Skip to main content

2018 | OriginalPaper | Buchkapitel

8. Advanced Low-Noise Amplifier Optimization Topics

verfasst von : Mladen Božanić, Saurabh Sinha

Erschienen in: Millimeter-Wave Low Noise Amplifiers

Verlag: Springer International Publishing

Aktivieren Sie unsere intelligente Suche, um passende Fachinhalte oder Patente zu finden.

search-config
loading …

Abstract

This chapter deals with advanced LNA optimization topics. It opens with some general considerations that need to be understood and addressed early in the LNA design flow as a first step in reaching optimum LNA operation. The second part of the chapter deals with LNA optimization through improved packaging. Advanced fabrication technologies is discussed in the third part. Some attempts at minimizing the passive parasitic effects and increasing the Q-factors of passives that can be proposed for the millimeter-wave frequency are considered in the fourth part of the chapter.

Sie haben noch keine Lizenz? Dann Informieren Sie sich jetzt über unsere Produkte:

Springer Professional "Wirtschaft+Technik"

Online-Abonnement

Mit Springer Professional "Wirtschaft+Technik" erhalten Sie Zugriff auf:

  • über 102.000 Bücher
  • über 537 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Finance + Banking
  • Management + Führung
  • Marketing + Vertrieb
  • Maschinenbau + Werkstoffe
  • Versicherung + Risiko

Jetzt Wissensvorsprung sichern!

Springer Professional "Technik"

Online-Abonnement

Mit Springer Professional "Technik" erhalten Sie Zugriff auf:

  • über 67.000 Bücher
  • über 390 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Maschinenbau + Werkstoffe




 

Jetzt Wissensvorsprung sichern!

Springer Professional "Wirtschaft"

Online-Abonnement

Mit Springer Professional "Wirtschaft" erhalten Sie Zugriff auf:

  • über 67.000 Bücher
  • über 340 Zeitschriften

aus folgenden Fachgebieten:

  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Finance + Banking
  • Management + Führung
  • Marketing + Vertrieb
  • Versicherung + Risiko




Jetzt Wissensvorsprung sichern!

