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Nanowires in Electronics Packaging

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Nanopackaging

Abstract

In the light of continuous miniaturization of traditional microelectronic components, the demand for decreasing wire diameters becomes immediately evident. The observation of metallic conductor properties for certain configurations of carbon nanotubes (CNT) and their current carrying capability [1] set the minimal diameter of a true wire to about 3 nm (compare Chap. 15). Investigations are in progress even below that diameter on nanocontacts, formed by single metal atoms, i.e., quantum wires. Quantum wires can be produced by mechanical wire breaking [2], its combination with etching and deposition [3], or other techniques. The properties of quantum wires are only about to be understood theoretically [4]. Doubtless, they are worth considering for packaging solutions in molecular electronics to come [5]. In this chapter, we focus on metal wires and rods in the size range above 10 nm up to submicron diameters, evaluated already to be attractive for microelectronic packaging purposes. Techniques to generate, to characterize, and to handle them, as well as their interaction with electromagnetic fields will be useful for packaging applications in the age of nanotechnology. With the wealth of information available, this review focuses on general trends and starting points for deeper study. Although the cited references are representative, they cannot be complete, since numerous activities are ongoing to produce and to characterize new kinds of wire-like geometries from different materials.

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Authors and Affiliations

  1. Department of Module Integration and Board Interconnection Technologies, Fraunhofer Institute for Reliability and Microintegration, Berlin, Germany

    Stefan Fielder

  2. Department of Module Integration and Board Interconnection Technologies, Fraunhofer Institut Zuverlässigkeit und Mikrointegration (IZM), 13355, Berlin, Gustav-Meyer-Allee 25, Germany

    Michael Zwanzig, Ralf Schmidt & Wolfgang Scheel

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  1. Dept. Electrical &, Computer Engineering, Portland State University, Portland, Oregon, USA

    James E. Morris

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Fielder, S., Zwanzig, M., Schmidt, R., Scheel, W. (2008). Nanowires in Electronics Packaging. In: Morris, J. (eds) Nanopackaging. Springer, Boston, MA. https://doi.org/10.1007/978-0-387-47325-3_20

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