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Ag3Sn plate formation in the solidification of near-ternary eutectic Sn-Ag-Cu

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Abstract

Near-ternary eutectic Sn-Ag-Cu alloys are leading lead-free candidate solders for various applications. These alloys yield three phases upon solidification: β-Sn,Ag3Sn, and Cu6Sn5. Large, plate-like, pro-eutectic Ag3Sn structures can grow rapidly within the liquid phase, potentially adversely affecting the mechanical behavior and reducing the fatigue life of solder joints. This article reports on the formation of such plates in Sn-Ag-Cu solder balls and joints and demonstrates how large Ag3Sn plate formation can be minimized.

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Author information

Authors and Affiliations

  1. IBM T.J. Watson Research Center in Yorktown Heights, USA

    Sung K. Kang & Da-Yuan Shih

  2. IBM Corporation in Endicott, USA

    NY. Donald, W. Henderson, Timothy Gosselin & Amit Sarkhel

  3. IBM Corporation in Hopewell Junction, NY

    NY. Charles Goldsmith & Karl J. Puttlitz

  4. Samsung Advanced Institute of Technology, Suwon, Korea

    Won Kyoung Choi

Authors
  1. Sung K. Kang
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  2. Da-Yuan Shih
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  3. NY. Donald
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  4. W. Henderson
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  5. Timothy Gosselin
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  6. Amit Sarkhel
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  7. NY. Charles Goldsmith
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  8. Karl J. Puttlitz
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  9. Won Kyoung Choi
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Additional information

For more information, contact S.K. Kang, IBM T.J. Watson Research Center, P.O. Box 218, Yorktown Heights, New York 10598; (914) 945-3932; fax (914) 945-2141; e-mail kang@us.ibm.com.

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Kang, S.K., Shih, DY., Donald, N. et al. Ag3Sn plate formation in the solidification of near-ternary eutectic Sn-Ag-Cu. JOM 55, 61–65 (2003). https://doi.org/10.1007/s11837-003-0143-6

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  • DOI: https://doi.org/10.1007/s11837-003-0143-6

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