Literatur
1.
Zurück zum Zitat Božanić M, Sinha S (2016) Power Amplifiers for the S-, C-, X-and Ku-bands. Springer Nature, Cham Božanić M, Sinha S (2016) Power Amplifiers for the S-, C-, X-and Ku-bands. Springer Nature, Cham
2.
Zurück zum Zitat Chen J, Henrie M, Mar MF, Nizic M (2012) Mixed-signal methodology guide. Cadence Design Systems, San Jose Chen J, Henrie M, Mar MF, Nizic M (2012) Mixed-signal methodology guide. Cadence Design Systems, San Jose
3.
Zurück zum Zitat Tummala RR, Swaminathan M (2008) System-on-Package: miniaturization of the entire system, 1st edn. McGraw-Hill Professional, New York Tummala RR, Swaminathan M (2008) System-on-Package: miniaturization of the entire system, 1st edn. McGraw-Hill Professional, New York
4.
Zurück zum Zitat Feng G, Boon CC, Meng F, Yi X, Yang K, Li C, Luong HC (2017) Pole-converging intrastage bandwidth extension technique for wideband amplifiers. IEEE J Solid-State Circ 52(3):769–780CrossRef Feng G, Boon CC, Meng F, Yi X, Yang K, Li C, Luong HC (2017) Pole-converging intrastage bandwidth extension technique for wideband amplifiers. IEEE J Solid-State Circ 52(3):769–780CrossRef
5.
Zurück zum Zitat Hastings A (2006) The art of analog layout, 2nd edn. Prentice Hall, Upper Saddle River Hastings A (2006) The art of analog layout, 2nd edn. Prentice Hall, Upper Saddle River
6.
Zurück zum Zitat Tsai JH, Huang WL, Lin CY, Chang RA (2014) An X-band low-power CMOS low noise amplifier with transformer inter-stage matching networks. In: 44th European Microwave Conference (EuMC). Rome, pp 1468–1471 Tsai JH, Huang WL, Lin CY, Chang RA (2014) An X-band low-power CMOS low noise amplifier with transformer inter-stage matching networks. In: 44th European Microwave Conference (EuMC). Rome, pp 1468–1471
7.
Zurück zum Zitat Greig WJ (2007) Integrated circuit packaging, assembly and interconnections, 1st edn. Springer, New York Greig WJ (2007) Integrated circuit packaging, assembly and interconnections, 1st edn. Springer, New York
8.
Zurück zum Zitat Grebennikov A, Sokal NO, Franco MJ (2012) Switchmode RF and microwave power amplifiers, 2nd edn. Elsevier, Burlington Grebennikov A, Sokal NO, Franco MJ (2012) Switchmode RF and microwave power amplifiers, 2nd edn. Elsevier, Burlington
9.
Zurück zum Zitat Canning T, Tasker PJ, Cripps SC (2014) Continuous mode power amplifier design using harmonic clipping contours: theory and practice. IEEE Trans Microw Theory Tech 62(1):100–110CrossRef Canning T, Tasker PJ, Cripps SC (2014) Continuous mode power amplifier design using harmonic clipping contours: theory and practice. IEEE Trans Microw Theory Tech 62(1):100–110CrossRef
10.
Zurück zum Zitat Trabelsi H, Barraj (2015) A 3–5 GHz FSK-UWB transmitter for wireless personal healthcare applications. AEU-Int J Electron Commun 69(1):262–273 Trabelsi H, Barraj (2015) A 3–5 GHz FSK-UWB transmitter for wireless personal healthcare applications. AEU-Int J Electron Commun 69(1):262–273
11.
Zurück zum Zitat Ji L, Xu Z, Zhou J, Zhai J (2013) Highly efficient 10 W GaN Class F power amplifier using DPD. Microw J 56(10):120–130 Ji L, Xu Z, Zhou J, Zhai J (2013) Highly efficient 10 W GaN Class F power amplifier using DPD. Microw J 56(10):120–130
12.
Zurück zum Zitat Kawasaki T, Kubota M, Tsukashima K, Tokumitsu T, Hasegawa Y (2014) A full E-band low noise amplifier realized by using novel wafer-level chip size package technology suitable for reliable flip-chip reflow-soldering. In: 2014 IEEE MTT-S International Microwave Symposium (IMS). Tampa, pp 1–4 Kawasaki T, Kubota M, Tsukashima K, Tokumitsu T, Hasegawa Y (2014) A full E-band low noise amplifier realized by using novel wafer-level chip size package technology suitable for reliable flip-chip reflow-soldering. In: 2014 IEEE MTT-S International Microwave Symposium (IMS). Tampa, pp 1–4
13.
