Abstract
Ternary Bi-31.5Sn-25.0In solder has been proposed and studied for application in temperature-sensitive electronic components. In a Bi-31.5Sn- 25.0In solder joint, In was detected in an intermetallic compound (IMC) layer formed at the solder/Cu substrate interface with a thickness of 4.8 μm. The microstructure of the bulk solder consisted of Sn-rich phases distributed in Bi-rich phases with dispersion of In in both phases. Meanwhile, the nanomechanical properties of the Bi-31.5Sn-25.0In solder showed great strain rate sensitivity. To be specific, hardness increased from 9.91 MPa to 56.84 MPa as the strain rate increased in the range of (0.0005-0.125) s−1. The strain-rate sensitivity exponent (m) was found to be 0.28, indicating that the excellent ductility was shown for the solder tested under the present conditions.
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Nguyen, V.L., Kim, S.H., Jeong, J.W. et al. Microstructure and mechanical behavior of low-melting point Bi-Sn-In solder joints. Electron. Mater. Lett. 13, 420–426 (2017). https://doi.org/10.1007/s13391-017-1614-1
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DOI: https://doi.org/10.1007/s13391-017-1614-1