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On the mechanism of electroless plating. II. One mechanism for different reductants

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Abstract

A mechanism is proposed for the reactions in electroless plating solutions with different reducing agents. The mechanism is based on the formation of atomic hydrogen during the oxidation of the reducing agents. The hydrogen atoms can either be oxidized or be desorbed as a gas. The mechanism accounts for both the electrochemical and the catalytic nature of the process.

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  1. Philips Research Laboratories, Eindhoven, The Netherlands

    J. E. A. M. Van Den Meerakker

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  1. J. E. A. M. Van Den Meerakker
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Van Den Meerakker, J.E.A.M. On the mechanism of electroless plating. II. One mechanism for different reductants. J Appl Electrochem 11, 395–400 (1981). https://doi.org/10.1007/BF00613960

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