Zurück zum Zitat Robertson I, Somjit N, Chongcheawchamnan M (2016) Microwave and millimetre-wave design for wireless communications, 1st edn. Wiley, Chichester Robertson I, Somjit N, Chongcheawchamnan M (2016) Microwave and millimetre-wave design for wireless communications, 1st edn. Wiley, Chichester
14.
Zurück zum Zitat Han FY, Lu KC, Horng TS, Lin J, Cheng HH, Chiu CT, Hung CP (2009) Packaging effects on the figure of merit of a CMOS cascode low-noise amplifier: flip-chip versus wire-bond. In: IEEE MTT-S international microwave symposium digest. Boston, pp 601–604 Han FY, Lu KC, Horng TS, Lin J, Cheng HH, Chiu CT, Hung CP (2009) Packaging effects on the figure of merit of a CMOS cascode low-noise amplifier: flip-chip versus wire-bond. In: IEEE MTT-S international microwave symposium digest. Boston, pp 601–604
15.
Zurück zum Zitat Tummala RR, Swaminathan M (2008) System-on-Package: miniaturization of the entire system, 1st edn. McGraw-Hill Professional, New York Tummala RR, Swaminathan M (2008) System-on-Package: miniaturization of the entire system, 1st edn. McGraw-Hill Professional, New York
16.
Zurück zum Zitat Chao TY, Li CH, Chen YC, Cheng YT, Kuo CN (2010) An interconnecting technology for RF MEMS heterogeneous chip integration. IEEE Trans Electron Devices 57(4):928–938CrossRef Chao TY, Li CH, Chen YC, Cheng YT, Kuo CN (2010) An interconnecting technology for RF MEMS heterogeneous chip integration. IEEE Trans Electron Devices 57(4):928–938CrossRef
17.
Zurück zum Zitat Isapour A, Kouki AB (2017) Empty LTCC integrated waveguide with compact transitions for ultra-low loss millimeter-wave applications. IEEE Microw Wirel Compon Lett 27(2):144–146CrossRef Isapour A, Kouki AB (2017) Empty LTCC integrated waveguide with compact transitions for ultra-low loss millimeter-wave applications. IEEE Microw Wirel Compon Lett 27(2):144–146CrossRef
18.
Zurück zum Zitat Chen A, Lo HY (2012) Semiconductor packaging: materials interaction and reliability, 1st edn. CRC Press, Boca Ranton Chen A, Lo HY (2012) Semiconductor packaging: materials interaction and reliability, 1st edn. CRC Press, Boca Ranton
19.
Zurück zum Zitat Tong Z, Fischer A, Stelzer A, Maurer L (2013) Radiation performance enhancement of e-band antenna in package. IEEE Trans Compon Packag Manufact Technol 3(11):1953–1959 Tong Z, Fischer A, Stelzer A, Maurer L (2013) Radiation performance enhancement of e-band antenna in package. IEEE Trans Compon Packag Manufact Technol 3(11):1953–1959
20.
Zurück zum Zitat Seler E, Wojnowski M, Hartner W, Böck J, Lachner R, Weigel R, Hagelauer A (2014) 3D rectangular waveguide integrated in embedded wafer level ball grid array (eWLB) package. In: 64th IEEE Electronic Components and Technology Conference (ECTC). Orlando, pp 956–962 Seler E, Wojnowski M, Hartner W, Böck J, Lachner R, Weigel R, Hagelauer A (2014) 3D rectangular waveguide integrated in embedded wafer level ball grid array (eWLB) package. In: 64th IEEE Electronic Components and Technology Conference (ECTC). Orlando, pp 956–962
21.
Zurück zum Zitat Wojnowski M, Issakov V, Knoblinger G, Pressel K, Sommer G, Weigel R (2012) High-Q inductors embedded in the fan-out area of an eWLB. IEEE Trans Compon Packag Manuf Technol 2(8):1280–1292CrossRef Wojnowski M, Issakov V, Knoblinger G, Pressel K, Sommer G, Weigel R (2012) High-Q inductors embedded in the fan-out area of an eWLB. IEEE Trans Compon Packag Manuf Technol 2(8):1280–1292CrossRef
22.
Zurück zum Zitat Trong HB, Ryckaert J, Tőkei Z, Mercha A, Verkest D, Thean AVY, Wambacq P (2017) Statistical timing analysis considering device and interconnect variability for BEOL requirements in the 5-nm node and beyond. IEEE Trans Very Large Scale Integr VLSI Syst 25(5):1669–1680CrossRef Trong HB, Ryckaert J, Tőkei Z, Mercha A, Verkest D, Thean AVY, Wambacq P (2017) Statistical timing analysis considering device and interconnect variability for BEOL requirements in the 5-nm node and beyond. IEEE Trans Very Large Scale Integr VLSI Syst 25(5):1669–1680CrossRef
23.
