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Encapsulated micro mechanical sensors

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Abstract

Encapsulated micro mechanical sensors were fabricated using glass-silicon anodic bonding and an electrical feedthrough structure. Two parallel plates which can be used not only for capacitive sensors but also electrostatic actuators are adopted for integrated sensors as capacitive pressure sensors, accelerometers and resonating sensors. Micromachining technologies were developed for these packaged micro sensors. These include silicon etching technologies as laser assisted etching, deep RIE and in-process thickness monitoring during wet etching. Anodic bonding technologies which enable to incorporate a circuit inside the package and to keep a sealed cavity at a high vacuum are also developed.

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References

  1. Esashi, M.: (1990) Sensor Packaging; In: Reichl. H. “ed.” (Micro System Technologies 90), pp. 495–502, Springer-Verlag, Berlin

    Google Scholar 

  2. Esashi, M.;Matsumoto, Y.;Shoji, S.: (1990) Absolute pressure sensors by air-tight electrical feedthrough structure, Sensors and Actuators, A21-A23: 1048–1052

    Google Scholar 

  3. Matsumoto, Y.; Shoji, S.; Esashi, M.: (1990) A miniature integrated capacitive pressure sensor, Tech. Digest of the 9th Sensor Sympt., 43–46

  4. Henmi, H.; Yoshimi, K.; Shoji, S.; Esashi, M.: (1993) Vacuum packaging for micro sensors by glass-silicon anodic bonding, Transducer'93, 584–587

  5. Esashi, M.: (1994) Sensor for measuring acceleration; In: de Rooij, N. “eds.” (Mechanical Sensors (Sensors Vol. 7)), pp. 331–358, VCH Pub., Weinheim

    Google Scholar 

  6. Matsumoto, Y.;Esashi, M.: (1993) Integrated silicon capacitive accelerometer with PLL servo technique, Sensors and Actuators, A39, 209–217

    Google Scholar 

  7. Shirai, T.;Ura, N.;Esashi, M.: (1992) Two-wire silicon capacitive accelerometer, Trans of The IEICE Japan, J75-C-II, 554–562

    Google Scholar 

  8. Jono, K.; Hashimoto, M.; Esashi, M.: (1994) Electrostatic servo system for multi-axis accelerometers, Proc. IEEE MEMS'94, 251–256

  9. Mineta, T.; Yoshida, M.; Nomura, T.; Esashi, M.: (1993) Capacitive accelerometers without fracture risk during fabrication processes, Transducer's93, 814–817

  10. Yoshimi, K.; Minami, K.; Wakabayashi, Y.; Esashi, M.: (1992) Packaging of resonant sensors, Tech. Digest of the 11th Sensor Sympo., 35–38

  11. Cabuz, C.; Shoji, S.; Cabuz, E.; Minami, K.; Esashi, M.: (1993) Highly sensitive resonant infrared sensor, Transducer'93, 694–697

  12. Cabuz, C.; Fukatsu, K.; Hashimoto, H.; Shoji, S.; Kurabayashi, T.; Minami, K.; Esashi, M.: (1994) Fine frequency tuning in resonant sensors, Proc. IEEE MEMS'94 245–250

  13. Hashimoto, M.; Cabuz, C.; Minami, K.; Esashi, M. (1994) Silicon resonant angular rate sensor using electromagnetic exitation and capacitive detection, Tech. Digest of the 12th Sensor Sympo., 163–166

  14. Esashi, M.; Ura, N.; Matsumoto, Y.: (1992) Anodic bonding for integrated capacitive sensors, Proc. of IEEE MEMS'92, 43–48

  15. Shoji, S.; Esasi, M.: (1990) Photoetching and electrochemical discharge drilling of Pyrex glass, Tech. Digest of the 9th Sensor Sympo., 27–30

  16. Shirai, T.;Esashi, M.: (1992) Circuit damage by anodic bonding, JIEE Technical Meeting, ST-92-7, 9–17

    Google Scholar 

  17. Ura, N.;Nakaichi, K.;Minami, K.;Esashi, M.: (1992) Vacuum sealing by anodic bonding, The 11th Sensor Sympo., Late News, L1-1, 63

    Google Scholar 

  18. Shoji, Y.;Suzuki, K.;Shoji, S.;Esashi, M.: (1994) Reduced distortion anodic bonding, Micromachining Technical Report, The Japan Soc. of Next Generation Sensor Technology, MP-93-43, 53–66

    Google Scholar 

  19. Minami, K.; Wakabayashi, Y.; Matsubara, T.; Yoshimi, K.; Yoshida, M.; Esashi, M.: (1993) YAG laser assisted etching for releasing silicon micro structure”, Proc. IEEE MEMS'93, 53–58

  20. Minami, K.; Tosaka, Y.; Esashi, M.: (1994) Optical in-situ monitoring of silicon diaphragm thicknes during wet etching, Proc. IEEE MEMS'94, 217–222

  21. Takinami, M.; Minami, K.; Esashi, M.: (1992) High-speed directional low-temperature dry etching for bulk silicon micromachining, Tech. Digest of the 11th Sensor Sympo., 15–18

  22. Esashi, M.: (1991) Micro flow sensor and integrated magnetic oxygen sensor using it, Transducers'91, 34–37

  23. Asada, N.; Matsuki, H.; Esashi, M.: (1994) Silicon micromachined two-dimensional galvano optical scanner, The 6th Joint MMM-Intermag Conf., AR-17

  24. Matsubara, T.; Yamaguchi, M.; Minami, K.; Esashi, M.: (1993) Stepping electrostatic microactuator, Transducers'93, 50–53

  25. Esashi, M.; Matsumoto, Y.: (1990) Common two lead wires sensing system, Transducer'91, 330–333

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Authors and Affiliations

  1. Faculty of Engineering, Tohoku University, Aza-Aoba Aramaki Aoba-ku, 980, Sendai, Japan

    Masayoshi Esashi

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  1. Masayoshi Esashi
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This work has been supported by the Japanese Ministry of Education Science and Culture under a Grand-in Aid No. 03102001

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Esashi, M. Encapsulated micro mechanical sensors. Microsystem Technologies 1, 2–9 (1994). https://doi.org/10.1007/BF01367754

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  • DOI: https://doi.org/10.1007/BF01367754

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