Abstract
The phases formed at the interfaces of nickel and Ag-Cu alloys were determined by studying the reaction diffusion couples together with the isothermal sections of the Ag-Cu-Ni system at the annealing temperatures. Phase equilibria at 860, 795 and 700 °C, were determined by both experimental investigation and model calculation. The reaction diffusion couples were prepared with either the Ag-15 wt% Cu alloy with nickel foil, or Ag-28 wt% Cu alloy with nickel foil, and were annealed at the three above-mentioned temperatures. The interfaces of the reaction layers in the couples were non-planar. By using microscopes and EPMA, the phase sequences formed in the reaction diffusion couples were determined. These diffusion paths were in agreement with the phase equilibria study, and it demonstrated that the tie triangle shifted towards the nickel side as temperature increased. The thickness of the reacted layers was determined by using an image analyser, and a parabolic growth was found for the Ni/Ag-28 wt% Cu couple annealed at 795 °C.
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References
D. P. Seraphim, R. C. Lasky and C.-Y. Li, “Principles of Electronic Packaging” (McGraw-Hill, New York, 1989).
Y. Hamano and M. Terasawa, in “Materials Research Society Symposia Proceedings”, Vol. 72, “Electronic Packaging Materials Science II”, edited by K. A. Jackson, R. C. Pohanka, D. R. Uhlmann and D. R. Ulrich (MRS, Pittsburgh, PA, 1986) pp. 3–12.
D. A. Weirauch Jr, Weld. Res. Suppl. (1994) 110s.
S. C. Dev, P. Basak, I. Singh, R. K. Dubey and O. N. Mohanty, J. Mater. Sci. 27 (1992) 6646.
S.-W. Chen, Mater. Chem. Phys. 33 (1993) 271.
C. Wagner, J. Electrochem. Soc. 103 (1956) 571.
J. E. Lane and J. S. Kirkaldy, Can. J. Phys. 42 (1964) 1643.
M. M. P. Janssen and G. D. Rieck, Trans. TMS-AIME 239 (1967) 1372.
R. A. Rapp, A. Fzis and G. J. Yurek, Metall. Trans. 4 (1973) 1283.
F. J. J. Van Loo, J. A. Van Beek, G. F. Bastin and R. Metselaar, in “Diffusion in solids: Recent developments”, edited by M. A. Dayanada and G. E. Murch (TMS, Warrendale, PA, 1984) pp. 231–59.
J.-C. Lin, K. J. Schulz, K.-C. Hsieh and Y. A. Chang, J. Electrochem. Soc. 136 (1989) 3006.
C. R. Kao and Y. A. Chang, Acta. Metall. Mater. 41 (1993) 3463.
A. G. Ward and J. W. Taylor, J. Metals 85 (1956) 145.
J. M. Lommel and B. Chalmers, Trans. TMS-AIME 215 (1959) 499.
S. K. Kang and V. Ramachandran, Scripta Metall. 14 (1980) 421.
H. Nakagawa, C. H. Lee and T. H. North, Metall. Trans. 22A (1991) 543.
Y. Wang, H. K. Kim, H. K. Liou and K. N. Tu, Scripta Metall. Mater. (1995) accepted.
C.-L. Tsao and S.-W. Chen, J. Mater. Sci. 30 (1995) 5215.
P. De Cesaris, Gazz. Chim. Ital. 43 (1913) 365.
W. Guertler and A. Bergmann, Z. Metallkde 25 (1933) 53.
T. A. Siewert and R. W. Heine, Metall. Trans. 8A (1977) 515.
J. L. Murray, Metall. Trans. 15A (1984) 261.
D. J. Chakrabarti, D. E. Laughlin, S.-W. Chen, and Y. A. Chang, in “Binary Alloy Phase Diagrams”, 2nd Edn, Vol. 2, edited by T. B. Massalski, H. Okamoto, P. R. Subramanian, and Kacprzak (ASM, Materials Park, OH 1990) pp. 1442.
M. Singleton and P. Nash, Bull. Alloy Phase Diag. 8 (1987) 119.
D. A. Stevenson and J. Wulff, Trans. Metall. AIME 221 (1961) 271.
S. I. Popel and V. N. Kozhurkov, Izv. Akad. Nauk. SSSR Metal 2 (1974) 49.
P. R. Subramanian and J. H. Perepezko, J. Phase Equilib. 14 (1993) 62.
R. Hultgren, P. D. Desai, D. T. Hawkins, M. Gleiser, K. K. Kelley and D. D. Wagman, “Selected Values of the Thermodynamic Properties of the Elements” (ASM, Metals Park, OH, 1973).
Y. A. Chang, D. Goldberg and J. P. Neumann, J. Phys. Chem. Ref. Data 6 (1977) 621.
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Luo, HT., Chen, SW. Phase equilibria of the ternary Ag-Cu-Ni system and the interfacial reactions in the Ag-Cu/Ni couples. JOURNAL OF MATERIALS SCIENCE 31, 5059–5067 (1996). https://doi.org/10.1007/BF00355906
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DOI: https://doi.org/10.1007/BF00355906