Abstract
Multilayer Cu/Ni/Cu interlayers that form a thin layer of a Cu-rich transient liquid phase have been used to join alumina to alumina at 1150 °C. The method and bonding conditions yield an assembly bonded by a Ni-rich (>94 at% Ni) interlayer at a temperature substantially lower than those normally required for solid-state diffusion bonding with pure Ni interlayers. Flexure strengths of as-bonded beams ranged from 61 to 267 MPa with an average of 160 MPa and a standard deviation of ±63 MPa. The highest flexure strengths were observed in samples where failure occurred in the ceramic. Post-bonding anneals of 10 h duration in air and gettered-argon at 1000 °C decreased the average room temperature strength to 138 and 74 MPa, respectively. In as-processed and annealed samples, varying degrees of interfacial spinel formation are indicated. Spinel formation may contribute to the scatter in as-processed samples, and the decrease in strength values resulting from annealing.
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Shalz, M.L., Dalgleish, B.J., Tomsia, A.P. et al. Ceramic joining II partial transient liquid-phase bonding of alumina via Cu/Ni/Cu multilayer interlayers. JOURNAL OF MATERIALS SCIENCE 29, 3200–3208 (1994). https://doi.org/10.1007/BF00356663
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DOI: https://doi.org/10.1007/BF00356663