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High aspect ratio structures obtained by electroforming in microstructured glass

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Abstract

 The application of glass in the microsystems technology becomes more and more important. Therefore, it is necessary to combine special microstructurable glasses with various other materials (e.g. joining with silicon by anodic bonding, joining with metals by electroforming, joining with polymers by glueing, joining with various other glasses by brazing or diffusion welding).

In order to increase the use of glass in the microsystems technology especially four fields of research are important:

–development of special glasses with various properties

–technologies of microstructuring

–technologies of joining

–application

These four topics are main research fields performed at the Institute of Glass/Ceramics-Technology and will be described in this paper.

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Authors and Affiliations

  1. Technical University of Ilmenau, Institute of Glass/Ceramics-Technology, Gustav-Kirchhoff-Str. 1, D-98693 Ilmenau, Germany, , , , , , DE

    D. Hülsenberg, A. Harnisch, M. May & B. Straube

  2. Technical University of Ilmenau, Institute of Materials, Gustav-Kirchhoff-Str. 1, D-98693 Ilmenau, Germany, , , , , , DE

    C. Jakob

Authors
  1. D. Hülsenberg
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  2. A. Harnisch
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  3. C. Jakob
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  4. M. May
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  5. B. Straube
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Additional information

Received: 30 October 1995 / Accepted: 12 January 1996

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Hülsenberg, D., Harnisch, A., Jakob, C. et al. High aspect ratio structures obtained by electroforming in microstructured glass. Microsystem Technologies 2, 109–113 (1996). https://doi.org/10.1007/s005420050025

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  • DOI: https://doi.org/10.1007/s005420050025

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