Abstract
The bonding achieved by vacuum hot-pressing cylinders of copper, nickel and a few of their alloys against diamond plaques has been measured. Alloying with carbide-forming elements such as titanium can have a markedly beneficial effect on the bonding of copper and, to a lesser extent, of nickel. The strengths obtained also depended on the fabrication time and temperature, at first increasing and then decreasing with time. These phenomena are compared to those observed previously in a study of bonding between diamonds and molten copper alloys. Some evidence is presented that relates the phenomena to the abrasiveness of diamond grit compacts.
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Dewar, B., Nicholas, M. & Scott, P.M. The solid phase bonding of copper, nickel and some of their alloys to diamonds. J Mater Sci 11, 1083–1090 (1976). https://doi.org/10.1007/BF02396642
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DOI: https://doi.org/10.1007/BF02396642