Summary
Pt/Ti metallisation bilayers are used as bottom electrodes for ferroelectric thin films. During deposition of the ferroelectric films, these electrodes are exposed to elevated temperatures causing modifications of the Pt/Ti bottom electrode. Diffusion and oxidation of the Ti adhesion layer have been studied by the application of factor analysis to AES depth profile data and by RBS. Factor analysis was employed to extract the chemical information from the measured AES spectra and to derive semiquantitative depth profiles of the identified material compounds. RBS was used to obtain the quantitative depth distribution of the elements. By the combination of both methods, diffusion and oxidation processes were observed and could be precisely described.
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Scheithauer, U., Hösler, W. & Bruchhaus, R. Combined AES/factor analysis and RBS investigation of a thermally treated Pt/Ti metallisation on SiO2 . Fresenius J Anal Chem 346, 305–307 (1993). https://doi.org/10.1007/BF00321438
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DOI: https://doi.org/10.1007/BF00321438