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Towards a methodology for analysis of interconnect structures for 3D-integration of micro systems

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Abstract

Functional aspects as well as the influence of integration technology on the system behavior have to be considered in the 3D integration design process of micro systems. Therefore, information from different physical domains has to be provided to designers. Due to the variety of structures and effects of different physical domains, efficient modeling approaches and simulation algorithms have to be combined. The article describes a modular approach which covers detailed analysis with PDE solvers and model generation for system level simulation.

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Acknowledgements

We would like to express our sincere appreciation to our colleagues at Fraunhofer IZM in Munich and Berlin, especially Josef Weber, Peter Ramm and Eberhard Kaulfersch, and our colleagues at Infineon, Philips and NXP for the highly effective cooperation. This article is partly based on the project e-CUBES which is supported by the European Commission under support-no. IST-026461. The authors of this article are solely responsible for its content.

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  1. Fraunhofer Institute for Integrated Circuits, Branch Lab Design Automation, Dresden, Germany

    Peter Schneider, Sven Reitz, Andreas Wilde, Günter Elst & Peter Schwarz

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  1. Peter Schneider
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  2. Sven Reitz
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  3. Andreas Wilde
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  4. Günter Elst
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  5. Peter Schwarz
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Correspondence to Sven Reitz.

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Schneider, P., Reitz, S., Wilde, A. et al. Towards a methodology for analysis of interconnect structures for 3D-integration of micro systems. Analog Integr Circ Sig Process 57, 205–211 (2008). https://doi.org/10.1007/s10470-008-9143-3

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  • DOI: https://doi.org/10.1007/s10470-008-9143-3

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