Fundamentals of Semiconductor Processing Technology

1. Front Matter

   Pages i-xiii

   PDF

2. Semiconductor Crystals

   • Badih El-Kareh

   Pages 1-38

3. Thermal Oxidation and Nitridation

   • Badih El-Kareh

   Pages 39-85

4. Thin Film Deposition

   • Badih El-Kareh

   Pages 87-167

5. Lithography

   • Badih El-Kareh

   Pages 169-260

6. Contamination Control and Etch

   • Badih El-Kareh

   Pages 261-351

7. Ion Implantation

   • Badih El-Kareh

   Pages 353-466

8. Diffusion

   • Badih El-Kareh

   Pages 467-525

9. Contact and Interconnect Technology

   • J. G. Ryan

   Pages 527-590

10. Back Matter

    Pages 591-602

    PDF

The drive toward new semiconductor technologies is intricately related to market demands for cheaper, smaller, faster, and more reliable circuits with lower power consumption. The development of new processing tools and technologies is aimed at optimizing one or more of these requirements. This goal can, however, only be achieved by a concerted effort between scientists, engineers, technicians, and operators in research, development, and manufac­ turing. It is therefore important that experts in specific disciplines, such as device and circuit design, understand the principle, capabil­ ities, and limitations of tools and processing technologies. It is also important that those working on specific unit processes, such as lithography or hot processes, be familiar with other unit processes used to manufacture the product. Several excellent books have been published on the subject of process technologies. These texts, however, cover subjects in too much detail, or do not cover topics important to modem tech­ nologies. This book is written with the need for a "bridge" between different disciplines in mind. It is intended to present to engineers and scientists those parts of modem processing technologies that are of greatest importance to the design and manufacture of semi­ conductor circuits. The material is presented with sufficient detail to understand and analyze interactions between processing and other semiconductor disciplines, such as design of devices and cir­ cuits, their electrical parameters, reliability, and yield.

• Wafer
• circuit
• development
• dielectrics
• interconnect
• manufacturing
• material
• materials science
• semiconductor
• thin films

• IBM Corporation, USA

  Badih El-Kareh

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