Zurück zum Zitat Ventzek PLG, Rauf S, Sparks T (2007) Plasma Etch. In: Lavoie C, d’Heurle FM, Zhang SL (eds) Handbook of semiconductor manufacturing technology. Taylor & Francis, New York Ventzek PLG, Rauf S, Sparks T (2007) Plasma Etch. In: Lavoie C, d’Heurle FM, Zhang SL (eds) Handbook of semiconductor manufacturing technology. Taylor & Francis, New York
24.
Zurück zum Zitat Inac O, Cetinoneri B, Uzunkol M, Atesal YA, Rebeiz GM (2011) Millimeter-wave and THz circuits in 45-nm SOI CMOS. In: 2011 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS). Waikoloa, pp 1–4 Inac O, Cetinoneri B, Uzunkol M, Atesal YA, Rebeiz GM (2011) Millimeter-wave and THz circuits in 45-nm SOI CMOS. In: 2011 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS). Waikoloa, pp 1–4
25.
Zurück zum Zitat Inac O, Uzunkol M, Rebeiz GM (2014) 45-nm CMOS SOI technology characterization for millimeter-wave applications. IEEE Trans Microw Theory Tech 62(6):1301–1311CrossRef Inac O, Uzunkol M, Rebeiz GM (2014) 45-nm CMOS SOI technology characterization for millimeter-wave applications. IEEE Trans Microw Theory Tech 62(6):1301–1311CrossRef
26.
Zurück zum Zitat Cristoloveanu C, Celler GK (2007) SOI Materials and. In: Lavoie C, d’Heurle FM, Zhang SL (eds) Handbook of semiconductor manufacturing technology. Taylor & Francis, New York Cristoloveanu C, Celler GK (2007) SOI Materials and. In: Lavoie C, d’Heurle FM, Zhang SL (eds) Handbook of semiconductor manufacturing technology. Taylor & Francis, New York
27.
Zurück zum Zitat Gianesello F, Gloria D, Montusclat S, Raynaud C, Boret S, Dambrine G, Lepilliet S, Martineau B, Pilard R (2007) 1.8 dB insertion loss 200 GHz CPW band pass filter integrated in HR SOI CMOS technology. In: IEEE/MTT-S international microwave symposium. Honolulu, pp 453–456 Gianesello F, Gloria D, Montusclat S, Raynaud C, Boret S, Dambrine G, Lepilliet S, Martineau B, Pilard R (2007) 1.8 dB insertion loss 200 GHz CPW band pass filter integrated in HR SOI CMOS technology. In: IEEE/MTT-S international microwave symposium. Honolulu, pp 453–456
28.
Zurück zum Zitat Chaturvedi S, Božanić M, Sinha S (2016) Effect of lossy substrates on series impedance parameters of interconnects. In: IEEE International Semiconductor Conference (CAS). Sinaia, pp 55–58 Chaturvedi S, Božanić M, Sinha S (2016) Effect of lossy substrates on series impedance parameters of interconnects. In: IEEE International Semiconductor Conference (CAS). Sinaia, pp 55–58
29.
Zurück zum Zitat Tang XL, Franc AL, Pistono E, Siligaris A, Vincent P, Ferrari P, Fournier JM (2012) Performance improvement versus CPW and loss distribution analysis of slow-wave CPW in 65 nm HR-SOI CMOS technology. IEEE Trans Electron Devices 59(5):1279–1285CrossRef Tang XL, Franc AL, Pistono E, Siligaris A, Vincent P, Ferrari P, Fournier JM (2012) Performance improvement versus CPW and loss distribution analysis of slow-wave CPW in 65 nm HR-SOI CMOS technology. IEEE Trans Electron Devices 59(5):1279–1285CrossRef
30.
Zurück zum Zitat Karaca D, Varonen M, Parveg D, Vahdati A, Halonen KA (2017) A 53–117 GHz LNA in 28-nm FDSOI CMOS. IEEE Microw Wirel Compon Lett 27(2):171–173CrossRef Karaca D, Varonen M, Parveg D, Vahdati A, Halonen KA (2017) A 53–117 GHz LNA in 28-nm FDSOI CMOS. IEEE Microw Wirel Compon Lett 27(2):171–173CrossRef
31.
Zurück zum Zitat Li R, Jin C, Tang M, Chang KF, Ho SW, Chen Z, Zheng B (2014) Low loss suspended membrane on low resistivity silicon and its applications to millimetre-wave passive circuits. IEEE Trans Compon Packag Manuf Technol 4(7):237–1244 Li R, Jin C, Tang M, Chang KF, Ho SW, Chen Z, Zheng B (2014) Low loss suspended membrane on low resistivity silicon and its applications to millimetre-wave passive circuits. IEEE Trans Compon Packag Manuf Technol 4(7):237–1244
32.
Zurück zum Zitat Seilis A, Moghadas H, Moez K, Daneshmand M (2015) Integrated magnetic nanoinductors. IEEE Trans Compon Packag Manuf Technol 5(5):675–684CrossRef Seilis A, Moghadas H, Moez K, Daneshmand M (2015) Integrated magnetic nanoinductors. IEEE Trans Compon Packag Manuf Technol 5(5):675–684CrossRef
