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Journal of Materials Science: Materials in Electronics

Ausgabe 10/2007

Inhalt (15 Artikel)

Structural and electrical properties of Ba(Fe1/3Nb1/3Ta1/3)O3 perovskite

Mallikarjun Chickpatil, Girija M. Chitgopikar, Ravindra L. Raibagkar

Copper nitride films deposited by dc reactive magnetron sputtering

K. Venkata Subba Reddy, A. Sivasankar Reddy, P. Sreedhara Reddy, S. Uthanna

The size effect in current–voltage characteristic of VO2-based ceramics in the on-state

A. I. Ivon, I. M. Chernenko, V. R. Kolbunov, L. A. Mozharovsky

Studies on electrosynthesized zinc mercury selenide alloys

Hosun Moon, A. Kathalingam, Thaiyan Mahalingam, J. P. Chu, Yong Deak Kim

High transmittance–low resistivity cadmium oxide films grown by reactive pulsed laser deposition

Raid A. Ismail, Bassam G. Rasheed, Evan T. Salm, Mukram Al-Hadethy

A new binderless thick-film piezoelectric paste

Darryl P. J. Cotton, Paul H. Chappell, Andy Cranny, Neil M. White

Structural and magnetic studies of CTAC-assisted NiZn ferrite films by spray deposition

Rongzhou Gong, Xiang Shen, Zekun Feng, Haifeng Li, Xian Wang, Huahui He

Direct robust bonding between Sn-based solder and Si substrate

D. Q. Yu, C. M. L. Wu, Y. W. Wong, J. K. L. Lai

Room-temperature indentation creep of lead-free Sn–Bi solder alloys

R. Mahmudi, A. R. Geranmayeh, S. R. Mahmoodi, A. Khalatbari

Stress reduction during phase change in Ge2Sb2Te5 by capping TiN film

Young Sam Park, Sang Ouk Ryu, Kyu Jeong Choi, Seung Yun Lee, Sung Min Yoon, Byoung Gon Yu

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