Abstract
Polyimides (PIs) with various molecular weights synthesized via the reaction of aromatic diamine monomer containing tert-butyl groups with aromatic dianhydride were highly soluble in common organic solvents and some epoxy resins at room temperature. These PIs can be incorporated in the absence of organic solvent into epoxy resin E51 with the loading below 2 wt% forming EP-PI composites. No phase separation is observed by SEM on cryogenically fractured surfaces of EP-PI composites. The PI can improve mechanical properties, especially impact strength. Adding 2 wt% PI-1.5W, the impact strength reaches to 55 kJ/m2 with the increase in tensile and flexural strengths by 14% and 3%, respectively. SEM analyses for the fracture surface suggest that PI reduces the crosslink density, improves the plasticity of epoxy resin and changes the mode of fracture from fragile to ductile. Moreover, the glass transition temperature of EP-PI composites was found to increase to a significant extent.
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Zhao, L.Y., Guan, J.G. and Ma, H.R., Chinese J. Polym. Sci., 2010, 28(6): 961
Zhang, J.N., Deng, S.Q., Wang, Y.L., Ye, L. and Zhou, L.M., Compos. Part A: Appl. Sci. Manuf., 2013, 55: 35
Duan, J.K., Kim, C. and Jiang, P.K., Chinese J. Polym. Sci., 2009, 27(4): 569
Sahoo, S.K., Mohanty, S. and Nayak, S.K., Chinese J. Polym. Sci., 2015, 33(1): 137
Ruijun, G., Mohini, S. and Samir, K., J. Mater. Sci., 2014, 49(8): 3125
Lakouraj, M.M., Rahpaima, G. and Zare, E.N., Chinese J. Polym. Sci., 2014, 32(11): 1489
TRío, G., Rodríguez, J. and Pearson, R.A., Compos. Part B: Eng., 2014; 57: 173
Ismail, H., Galpaya, D. and Ahmad, Z., Polym. Test., 2009, 28(4): 363
Francis, B., Thomas, S., Viswanathan A., Ramaswamy, G., Jose, R.S. and Rao, V.L., J. Polym. Sci., Part B: Polym. Phys., 2006, 44: 541
Alessi, S., Conduruta, D., Pitarresi, G., Dispenza, C. and Spadaro, G., Polym. Degrad. Stab., 2011, 96(4): 642
Li, X., Kang, H., Shen, J.X., Zhang, L.Q., Nishi, T. and Ito, K., Chinese J. Polym. Sci., 2015, 33(3): 433
Bakar, M., Molenda, A. and Piasek, J.J., J. Macromol. Sci. Phys., 2012, 51(6): 1159
Alessi, S., Conduruta, D., Pitarresi, G., Dispenza, C. and Spadaro, G., Polym. Degrad. Stab., 2010, 95(4): 677
Lin, C.H., Chen, J.C., Huang, C.M., Jehng, J.M., Chang, H.C., Juang, T.Y. and Su, W.C., Polymer, 2013, 54: 6936
Li, Z.M., Zhang, G., Li, D.S. and Yang, J., Chinese J. Polym. Sci., 2014, 32(3): 292
Xia, J.H., Jiang, Y., Gong, S.M., Sun, Z. and Wang, Y.H., Chinese J. Polym. Sci., 2014, 32(12): 1610
Chen, F.H., Sun, T.C., Hong, S., Meng, K. and Han, C.C., Macromolecules, 2008, 41(20): 7469
Agag, T. and Takeichi, T., Polymer, 1999, 40(23): 6557
Francis, B., Thomas, S., Sadhana, R., Thuaus, N., Ramaswamy, R., Jose, S. and Lakshmanarao. V., J. Polym. Sci., Part B: Polym. Phys., 2007, DOI: 10.1002/polb.21238.
Huang, W., Yan, D.Y. and Lu, Q.H., J. Polym. Sci., Part A: Polym. Chem., 2002, 40(2): 229
Francis, B., Thomas, S., Jose, J., Ramaswamy, R. and Rao, V.L., Polymer, 2005, 46: 12372
Kissinger, H.E., Anal. Chem., 1957, 29(12): 1702
Ozawa, T., Bull. Chem. Soc. Jpn., 1965, 38: 1881
Crane, L.W., Dynes, P.J. and Kaelble, D.H., J. Polym. Sci. Polym. Lett. Ed., 1973, 11: 533
Tang, L.C., Wan, Y.J., Peng, K., Pei, Y.B., Wu, L.B., Chen, L.M., Shu, L.J., Jiang, J.X. and Lai, G.Q., Compos. Part A: Appl. Sci. Manuf., 2013, 45: 95
Jason J.G., Zhang, D., Li, Q., Hou, H.Q., Graham, M.J., Dai, L.M., Harris, F.W. and Cheng, S.Z.D., J. Am. Chem. Soc. 2005, 127: 9984
Verker, R., Grossman, E. and Eliaz, N., Acta. Materialia., 2009, 57: 1112
Gaw, K.O. and Kakimoto, M., Adv. Polym. Sci., 1999, 140: 109
Huang, W., “Preparation and characterization of aromatic polyimides with pendent tert-butyl group”, Thesis, Shanghai Jiao Tong University, 2002
Liu, Y., Wu, W., Chen, Y., Shi, P.P., Liu, M.C. and Wu, X., J. Appl. Polym. Sci., 2013, 127(4): 3213
Hossein, Y., Morteza, E., Hamed, V.T. and Ehsan, R.M., Prog. Org. Coat., 2013, 76(1): 286
Tang, L.C., Zhang, H., Stephan, S., Ye, L. and Zhang, Z., Compos. Sci. Technol., 2012, 72(5): 558
Ma, H.Y., Wei, G.S., Li, Y.Q. and Zhang, X.H., Polymer, 2005, 46(23): 10568
Danny, V., Zach, R. and Michael, R.K., Polymer, 2014, 55(7): 1854
Russell, J.V., David, A.C. and Chun, H.W., Macromol. Mater. Eng., 2013, 298: 1232
Tang, L.C., Wang, X., Wan, Y.J., Wu, L.B. and Lai, G.Q., Mater. Chem. Phys., 2013, 141(1): 333
Hill, L.W., Paint and Coating Testing Manual, Gardner-Sward Handbook, 1995, 46: 534
Mohamed, A., Derric, D., David, A. and Elijiah, N., Polymer, 2007, 48(19): 5662
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Electronic Supplementary Material Supplementary material is available in the online version of this article at http://dx.doi.org/10.1007/s10118-015-1685-0.
This work was financially supported by the Shanghai key R&D Program ( No. DZ1100105).
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Zhao, Q., Wang, Xy. & Hu, Yh. The application of highly soluble amine-terminated aromatic polyimides with pendent tert-butyl groups as a tougher for epoxy resin. Chin J Polym Sci 33, 1359–1372 (2015). https://doi.org/10.1007/s10118-015-1685-0
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DOI: https://doi.org/10.1007/s10118-015-1685-0