Ausgabe 9/2005
Inhalt (7 Artikel)
Electrical properties of stacked CuInSe2 thin films
A. Ashour, A. A. Akl, A. A. Ramadan, K. Abd EL-Hady
Correlation between the interfacial reaction and mechanical joint strength of the flip chip solder bump during isothermal aging
Dae-Gon Kim, Hyung-Sun Jang, Jong-Woong Kim, Seung-Boo Jung
The influence of temperature hysteresis at metal-semiconductor phase transition on current-voltage characteristic of VO2–based ceramics
A. I. Ivon, V. R. Kolbunov, I. M. Chernenko
Structures and dielectric properties of La/Sn co-substituted Ba4Nd2{T}i4Ta6O30 ceramics
X. H. Zheng, X. M. Chen, T. Wang
Semi-abrasive free slurry with acid colloidal silica for copper chemical mechanical planarization
Nam-Hoon Kim, Jong-Heun Lim, Sang-Yong Kim, Eui-Goo Chang