weidong Xie, Bite Zhou, Thomas Bieler, Kuo-Chuan Liu
Calculation of the Thermoelectric Power of Vanadium, Niobium, and Tantalum
Horst Brodowsky, Qiyuan Chen, Zhongliang Xiao, Zhoulan Yin
Enhancement of the Stability of Ti and Ni Ohmic Contacts to 4H-SiC with a Stable Protective Coating for Harsh Environment Applications
Walter Daves, Andreas Krauss, Volker Häublein, Anton J. Bauer, Lothar Frey
Effects of Thermal Annealing on the Formation of Buried β-SiC by Ion Implantation
P. R. Poudel, B. Rout, D. R. Diercks, J. A. Paramo, Y. M. Strzhemechny, F. D. Mcdaniel
Synthesis and Characterization of SrFe11.2Zn0.8O19 Nanoparticles for Enhanced Microwave Absorption
Sachin Tyagi, Himanshu B. Baskey, Ramesh Chandra Agarwala, Vijaya Agarwala, Trilok Chand Shami
Photoluminescence and Raman Spectroscopy of Polycrystalline ZnO Nanofibers Deposited by Electrospinning
Banani Sen, Michael Stroscio, Mitra Dutta
Synthesis and Characterization of Polythiophene/Bi2Te3 Nanocomposite Thermoelectric Material
W. Q. Ao, L. Wang, J. Q. Li, Fred Pan, C. N. Wu
Hybrid Inorganic–Organic Heterojunction Solar Cell
Shaker Ebrahim, Moataz Soliman, Tarek M. Abdel-Fattah