33.
Zurück zum Zitat Böck J, Aufinger K, Boguth S, Dahl C, Knapp H, Liebl W, Manger D, Meister TF, Pribil A, Wursthorn J et al (2015) SiGe HBT and BiCMOS process integration optimization within the DOTSEVEN project. In: IEEE Bipolar/BiCMOS Circuits and Technology Meeting (BCTM). Boston, pp 121–124 Böck J, Aufinger K, Boguth S, Dahl C, Knapp H, Liebl W, Manger D, Meister TF, Pribil A, Wursthorn J et al (2015) SiGe HBT and BiCMOS process integration optimization within the DOTSEVEN project. In: IEEE Bipolar/BiCMOS Circuits and Technology Meeting (BCTM). Boston, pp 121–124
34.
Zurück zum Zitat Franc AL, Pistono E, Gloria D, Ferrari P (2012) High-performance shielded coplanar waveguides for the design of CMOS 60-GHz bandpass filters. IEEE Trans Electron Devices 59(5):1219–1226CrossRef Franc AL, Pistono E, Gloria D, Ferrari P (2012) High-performance shielded coplanar waveguides for the design of CMOS 60-GHz bandpass filters. IEEE Trans Electron Devices 59(5):1219–1226CrossRef
35.
Zurück zum Zitat Sarafis P, Nassiopoulou AG, Issa H, Ferrari P (2016) High-performance on-chip low-pass filters using CPW and slow-wave-CPW transmission lines on porous silicon. IEEE Trans Electron Devices 63(1):439–445CrossRef Sarafis P, Nassiopoulou AG, Issa H, Ferrari P (2016) High-performance on-chip low-pass filters using CPW and slow-wave-CPW transmission lines on porous silicon. IEEE Trans Electron Devices 63(1):439–445CrossRef
36.
Zurück zum Zitat Tang XL, Pistono E, Ferrari P, Fournier JM (2016) A millimeter-wave CMOS power amplifier design using high-Q slow-wave transmission lines. Int J RF Microw Comput Aided Eng 26(2):99–109CrossRef Tang XL, Pistono E, Ferrari P, Fournier JM (2016) A millimeter-wave CMOS power amplifier design using high-Q slow-wave transmission lines. Int J RF Microw Comput Aided Eng 26(2):99–109CrossRef
37.
Zurück zum Zitat Sayag A, Levin S, Regev D, Zfira D, Shapira S, Goren D, Ritter D (2008) A 25 GHz 3.3 dB NF low noise amplifier based upon slow wave transmission lines and the 0.18 μm CMOS technology. In: IEEE radio frequency integrated circuits symposium. Atlanta, pp 373–376 Sayag A, Levin S, Regev D, Zfira D, Shapira S, Goren D, Ritter D (2008) A 25 GHz 3.3 dB NF low noise amplifier based upon slow wave transmission lines and the 0.18 μm CMOS technology. In: IEEE radio frequency integrated circuits symposium. Atlanta, pp 373–376
38.
Zurück zum Zitat Franc AL, Pistono E, Meunier G, Gloria D, Ferrari P (2013) A lossy circuit model based on physical interpretation for integrated shielded slow-wave CMOS coplanar waveguide structures. IEEE Trans Microw Theor Tech 61(2):754–763CrossRef Franc AL, Pistono E, Meunier G, Gloria D, Ferrari P (2013) A lossy circuit model based on physical interpretation for integrated shielded slow-wave CMOS coplanar waveguide structures. IEEE Trans Microw Theor Tech 61(2):754–763CrossRef
39.
Zurück zum Zitat Bautista A, Franc AL, Ferrari P (2015) Accurate parametric electrical model for slow-wave CPW and application to circuits design. IEEE Trans Microw Theor Tech 63(12):4225–4235CrossRef Bautista A, Franc AL, Ferrari P (2015) Accurate parametric electrical model for slow-wave CPW and application to circuits design. IEEE Trans Microw Theor Tech 63(12):4225–4235CrossRef
40.
Zurück zum Zitat Park JD, Niknejad AM (2013) A Wideband 100 GHz low noise amplifier with slow-wave CPW in 65 nm LP CMOS. Microw Opt Technol Lett 55(8):1954–1957CrossRef Park JD, Niknejad AM (2013) A Wideband 100 GHz low noise amplifier with slow-wave CPW in 65 nm LP CMOS. Microw Opt Technol Lett 55(8):1954–1957CrossRef
41.
Zurück zum Zitat Arigong B, Ren H, Ding J, Chung HJ, Jung S, Kim H, Zhang H (2017) An ultra-slow-wave transmission line on CMOS technology. Microw Opt Technol Lett 59(3):604–606CrossRef Arigong B, Ren H, Ding J, Chung HJ, Jung S, Kim H, Zhang H (2017) An ultra-slow-wave transmission line on CMOS technology. Microw Opt Technol Lett 59(3):604–606CrossRef
42.
Zurück zum Zitat Mahani MS, Roberts GW (2017) A mmWave folded substrate integrated waveguide in a 130-nm CMOS process. IEEE Trans Microw Theor Tech TBD(TBD) 1–14 Mahani MS, Roberts GW (2017) A mmWave folded substrate integrated waveguide in a 130-nm CMOS process. IEEE Trans Microw Theor Tech TBD(TBD) 1–14
43.
Zurück zum Zitat Meng F, Ma K, Yeo KS, Xu S, Boon CC, Lim WM (2014) A 60-GHz 26.3-dB gain 5.3-dB NF low-noise amplifier in 65-nm CMOS using Q-factor enhanced inductors. In: XXXIth URSI general assembly and scientific symposium. Beijing, pp 1–4 Meng F, Ma K, Yeo KS, Xu S, Boon CC, Lim WM (2014) A 60-GHz 26.3-dB gain 5.3-dB NF low-noise amplifier in 65-nm CMOS using Q-factor enhanced inductors. In: XXXIth URSI general assembly and scientific symposium. Beijing, pp 1–4
44.
Zurück zum Zitat Gao Z, Kang K, Jiang Z, Wu Y, Zhao C, Ban YL, Sun L, Xue Q, Yin WY (2015) Analysis and equivalent-circuit model for CMOS on-chip multiple coupled inductors in the millimeter-wave region. IEEE Trans Electron Devices 62(12):3957–3964CrossRef Gao Z, Kang K, Jiang Z, Wu Y, Zhao C, Ban YL, Sun L, Xue Q, Yin WY (2015) Analysis and equivalent-circuit model for CMOS on-chip multiple coupled inductors in the millimeter-wave region. IEEE Trans Electron Devices 62(12):3957–3964CrossRef
45.
Zurück zum Zitat Govind V, Dalmia S, Swaminathan M (2004) esign of integrated low noise amplifiers (LNA) using embedded passives in organic substrates. IEEE Trans Adv Packag 27(1):79–89CrossRef Govind V, Dalmia S, Swaminathan M (2004) esign of integrated low noise amplifiers (LNA) using embedded passives in organic substrates. IEEE Trans Adv Packag 27(1):79–89CrossRef
46.
Zurück zum Zitat Zhang J, Goussetis G, Richard L, Huang G, Fusco V, Dielacher F (2014) Low noise amplifier with integrated balanced antenna for 60 GHz wireless communications. IEEE Trans Antennas Propag 62(6):3407–3411CrossRef Zhang J, Goussetis G, Richard L, Huang G, Fusco V, Dielacher F (2014) Low noise amplifier with integrated balanced antenna for 60 GHz wireless communications. IEEE Trans Antennas Propag 62(6):3407–3411CrossRef
47.
Zurück zum Zitat Rappaport TS, Murdock JN, Gutierrez F (2011) State of the art in 60-GHz integrated circuits and systems for wireless communications. Proc IEEE 99(8):1390–1436CrossRef Rappaport TS, Murdock JN, Gutierrez F (2011) State of the art in 60-GHz integrated circuits and systems for wireless communications. Proc IEEE 99(8):1390–1436CrossRef
48.
Zurück zum Zitat Pelliccia L, Cacciamani F, Farinelli P, Sorrentino R (2015) High-tunable waveguide filters using ohmic RF MEMS switches. IEEE Trans Microw Theor Tech 63(10):3381–3390CrossRef Pelliccia L, Cacciamani F, Farinelli P, Sorrentino R (2015) High-tunable waveguide filters using ohmic RF MEMS switches. IEEE Trans Microw Theor Tech 63(10):3381–3390CrossRef
49.
Zurück zum Zitat Ebrahimi N, Wu PY, Bagheri M, Buckwalter JF (2017) A 71–86-GHz Phased Array Transceiver Using Wideband Injection-Locked Oscillator Phase Shifters. IEEE Trans Microw Theor Tech 65(2):346–361CrossRef Ebrahimi N, Wu PY, Bagheri M, Buckwalter JF (2017) A 71–86-GHz Phased Array Transceiver Using Wideband Injection-Locked Oscillator Phase Shifters. IEEE Trans Microw Theor Tech 65(2):346–361CrossRef
50.
Zurück zum Zitat Chaturvedi S, Božanić M, Vasilache D, Sinha S, Giangu I, Stefanescu A (2017) Cantilever for RF applications: model and technology. In: IEEE International Semiconductor Conference (CAS). Sinaia, pp 1–4 Chaturvedi S, Božanić M, Vasilache D, Sinha S, Giangu I, Stefanescu A (2017) Cantilever for RF applications: model and technology. In: IEEE International Semiconductor Conference (CAS). Sinaia, pp 1–4
Metadaten
Titel
Advanced Low-Noise Amplifier Optimization Topics
verfasst von
Mladen Božanić
Saurabh Sinha
Copyright-Jahr
2018
DOI
https://doi.org/10.1007/978-3-319-69020-9_8

Neuer Inhalt